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This line was added.
This line was removed.
Formatting was changed.

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Reason: BOM optimization.

Impact: None.

#27 Removed testpoints from bottom PCB side for signals "GND", "3.3VIN", "RESIN", "JTAGEN", "TMS", "TCK", "TDI", and "TDO".

Type: Schematic Change

Reason: Placement optimization.

Impact: None.

#28 Added testpoint (TP23, TP24, TP25, TP26, TP27, TP28, TP29, TP30, TP31, TP32, TP33, TP34,

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TP35(for AVCC), TP36, TP39, TP40

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Type: Schematic Change
Reason: Voltage and system monitoring improvement.
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