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Impact: None. Improved stability.

#3 Added 470 nF capacitors (C178, C187, C188, C189

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) to improve VTT net.

Type: Schematic Change

Reason: VTT decoupling improvement.

Impact: Improved VTT voltage rail reliabililty.

#4 Added diode (D2) between U41 pin 3 net MR and voltage rail 3.3VIN.

Type: Schematic Change

Reason: Protect manual reset pin.

Impact: None.

#5 Enabled DDR4 test usage via connecting all DDR4 TEN pins together, pulled them down with resistor (R120) and added testpoint (TP23).

Type: Schematic Change

Reason: Enable DDR4 test improvement.

Impact: None.

#6 Added testpoints (TP25, TP27, TP29, TP35, TP37...TP79).

Type: Schematic Change

Reason: Improve voltage measuring possibilities.

Impact: None.

#7 Changed capacitor (C112) size from 0402 to 0201 and voltage rating from 16 V to 10 V.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#8 Changed ferrid beads

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(L1, L2, L3, L4, L5,

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L7) from MPZ0603S121HT000 to BLM15PX800SZ1D.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#9 Changed ferrid beads (L6, L8) from MPZ1608S221A to BLM15PX800SZ1D

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.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#10

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Changed signal trace

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lengths.

Type: PCB Change

Reason:Changing trace length are the result of above done changes Result of changes above.

Impact: Check whether new trace length fits your baseboard requirements Changed trace length have to be taken into account in existing designs. The trace length for new revision will be available in TE081x series pinout generator. Please check if change in trace length still matches your requirements. Adaption of carrier may be necessary.

#11 Updated documentation overviews.

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