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Refer to https://shopwiki.trenz-electronic.de/dedisplay/Download/?path=Trenz_Electronic/TE0712PD/TE0712+TRM for downloadableonline version of this manual and the rest of available documentation.

 

Trenz Electronic TE0712 is an industrial-grade FPGA module integrating a Xilinx Artix-7 FPGA, a 10/100 Mbit Ethernet transceiver, 1 GByte of DDR3 SDRAM, 32 MByte Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. All this on a tiny footprint, smaller than a credit card size at very competitive price. All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.

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Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

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Main Components

  

  1. Programmable oscillator @25 MHz, SiTime SiT8008, U9

  2. Programmable quad clock generator, Silicon Labs Si5338, U2

  3. 10/100 Mbps Ethernet PHY transceiver, Texas Instruments TLK106, U5

  4. Xilinx Artix-7 FPGA XC7A series, U1

  5. 32 MByte QSPI Flash memory, Cypress S25FL256S, U4

  6. 4 Gbit DDR3 SDRAM, Intelligent Memory IM4G16D3EABG, U15

  7. System Controller CPLD, Lattice Semiconductor MachXO2-256HC, U3

  8. 4 Gbit DDR3 SDRAM, Intelligent Memory IM4G16D3EABG, U19

  9. Serial EEPROM, Microchip 11AA02E48, U7

  10. Samtec Razor Beam™ LSHM-150 B2B connector, JM2
  11. Samtec Razor Beam™ LSHM-150 B2B connector, JM1
  12. Samtec Razor Beam™ LSHM-150 B2B connector, JM3
  13. 12A Enpirion EN63A0QI PowerSoC DC-DC converter, U14
  14. Green LED (SYSLED1), D1
  15. Red LED (SYSLED2), D2

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FPGA bank number and number of I/O signals connected to the B2B connector:

FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
13JM110VCCIO13Supplied by the baseboard.
13JM320VCCIO13Supplied by the baseboard.
14JM183.3V 
14JM2183.3V 
14JM343.3V 
15JM248VCCIO15Supplied by the baseboard.
15JM22VCCIO15Supplied by the baseboard.
16JM148VCCIO16Supplied by the baseboard.

Please refer to the Pin-out  tables page for additional information. 

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JTAGENJTAG Access To
LowArtix-7 FPGA
HighSystem Controller CPLD

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System Controller I/O Pins

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Pin usages depends on CPLD Firmware, see: TE0712 CPLD

On-board LEDs

The TE0712 module has 2 LEDs which are connected to the System Controller CPLD. Once FPGA configuration has completed these can be used by the user's design. 

LEDColorSC SignalSC PinNotes
D1GreenSYSLED19Exact function depends on System Controller CPLD firmware.
D2RedSYSLED28Exact function depends on System Controller CPLD firmware.

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Clocking

Si5338 programmable clock generator is used to generate different clocks with 25 MHz oscillator connected to pin IN3. The Si5338 can alternatively be clocked using pins IN1 and IN2 which are connected to B2B connector JM3 (CLKIN2).

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 CLK Output
FPGA Bank
FPGA Pin
IO Standard
Net Name
Default FrequencyNotes
CLK0*34K4/J4DIFF_SSTL15CLK0_P/N--NB! Since PCB REV02.
CLK1A-- CLK50M50 MHz

PHY chip RMII reference clock.

CLK1B*34R4 CLK50M2--NB! Since PCB REV02.
CLK2216F6/E6AutoMGT_CLK0_P/N125 MHzGTP transceiver clock.
CLK335H4/G4DIFF_SSTL15PLL_CLK_P/N50 MHz

 

* See notes.

Board Connector Clock Inputs

Certain B2B connector pins are connected to the FPGA pins which are capable of handling clocking signals from the user’s PCB (baseboard). See schematics B2B page for additional information.

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See Xilinx datasheet DS181 - "Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics" for additional information. User should also check related baseboard documentation when choosing baseboard design for TE0712 module.

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Power Rails

Power Rail Name

B2B Connector JM1 Pin

B2B Connector JM2 Pin

Direction

Notes

VIN

1, 3, 52, 4, 6, 8InputSoM supply voltage (from the baseboard).
3.3VIN13, 15-InputSoM supply voltage (from the baseboard).
1.5V-19OutputModule internal 1.5V level.

1.8V

39-Output

Module internal 1.8V level. Maximum 300mA available.

3.3V1410, 12OutputModule internal 3.3V level.
VCCIO13-1, 3Input

High-Range bank supply voltage (from the baseboard).

VCCIO15-7, 9InputHigh-Range bank supply voltage (from the baseboard).
VCCIO169, 11-InputHigh-Range bank supply voltage (from the baseboard).
VREF_JTAG-91OutputJTAG reference voltage (3.3V).

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Include Page
IN:Samtec LSHM
IN:Samtec LSHM

Technical Specifications

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Variants Currently In Production

Module Variant

FPGA

Junction Temperature

Temperature RangeB2B Connector Height
TE0712-02-35-2IXC7A35T-2FGG484I-40°C to 85°CIndustrial grade4.0 mm
TE0712-02-100-1IXC7A100T-1FGG484I-40°C to 85°CIndustrial grade4.0 mm
TE0712-02-200-1IXC7A200T-1FBG484I-40°C to 85°CIndustrial grade4.0 mm
TE0712-02-200-2IXC7A200T-2FBG484I-40°C to 85°CIndustrial grade4.0 mm
TE0712-02-200-1I3XC7A200T-1FBG484I-40°C to 85°CIndustrial grade2.5 mm
TE0712-02-100-2CXC7A100T-2FGG484C0°C to 85°CCommercial grade4.0 mm
TE0712-02-100-2C3XC7A100T-2FGG484C0°C to 85°CCommercial grade2.5 mm
TE0712-02-200-2CXC7A200T-2FBG484C0°C to 85°CCommercial grade4.0 mm
TE0712-02-200-2C3XC7A200T-2FBG484C0°C to 85°CCommercial grade2.5 mm

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

-0.36.5

V

EP53F8QI datasheet.
3.3VIN supply voltage-0.36.0VTPS748 datasheet.
HR I/O banks supply voltage (VCCO)-0.53.6VXilinx datasheet DS181
HR I/O banks input voltage-0.4 VCCO + 0.55VXilinx datasheet DS181
GTP transceivers Tx/Rx input voltage-0.51.26VXilinx datasheet DS181

Storage temperature

-55

100

°C

See IM4G16D3EABG datasheet.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
VIN supply voltage
-0
2.
3
4
6
5.5V
EP53F8QI datasheet
EP53F8QI datasheet.
3.3VIN supply voltage
-0
2.
3
9
6
5.
0
5VTPS748 datasheet.

Storage temperature (ambient)

-55

100

°C

See IM4G16D3EABG datasheet.

Recommended Operating Conditions

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HR I/O banks supply voltage (VCCO)1.143.465VXilinx datasheet DS181
HR I/O banks input voltage-0.20VCCO + 0.2VXilinx datasheet DS181

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options

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.

Note
Assembly variants for higher storage temperature range are available on request.

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Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.
  • Mating height with standard connectors: 8mm
  • PCB thickness: 1.6mm
  • Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

All dimensions are shown in millimeters.

 Image Removed   Image Removed

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

  • on PCB: approx. 2.5mm. Please download the step model for exact numbers.

All dimensions are shown in millimeters.

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Weight

16 - 27 g,  Plain module (depends on variant).

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Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
2016-12-0902Second production revisionClick to see PCNTE0712-02
2013-12-02

01

First production revision

 TE0712-01

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.


Document Change History

Date

Revision

Contributors

Description

2017-05-29
Jan Kumann

Variants table added.

Key Features section relocated.

2017-03-01

V3.2

John HartfielBUGFIX in the description of System Controller I/O section
2017-03-01v3.1John HartfielUpdate Clocking Section
2017-01-26
V3
Jan Kumann

New block diagram.

Few corrections.

2017-01-20
V2

 

Jan Kumann

Revised version.
2013-12-02 V0.1Antti LukatsWork in progress.

Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices