Page History
...
PCN-201406xx
Title
TE0720-01 to TE0720-02
Subject
Trenz Electronic TE0720 SoM (system on module): revision 1 to revision 2 upgrade
Change Level
major
Issuer
Place
Bünde, Germany, EU
Products Affected
This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.
affected product | suggested upgrade |
---|---|
TE0720-01-* | TE0720-02-* |
Changes
Description | JTAG only boot mode is now supported |
---|---|
Type | Enhancement |
Reason | Enhancement of functionality |
Impact | None |
Description | Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256 |
---|---|
Type | Enhancement |
Reason | Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado) W25Q256 is only supported by u-boot, linux and Vivado SDK Programmer. |
Impact | May have to re-evaluate applications that write to the SPI Flash |
Description | Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with TPS51206 |
---|---|
Type | BOM change |
Reason | TPS51206 was changed due to BOM optimization |
Impact | None |
Description | Changed MDIO pullup from 10k to 4k7 |
---|---|
Type | BOM change |
Reason | Avoiding potential problems when PHY management bus is configured at high speeds |
Impact | None |
Description | Changed eMMC core supply from switched 3.3Vout to 3.3Vin. |
---|---|
Type | Schematic change |
Reason | eMMC startup timing improvement |
Impact | None |
Description | MAC EEPROM power changed from 3.3V to 1.8V |
---|---|
Type | Schematic change |
Reason | PCB and System Controller optimization |
Impact | None |
Description | I2C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus. |
---|---|
Type | Schematic change |
Reason | Change to new type of MEMS with only one I2C |
Impact | None (if the old GPIO based I2C mux was used it just has no effect now) |
Description | ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled in standard assembly variants. |
---|---|
Type | BOM change |
Reason | ST LSM303DLM MEMS has been discontinued. |
Impact | None for designs that did not use the MEMS sensor |
Description | Removed test pads on top layer |
---|---|
Type | Layout change |
Reason | No longer needed as the System Controller factory programming is done during tests using main B2B Connectors |
Impact | None (test pads only used at factory) |
Description | Increased component clearance from mounting holes on bottom layer |
---|---|
Type | Enhancement |
Reason | Decreasing the possibility to damage the module with improper extraction methods |
Impact | None |
Description | System Controller in-system programming via B2B JTAG pins |
---|---|
Type | Enhancement |
Reason | Enhancement for Factory tests and programming |
Impact | None |
Description | JM1 pin 89 has new function that enables System Controller JTAG Chain, no impact for old designs that connect this pin to GND |
---|---|
Type | Enhancement |
Reason | Enhancement for Factory tests and programming |
Impact | None |
...
Overview
Content Tools