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  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"

Template Change history:

DateVersionChangesAuthor

4.1
  • Minor changes
    • Notes
    • Tables
ED

4.0
  • Rework for smaller TRM which can be generated faster
    • Reduce Signal Interfaces Pin
    • Reduce On Board Perihery
    • Reduce Power
    • Move Configuration Signals from Overview to own section
JH

3.12
  • Version History
    • changed from list to table
  • all
    • changed title-alignment for tables from left to center
ma

3.11
  • update "Recommended Operating Conditions" section


3.1
  • New general notes for temperature range to "Recommended Operating Conditions"


3.02
  • add again fix table of content with workaround to use it for pdf and wiki
  • Export Link for key features examples
    • Notes for different Types (with and without Main FPGA)
  • Export Link for Signals, Interfaces and Pins examples
    • Notes for different Types (Modul, Modul Hypride, Evalboard, Carrier)


3.01
  • remove fix table of content and page layout ( split page layout make trouble with pdf export)
  • changed and add note to signal and interfaces, to on board periphery section
  • ...(not finished)


3.00
  • → separation of Carrier/Module and evaluation kit TRM


2.15
  • add excerpt macro to key features


2.14
  • add fix table of content
  • add table size as macro



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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
        anchorFigure_anchorname
        title-alignmentcenter
        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • Scroll Title
        anchorTable_tablename
        title-alignmentcenter
        titleText

        Scroll Table Layout
        orientationportrait
        sortDirectionASC
        repeatTableHeadersdefault
        style
        widths
        sortByColumn1
        sortEnabledfalse
        cellHighlightingtrue

        ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



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-----------------------------------------------------------------------


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Note for Download Link of the Scroll ignore macro:


Scroll Ignore

Download PDF version of this document.

Overview

The Trenz Electronic TE0xxx-xx ... TE0817 is an industrial /extended grade ... module ... based on Xilinx/Intel...grade MPSoC SOM integrating a Xilinx Zynq UltraScale+ MPSoC, DDR4 SDRAM with 64-Bit width data bus connection, SPI Boot Flash memory for configuration and operation, transceivers and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking connections in a compact 5.2 cm x 7.6 cm form factor.

Refer to http://trenz.org/tec0850te0817-info for the current online version of this manual and other available documentation.

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Notes :

Key Features

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

See examples fro different types <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-KeyFeatures


Excerpt
  • SoC/FPGA

    • Device: ZU4 / ZU5 / ZU7 1)
    • Engine: CG / EG / EV 1)
    • Speedgrade: -1 / -2 / -3 1)
    • Temperature Range: Extended / Industrial 1)
    • Package: FBVB900...
  • RAM/Storage
    • 4 GByte DDR4 SDRAM 2)
    • 2 x 64 MByte Serial Flash 3)
    • EEPROM with MAC address...
  • On Board
    • ...Oscillator
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
  • Notes
    • ...

Block Diagram

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add drawIO object in Scroll Ignore section and add reference image in Scroll Only.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

Note

Title (not anchor) of all Scroll Title such as DrawIOs and Tables should be changed according to the Module name.

Example: TE0812 Block Diagram

Note

All created DrawIOs  should be named according to the Module name:

Example: DrawIO of TE0812 Block Diagram should be named TE0812_OV_BD

Scroll Title
anchorFigure_OV_BD
title-alignmentcenter
titleTExxxx block diagram
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    • 4 x B2B Connector (ADM6)
      • up to 204 PL IO

        • HP: 156
        • HD: 48
      • up to 65 PS MIO

      • 4 GTR
      • 16 GTH
      • I2C, JTAG
  • Power
    • 3.3 V power supply via B2B Connector needed 4).
  • Dimension
    • 76 mm x 52 mm
  • Notes
    1) Please, take care of the possible assembly options. Furthermore, check whether the power supply is powerful enough for your FPGA design.
    2) Up to 32 GByte are possible with a maximum bandwidth of 2400 MBit/s.
    3) Please, take care of the possible assembly options.
    4) Dependant on the assembly option a higher input voltage may be possible.

Block Diagram

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add drawIO object in Scroll Ignore section and add reference image in Scroll Only.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


Note

Title (not anchor) of all Scroll Title such as DrawIOs and Tables should be changed according to the Module name.

Example: TE0812 Block Diagram


Note

All created DrawIOs  should be named according to the Module name:

Example: DrawIO of TE0812 Block Diagram should be named TE0812_OV_BD



Scroll Title
anchorFigure_OV_BD
title-alignmentcenter
titleTE0813 block diagram


Scroll Ignore

draw.io Diagram
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Image Added


Main Components

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Notes :

Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .



Scroll Title
anchorFigure_OV_MC
title-alignmentcenter
titleTExxxx TE0813 main components


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  1. ...
  2. ...
  3. ...

Initial Delivery State

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Note

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

draw.io Diagram
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Scroll Only

Image Added


  1. SoC, U1
  2. DDR4, U2, U3, U9, U12
  3. Quad SPI Flash, U7, U17
  4. Connector, JM1, JM2, JM3, JM4
  5. EEPROM, U28
  6. Clock Generator, U5
  7. Oscillator, U6, U32
  8. Power Supply, U4, U8, U10, U11, U13 ... U16, U18 ... U24, U26, U27, U29 ...U31, U33, U34, U41

Initial Delivery State

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Note

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty



Scroll Title
anchorTable_OV_IDS
title-alignmentcenter
titleInitial delivery state of programmable devices on the module

Scroll Table Layout
orientationportrait

Scroll Title
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title-alignmentcenter
titleInitial delivery state of programmable devices on the module
Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrue

Storage device name

Content

Notes

Quad SPI Flash

EEPROMSystem Controller CPLDDDR4 SDRAMeMMCProgrammable Clock Generator

Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.
...
Scroll Title
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titleController signal.

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repeatTableHeadersdefault
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Storage device name

Content

Notes

DDR4 SDRAMnot programmed
Quad SPI Flashnot programmed
EEPROMnot programmed besides factory programmed MAC address
Programmable Clock Generatornot programmed

Name

B2B/ConnectorDirectionDescription

Boot Mode

EnableResetJTAGSELPGOOD


Signals, Interfaces and Pins

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For subsection examples see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-Signals,InterfacesandPins

Note

Modules has mostly B2B Connector with Interface subsections

Hybride Modules have B2B Connector with Interface subsections and additional "real" connector

Carrier has  B2B connector (maybe not all interfaces like modules has) and "real" connectors

Evaluation boards has only "real" connectors

Modules with main SoC have an additional MIO section, where dedication MIO Pin assignment will be shown

B2B SoC/FPGA IOs

B2B JTAG Interface

B2B ETH Interface

B2B USB Interface

SD Card Connector

SMA Connector

MIO

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Note
titleNote

MIO section only for SoC devices with dedicated MIO, otherwhise remove this section

MIO Pins

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Only for SoC Modules(Xilinx MIO, for Intel and MicroChip SoC please change MIO to syntax of the manufacturer).  you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

MIO Pins are only for SoC like Zynq, U+Zynq and Versal, for other FPGA modules remove this chapter

Example:

  • Table with all connectors and Designator
  • List of different interfaces per connector
  • IO CNT (for FPGA IOs where functionality can be changed by customer)


Connectors

Scroll Title
anchorTable_SIP_C
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titleBoard Connectors

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Connector TypeDesignatorInterfaceIO CNT 1)Notes
B2BJM1MGT PL4 x MGT (RX/TX)
B2BJM1HP52 SE / 24 DIFF
B2BJM2MGT PS2 x MGT CLK
B2BJM2MGT PS4 x MGT (RX/TX)
B2BJM2CFGJTAG
B2BJM2CFGMODE
B2BJM3HD48 SE / 24 DIFF
B2BJM3MGT PLMGT CLK
B2BJM3MIO65 GPIO
B2BJM4HP104 SE / 48 DIFF

1) IO CNT depends on assembly variant. E.g. the MGTs are not available for all FPGAs


Test Points

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MIO PinConnected toB2BNotesMIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI

Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes1)
10TP1PWR_PL_OKJ2-120

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.



Scroll Title
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titleTest Points Information

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Connected to
Test PointSignalNotes1)
TP1PLL_SCLpulled-up to PS_1V8
TP2TP3PLL_SDApulled-up to PS_1V8TP4
TP5GND
TP6PL_1V8
TP7GND
TP8GND
TP9PL_VCCINT_IO
TP10

On-board Peripherals

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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection by assigning advance link using: #NameOfTheSection

Example: #ClockSources, #CPLD, #QuadSPIFlash

Scroll Title
anchorTable_OBP
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titleOn board peripherals
Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrueChip/InterfaceDesignatorNotes
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For example subsections see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-On-boardPeripherals

Power and Power-On Sequence
GND
TP11PL_VCCINT
TP12PL_VCU_0V9
TP13FP_0V85
TP14PS_1V8
TP15GND
TP16DDR_2V5
TP17DDR_PLL
TP18DDR_1V2
TP20MGTAVTT
TP21VTT
TP22PL_GT_1V05
TP23VREFA
TP24MGTVCCAUX
TP25MGTAVCC
TP27PS_PLL
TP28PS_AVTT
TP29LP_0V85
TP30PS_AUX
TP31PS_AVCC
TP34POR_Bpulled-up to PS_1V8

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.


On-board Peripherals

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
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Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection by assigning advance link using: #NameOfTheSection

Example:

Chip/InterfaceDesignatorConnected ToNotes
ETH PHYU10
  • B2B connector J1
  • SoC MIO
Gigabit ETH PHY



Scroll Title
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titlePower ConsumptionOn board peripherals

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Power Input PinTypical Current
VINTBD*

* TBD - To Be Determined

Power Distribution Dependencies

Scroll Title
anchorFigure_PWR_PD
title-alignmentcenter
titlePower Distribution
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Chip/InterfaceDesignatorConnected ToNotes

DDR4 SDRAM

U2, U3, U9, U12SoC - PS

Quad SPI Flash

U7, U17SoC - PSBooting.

EEPROM

U28B2B - J2

Clock Generator

U5SoC, B2B

Oscillator

U6Clock Generator25 MHz

Oscillator

U32SoC33.333333 MHz



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For example subsections see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-On-boardPeripherals

Configuration and System Control Signals

Anchor
Configuration and System Control Signals
Configuration and System Control Signals

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  • Overview  all Controller signals, like Reset, Boote Mode, JTAG Interface(Connector or USB In case of FTDI)...
  • In case it's connected to CPLD always link to CPLD description and add not from the  current implementation here(in case it's available)

Power-On Sequence

Scroll Title
anchorFigure_PWR_PS
title-alignmentcenter
titlePower Sequency
Scroll Ignore

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Scroll Only

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Voltage Monitor Circuit

Scroll Title
anchorFigure_PWR_VMC
title-alignmentcenter
titleVoltage Monitor Circuit
Scroll Ignore

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Scroll Only

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Power Rails


B2B Connector

JM1
Scroll Title
anchorTable_PWROV_PRCNTRL
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titleModule power railsController signal.

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Power Rail Name
Connector+Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

Bank Voltages

Scroll Title
anchorTable_PWR_BV
title-alignmentcenter
titleZynq SoC bank voltages.
Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrue

Bank          

Schematic Name

Voltage

NotesBoard to Board Connectors Page properties
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  • This section is optional and only for modules.
  • Signal Name

    Direction1)Description
    JM1.A45POR_OVERRIDEINOverride power-on reset delay 2).
    JM2.A31ERR_OUTOUTPS error indication 2).
    JM2.A34ERR_STATUSOUTPS error status 2).
    JM2.A35LP_GOODOUTLow-power domain powered-up. Pulled up to 3.3VIN
    JM2.A36PLL_SCLINI2C clock
    JM2.A37PLL_SDAIN/OUTI2C data
    JM2.A40PG_VCUOUTProgrammable logic powered-up.
    JM2.A41EN_PSGTINEnable GTR transceiver power-up.
    JM2.A44 / JM2.A45 /
    JM2.A46 / JM2.A47
    TCK / TDI / TDO / TMSSignal-dependent

    JTAG configuration and debugging interface.

    JTAG reference voltage: PS_1V8

    JM2.B29PG_PSGTOUTGTR transceivers powered-up.
    JM2.B30PROG_BIN/OUTPower-on reset 2). Pulled-up to PS_1V8.
    JM2.B33SRST_BINSystem reset 2). Pulled-up to PS_1V8.
    JM2.B34INIT_BIN/OUTInitialization completion indicator after POR 2). Pulled-up to PS_1V8.
    JM2.B37PG_PLOUTVCU powered-up.
    JM2.B38EN_FPDINEnable full-power domain power-up.
    JM2.B41PG_FPDOUTFull-power domain powered-up.
    JM2.B45PG_DDROUTDDR power supply powered-up.
    JM2.B46DONEOUTPS done signal 2). Pulled-up to PS_1V8.
    JM2.B47EN_DDRINEnable DDR power-up.
    JM2.C31MRINManual reset.
    JM2.C35EN_PLINEnable programable logic power-up.
    JM2.C36EN_GT_RINEnable GTH/GTY transceiver power-up.
    JM2.C44 / JM2.C45 / JM2.C46 / JM2.C47MODE3..0INBoot mode selection 2):
    • JTAG
    • QUAD-SPI (32 Bit)
    • SD1 (2.0)
    • eMMC (1.8 V)
    • SD1 LS (3.0)

    Supported Modes depends also on used Carrier.

    JM2.D33PG_GT_ROUTGTH/GTY Transceivers powered-up.
    JM2.D37PSBATTINPS RTC Battery supply voltage 2) 3).
    JM2.D45 / JM2.D46DX_P / DX_N-SoC temperatur sensing diode pins 2).

    1) Direction:

      • IN: Input from the point of view of this board.
      • OUT: Output from the point of view of this board.

    2) See UG1085 for additional information.

    3) See Recommended Operating Conditions.

    Power and Power-On Sequence

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    Enter the default value for power supply and startup of the module here.

    • Order of power provided Voltages and Reset/Enable signals

    Link to Schematics, for power images or more details


    Power Rails

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    List of all Powerrails which are accessible by the customer

    • Main Power Rails and Variable Bank Power



    Scroll Title
    anchorTable_PWR_PR
    title-alignmentcenter
    titleModule power rails.

    Scroll Table Layout
    orientationportrait
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    Power Rail Name/ Schematic NameConnector.PinDirection1)Notes
    VCCO_66JM1.A32 / JM1.A33IN
    VREF_66JM1.A41IN
    3.3VINJM1.A54 / JM1.A55 / JM1.B55 / JM1.B56IN

    PL_1V8

    JM1.C32 / JM1.C33 / JM1.D33 / JM1.D34OUT
    PL_DCINJM1.C57 / JM1.C58 / JM1.C59 / JM1.C60 / JM1.D57 / JM1.D58 / JM1.D59 / JM1.D60 / IN
    LP_DCDCJM2.A50 / JM2.A51 / JM2.A52 / JM2.B50 / JM2.B51 / JM2.B52 / JM2.C50 / JM2.C51 / JM2.C52 / JM2.D50 / JM2.D51 / JM2.D52IN
    DCDCINJM2.A57 / JM2.A58 / JM2.A59 / JM2.A60 / JM2.B57 / JM2.B58 / JM2.B59 / JM2.B60 / JM2.C57 / JM2.C58 / JM2.C59 / JM2.C60 / JM2.D57 / JM2.D58 / JM2.D59 / JM2.D60 / IN
    PS_BATTJM2.D37IN
    DDR_1V2JM2.D47OUT
    PS_1V8JM3.A56 / JM3.B56 / JM3.C56 / JM3.D56OUT
    GT_DCDCJM3.A59 / JM3.A60 / JM3.B59 / JM3.B60 / JM3.C59 / JM3.C60 / JM3.D59 / JM3.D60 /IN
    VCCO_25JM3.C7 / JM3.C8 / JM3.D8 / JM3.D9IN
    VCCO_26JM3.C19 / JM3.C20 / JM3.D20 / JM3.D21IN
    VCCO_64JM4.B21 / JM4.B39IN
    VREF_64JM4.B30IN
    VCCO_65JM4.C21 / JM4.C39IN
    VREF_65JM4.C30IN

    1) Direction:

      • IN: Input from the point of view of this board.
      • OUT: Output from the point of view of this board.


    Recommended Power up Sequencing

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    List baseboard design hints for final baseboard development.

    The power up sequencing highly depends on the use case. In general, it should be possible to enable/disable the processing system (PS) / programmable logic (PL) independently. Furthermore, within the processing logic it should be possible to enable/disable only low-power domain and/or low-power and full-power domain. Additionally, usage of GTR for PS side and GTH/GTY for PL side should be possible. Because of this flexibility the needed parts of the following table needs to be selected individually. For detailed information take a look into schematics.

    Scroll Title
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    titleBaseboard Design Hints

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    SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
    0---Configuration signal setup.See Configuration and System Control Signals.
    1 1)PSBATT1.2 V ... 1.5 V-Battery connection.Battery Power Domain usage. When not used, tie to GND.
    1 2)3.3VIN3.3 V (± 5 %)-Management power supply.Management module power supply. 0.5 A recommended. Consider note 2) for modules with VCU and/or low-power SoC.
    2Processing System (PS):Procedure for PS starting.
    2.1Low-power domain:Bring-up for low-power domain PS.
    2.1.1LP_DCDC3.3 V (± 5 %) 3)-Low-power domain power supply.Main module power supply for low-power domain. 5.5 A recommended. Power consumption depends mainly on design and cooling solution.
    2.1.2EN_LPD-PU 4), 3.3 VLow-power domain power enable.
    2.1.3LP_GOOD-PU 4), 3.3 VLow-power domain power good status.Module power-on sequencing for low-power domain finished.
    2.2Full-power domain:Bring-up for full-power domain PS.Full-power PS domain needs powered low-power PS domain.
    2.2.1DCDCIN3.3 V (± 5 %) 3)
    Full-power domainand GTR transceiver power supply.Main module power supply for full-power domain. 7 A recommended. Power consumption depends mainly on design and cooling solution.
    2.2.2EN_FPD3.3 V-Full-power domain power enable.
    2.2.3PG_FPD-PU 4), 3.3 VFull-power domain power good status.Module power-on sequencing for full-power domain finished.
    2.2.4EN_DDR3.3 V-DDR memory power enable.
    2.2.5PG_DDR
    PU 4), 3.3 VDDR memory power good status.Module power-on sequencing for DDR memory finished.

    2.3

    GTR TransceiverProcedure for GTR transceiver starting.PS transceiver usage needs powered PS (low- and full-power domain).
    2.3.1EN_PSGT3.3 V-GTR transceiver power enable.
    2.3.2PG_PSGT-PU 4), 3.3 VGTR transceiver power good status.Module power-on sequencing for GTR transceiver finished.
    2Programmable Logic (PL)Procedure for PL starting.PS and PL can be started independently.
    2.1PL_DCIN3.3 V (± 5 %) 3) 5)-Programmable logic power supply.Main module power supply for programmable logic. 12 A recommended. Power consumption depends mainly on design and cooling solution.
    2.2EN_PL-PU 4), 3.3 VProgrammable logic power enable.
    2.3PG_PL-PU 4), 3.3 VProgrammable logic power good status.Module power-on sequencing for programmable logic finished. Periphery and variable bank voltages can be enabled on carrier.
    2.4VCCO_25 / VCCO_26 / VCCO_64 / VCCO_65 / VCCO_66 6)-Module bank voltages.Enable bank voltages after PG_PL deassertion.
    2.5PG_VCU-PU 4), 3.3 VVCU power good status.
    3GTH / GTY TransceiverProcedure for GTH / GTY transceiver starting.PL transceiver usage needs powered PL and low-power PS domain.
    3.1GT_DCDC3.3 V (± 5 %) 3)-GTH / GTY transceiver power supply.Main module power supply for GTH / GTY transceiver. 3 A recommended. Power consumption depends mainly on design and cooling solution.
    3.2EN_GT_R3.3 V-GTH / GTY transceiver power enable.
    3.3PG_GT_R-PU 4), 3.3 VGTH / GTY transceiver power good status.

    1) (optional)

    2) On TE0813 REV01 boards it is necessary for modules with VCU and/or low-power speedgrade to either connect signal EN_PL to voltage 3.3VIN or to enable EN_PL together with 3.3VIN. This should be changed in a newer revision.

    3) Dependent on the assembly option a higher input voltage may be possible. 

    4) (on module)

    5) This value depends highly on DCDC U4. Higher values may be possible with different DCDCs. For more information consult schematic and according datasheets.

    6) See DS925 for additional information.

    Board to Board Connectors

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    • This section is optional and only for modules.
    • use "include page" macro and link to the general B2B connector page of the module series,

      For example: 6 x 6 SoM LSHM B2B Connectors

      Include Page
      PD:6 x 6 SoM LSHM B2B Connectors
      PD:6 x 6 SoM LSHM B2B Connectors

    Include Page
    PD:5.2 x 7.6 UltraSoM+ ADF6 and ADM6 B2B Connectors
    PD:5.2 x 7.6 UltraSoM+ ADF6 and ADM6 B2B Connectors

    Technical Specifications

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    List of all Powerrails which are accessible by the customer

    • Main Power Rails and Variable Bank Power add boarder one time maximum Rating (Board will damaged)

    Absolute Maximum Ratings *)

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    Power Rail Name/ Schematic NameDescriptionMinMaxUnit
    LP_DCDCMicromodule Power-0.3006.0V
    DCDCINMicromodule Power-0.3007.0V
    GT_DCDCMicromodule Power-0.3006.0V
    PL_DCIN 1)Micromodule Power-0.300

    4.0

    V
    3.3VINMicromodule Power-0.3003.600V
    PS_BATTRTC / BBRAM-0.5002.000V
    VCCO_25HD IO Bank power supply-0.5002.000V
    VCCO_26HD IO Bank power supply-0.5002.000V
    VCCO_64HP IO Bank power supply-0.5003.400V

    VCCO_65

    HP IO Bank power supply-0.5003.400V
    VCCO_66HP IO Bank power supply-0.5003.400V
    VREF_64Bank input reference voltage-0.5002.000V
    VREF_65Bank input reference voltage-0.5002.000V
    VREF_66Bank input reference voltage-0.5002.000V

    1) This value depends highly on DCDC U4. Higher values are possible with different DCDCs. For more information consult schematic and according datasheets.

    *) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
       or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

    Recommended Operating Conditions

    This TRM is generic for all variants. Temperature range can be different depending on assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

    Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

    • Variants of modules are described here: Article Number Information
    • Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
    • Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
    • Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
    • The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.

    use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors
    Include PagePD:6 x 6 SoM LSHM B2B ConnectorsPD:6 x 6 SoM LSHM B2B Connectors

    Technical Specifications

    Absolute Maximum Ratings


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    Symbols
    Parameter
    Description
    MinMax
    Unit
    Units
    V
    Reference Document
    LP_DCDC 1)3.1353.465
    VVV
    V
    VVV°C

    Recommended Operating Conditions

    This TRM is generic for all variants. Temperature range can be differ depending on the assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

    Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

    • Variants of modules are described here: Article Number Information
    • Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
    • Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
    • Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
    • The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.
    See  ???? datasheet

    .


    DCDCIN 1)3.1353.465V
    GT_DCDC 1)3.1353.465V
    PL_DCIN 1) 2)3.135

    3.465

    V
    3.3VIN3.1353.465V
    PS_BATT1.21.5VSee FPGA datasheet.
    VCCO_251.1643.399VSee FPGA datasheet.
    VCCO_261.1643.399VSee FPGA datasheet.
    VCCO_640.971.854VSee FPGA datasheet.

    VCCO_65

    0.971.854VSee FPGA datasheet.
    VCCO_660.971.854VSee FPGA datasheet.
    VREF_640.61.2VSee FPGA datasheet.
    VREF_650.61.2VSee FPGA datasheet.
    VREF_660.61.2VSee FPGA datasheet.

    1) Dependent on the assembly option a higher input voltage may be possible. 

    2) This value depends highly on DCDC U4. Higher values may possible with different DCDCs. For more information consult schematic and according datasheets

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    ParameterMinMaxUnitsReference Document
    VSee ???? datasheets.VSee  ???? datasheet.VSee  ???? datasheet.VSee  ???? datasheet.VSee  ???? datasheet.VSee  ???? datasheet.VSee  ???? datasheet.°C


    Physical Dimensions

    • Module size: ?? 76 mm × ?? 52 mm.  Please download the assembly diagram for exact numbers.

    • Mating height with standard connectors: ? 5 mm.

    PCB thickness: ?? mm1.74 mm (± 10 %).

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    In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

    For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

    https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

    Note

    For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



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    Currently Offered Variants 

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    Set correct link to the shop page overview table of the product on English and German.

    Example for TE0706:

        ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706TE0813

        DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706TE0813


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    Trenz shop TEXXXX TE0813 overview page
    English pageGerman page


    Revision History

    Hardware Revision History

    Page properties
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    Set correct links to download  Carrier, e.g. TE0706 REV02:

      TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

    Note:

    • Date format:  YYYY-MM-DD
    • Example: 

      DateRevisionChangesDocumentation Link
      2020-11-25REV02
      • Resistors R14 and R15 was replaced by 953R (was 5K1)
      • Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
      REV02



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    _HRN
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    DateRevisionChangesDocumentation Link
    -REV01First Production ReleaseREV01


    Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

    Document Change History

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    • Note this list must be only updated, if the document is online on public doc!
    • It's semi automatically, so do following
      • Add new row below first

      • Copy "Page Information Macro (date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

      • Metadata is only used of compatibility of older exports


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    DateRevisionContributorDescription

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    typeFlat

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    prefixv.
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    typeFlat
    showVersionsfalse

    • <add TRM change list here>Initial Document

    --

    all

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    • --


    Disclaimer

    Include Page
    IN:Legal Notices
    IN:Legal Notices



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