Page History

Products Affected

This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.

Changes

#1 JTAG only boot mode is now supported

Type: Enhancement

Reason: Enhancement of functionality

Impact: None

#2 Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256

Type: Enhancement

Reason: Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado) W25Q256 is only supported by u-boot, linux Linux and Vivado SDK Programmer

Impact: May have to re-evaluate applications that write to the SPI Flash

#3 Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with TPS51206

Type: BOM change

Reason: TPS51206 was changed due to BOM optimization

Impact: None

#4 Changed MDIO pullup from 10k to 4k7

Type: BOM change

Reason: Avoiding potential problems when PHY management bus is configured at high speeds

Impact: None

#5 Changed eMMC core supply from switched 3.3Vout to 3.3Vin

Type: Schematic change

Reason: eMMC startup timing improvement

Impact: None

#6 MAC EEPROM power changed from 3.3V to 1.8V

Type: Schematic change

Reason: PCB and System Controller optimization

Impact: None

#7 I2C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus.

Type: Schematic change

Reason: Change to new type of MEMS with only one I2C

Impact: None (if the old GPIO based I2C mux is used it just has no effect now)

#8 ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled in standard assembly variants

Type: BOM change

Reason: ST LSM303DLM MEMS has been discontinued

Impact: None for designs that did not use the MEMS sensor, please contact us for customized BOM if necessary

#9 Removed test pads on top layer

Type: Layout change

Reason: No longer needed as the System Controller factory programming is done during tests using main B2B Connectors

Impact: None (test pads only used at factory)

#10 Increased component clearance from mounting holes on bottom layer

Type: Enhancement

Reason: Decreasing the possibility to damage the module with improper extraction methods

Impact: None

#11 System Controller in-system programming via B2B JTAG pins

Type: Enhancement

Reason: Enhancement for Factory tests and programming

Impact: None

#12 JM1 pin 89 has new function that enables System Controller JTAG Chain no impact for old designs that connect this pin to GND

Type: Enhancement

Reason: Enhancement for Factory tests and programming

Impact: None

Method of Identification

The model code and revision number (e.g. TE0720-01 or TE0720-02) are printed on the top side of the PCB.