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changes.mady.by.user Antti Lukats

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changes.mady.by.user Thorsten Trenz

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PCN-201406xx

Title

TE0720-01 to TE0720-02

Subject

Trenz Electronic TE0720 SoM (system on module): revision 1 to revision 2 upgrade

Change Level

major

Issuer

Trenz Electronic GmbH

Place

Bünde, Germany, EU

Products Affected

This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.

affected productsuggested upgrade
TE0720-01-1CF*TE0720-02-1CF
TE0720-01-1CF1TE0720-02-1CF
TE0720-01-1CRTE0720-02-1CR
TE0720-01-2EFTE0720-02-2EF
TE0720-01-2ERcontact us
TE0720-01-2IFTE0720-02-2IF
TE0720-01-2IFC1TE0720-02-2IF
TE0720-01-2IFC2TE0720-02-2IF

Description of Change

*

Changes

DescriptionJTAG only boot mode is now supported
TypeEnhancement
ReasonEnhancement of functionality
ImpactNone

 

 

  • enhancement: JTAG only boot mode is now supported.
    • enhancement:
    Description
    Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256
    TypeEnhancement
    ReasonSpansion S25FL256 is supported by current Xilinx design tools (ISE14.
    replacement:
    7, Vivado) W25Q256 is only supported by u-boot, linux and Vivado SDK Programmer.
    ImpactMay have to re-evaluate applications that write to the SPI Flash
    DescriptionTexas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with
    TPS51206.
    TPS51206 
    TypeBOM change
    : changed
    ReasonTPS51206 was changed due to BOM optimization
    ImpactNone
    DescriptionChanged MDIO pullup from 10k to
    4k7.
    4k7 
    Type
    change: changed
    BOM change
    ReasonAvoiding potential problems when PHY management bus is configured at high speeds
    ImpactNone
    DescriptionChanged eMMC core supply from switched 3.3Vout to 3.3Vin.
    Type
    change:
    Schematic change
    ReasoneMMC startup timing improvement
    ImpactNone
    DescriptionMAC EEPROM power changed from 3.3V to 1.8V
    , no impact on user design.
    Type

    Schematic change

    ReasonPCB and System Controller optimization
    ImpactNone
    DescriptionI2C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus.
    removal: ST
     
    TypeSchematic change
    ReasonChange to new type of MEMS with only one I2C
    Impact None (if the old GPIO based I2C mux was used it just has no effect now)
    Description ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled in standard assembly variants.
  • removal: removed test pads on top layer.
  • enhancement: increased component clearance from mounting holes on bottom layer.
  • enhancement: System Controller in-system programming via B2B JTAG pins.
  • JM1 pin 89 has new function that enables System Controller JTAG Chain, no impact for old designs that connect this pin to GND.

    • Reason for Change

  • Enhancement of functionality.
  • Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado) W25Q256 is only supported by u-boot, linux and Vivado SDK Programmer.
  • TPS51206 was changed due to BOM optimization.
  • Avoiding potential problems when PHY management bus is configured at high speeds. 
  • eMMC startup timing improvement.
  • PCB and System Controller optimization.
  • Change to new type of MEMS with only one I2C.
  • ST LSM303DLM MEMS has been discontinued.
    • Type BOM change
    Reason ST LSM303DLM MEMS has been discontinued.
    Impact None for designs that did not use the MEMS sensor
    DescriptionRemoved test pads on top layer
    TypeLayout change
    ReasonNo
    no
    longer needed as the System Controller factory programming is done during tests using main B2B Connectors
    .decreasing
    ImpactNone (test pads only used at factory)
    DescriptionIncreased component clearance from mounting holes on bottom layer
    TypeEnhancement
    ReasonDecreasing the possibility to damage the module with
    using
    improper extraction methods
    .
  • enhancement for Factory tests and programming.
    • ImpactNone
    DescriptionSystem Controller in-system programming via B2B JTAG pins
    TypeEnhancement
    ReasonEnhancement
    enhancement
    for Factory tests and programming
    . 
    Application
    Impact
    1. none
    2. May have to re-evaluate applications that write to the SPI Flash
    3. none
    4. none
    5. none
    6. none
    7. none (if the old GPIO based I2C mux was used it just has no effect now)
    8. none for designs that did not use the MEMS sensor
    9. none (test pads only used at factory)
    10. none
    11. none
    12. none

    Proposed Countermeasures

    None
    DescriptionJM1 pin 89 has new function that enables System Controller JTAG Chain, no impact for old designs that connect this pin to GND
    TypeEnhancement
    ReasonEnhancement for Factory tests and programming
    ImpactNone
     

    Method of Identification

    The model code and revision number (e.g. TE0720-01 or TE0720-02) are printed on the top side of the PCB.

    Production Shipment Schedule

    From June 2014.

    Contact Information

    If you have any questions related to this PCN, please contact Trenz Electronic's Technical Support at

    Disclaimer

    Any projected dates in this PCN are based on the most current product information at the time this PCN is being
    issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information,
    please contact your local Trenz Electronic sales office, technical support or local distributor.