Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.
CompanyTrenz Electronic Gmbh
PCN NumberPCN-20140730
TitleTE0720-01 to TE0720-02
SubjectTrenz Electronic
TE0720 SoM
TE0720 SoM (system on module): revision 1 to revision 2 upgrade

Change Level

major

Issuer

Trenz Electronic GmbH

Place

Bünde, Germany, EU

Issue Date

20140730

Products Affected

This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.

affected product

suggested upgrade

TE0720-01-*

TE0720-02-*

Changes

TypeReason
 

Type
Impact

Description
Reason for change
#1EnhancementJTAG only boot mode is now supported
 

Enhancement

NoneEnhancement of functionality

Impact

None

 

DescriptionReasonDescription TPS51206 TypeImpact 4k7 TypeDescription.TypeImpactTypeImpact ST .DescriptionReasonDescriptionTypeReasonImpactTypeReasonImpactDescriptionType
#2EnhancementWinbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256
TypeEnhancement
 

May have to re-evaluate applications

that write to the SPI Flash

Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado)

W25Q256 is only supported by u-boot, linux and Vivado SDK Programmer

.

ImpactMay have to re-evaluate applications that write to the SPI Flash
#3BOM change

Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with

TPS51206

 BOM changeNoneReasonTPS51206 was changed due to BOM optimization
#4NoneBOM changeDescription

Changed MDIO pullup from 10k to

4k7

 BOM changeNoneReasonAvoiding potential problems when PHY management bus is configured at high speeds
ImpactNone
#5Schematic changeChanged eMMC core supply from switched 3.3Vout to 3.3Vin
 Schematic changeNoneReasoneMMC startup timing improvement
#6NoneSchematic changeDescriptionMAC EEPROM power changed from 3.3V to 1.8V
 Schematic changeNoneReasonPCB and System Controller optimization
#7NoneSchematic changeDescription

I2C Multiplexing no longer needed (to select between RTC and MEMS), all

I2C devices are on the same bus.

 
TypeSchematic change
ReasonChange to new type of MEMS with only one I2C
Impact None None (if the old GPIO based I2C mux is used it just has no effect now)Change to new type of MEMS with only one I2C
#8BOM change

ST

Description

LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS

is no longer assembled in standard assembly variants

Type BOM change
Reason ST LSM303DLM MEMS has been discontinued.
 None Impact None for designs that did not use the MEMS sensorST LSM303DLM MEMS has been discontinued
#9Layout changeRemoved test pads on top layer
TypeLayout change
 None (test pads only used at factory)No longer needed as the System Controller factory programming is done during tests using main B2B Connectors
ImpactNone (test pads only used at factory)
#10EnhancementIncreased component clearance from mounting holes on bottom layer
 EnhancementNoneDecreasing the possibility to damage the module with improper extraction methods
#11NoneEnhancementDescriptionSystem Controller in-system programming via B2B JTAG pins
 EnhancementNoneEnhancement for Factory tests and programming
#12NoneEnhancement

JM1 pin 89 has new function that enables System Controller JTAG Chain,

no impact for old designs that connect this pin to GND

 EnhancementNoneReasonEnhancement for Factory tests and programming
ImpactNone
 

Method of Identification

The model code and revision number (e.g. TE0720-01 or TE0720-02) are printed on the top side of the PCB.

Production Shipment Schedule

From June 2014.

Contact Information

If you have any questions related to this PCN, please contact Trenz Electronic's Technical Support at

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being
issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information,
please contact your local Trenz Electronic sales office, technical support or local distributor.