Page History
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ED: Tabelle ist fertig!
Changes
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#1 Restructured power supply circuit. Power supply can be supplied either via power path ATX connector (J20) (signal "12V_input_A") → fuse 0451007.MRL (F1) (signal "12V_input_A_Fused") → protection circuit LTC4365ITS8#TRMPBF (U52) with MOSFET Si7114ADN-T1-GE3 (T2, T3) (signal "12V") or via power path power jack (J25) (signal "12V_input_B") → fuse 0451007.MRL (F2) (signal "12V_input_B_Fused") → protection circuit LTC4365ITS8#TRMPBF (U53) with MOSFET Si7114ADN-T1-GE3 ( T4, T5) (signal "12V"). Added input power protection circuit with TVS diode SMBJ20CA (D11, D19).
Type: Schematic Change
Reason: Improve power supply architecture.
Impact: None.
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#2 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and adapted power circuit.
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesEOL of Component.
Impact: None.
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Power supply option 1.25 V removed. Minor changes in electrical characteristics. (???)
#3 Changed DCDC EN6347QI (U19) to MPM3650CGQW-Z and adapted power circuit.
Type: Schematic Change
Reason:Harmonize with TEBF0818 series EOL of Component.
Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)
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#4 Changed DCDC 171050601 (U22, U26, U29) to MPM3650CGQW-Z and adapted power circuit.
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesBOM Optimization.
Impact: None.
#1 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).
(???)
#5 Changed DCDC 171050601 (U18) to MPM3683GMN-10 and adapted power circuit.
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesBOM Optimization.
Impact: None.
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(???)
#6 Changed DCDC
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EN5311QI (
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U28, U43) to
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MP2164GG-Z and adapted power circuit.
Type: Schematic Change
Reason: EOL of Component.
Impact: Power supply option 1.25 V removedNone. Increased current output capability. Minor changes in electrical characteristics. (???)
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#7 Changed load switch TPS27082LDDCR (Q1, Q2, Q3) to MP5077GG-Z and adapted circuit.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)
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#8 Changed battery power supply circuit (U37, D16) and diode (D16) from SDMG0340LC-7-F to BAS70-05W.
Type: Schematic Change
Reason: BOM OptimizationChange battery voltage supply from 1.8 V to 1.2 V to follow AMD recommendation.
Impact: (???)
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#9 Change eMMC (U2) from MTFC16GJVEC-2M WT to SDINBDG4-8G-XI2.
Type:Schematic Change BOM change
Reason: EOL of Component.
Impact: None. Increased current output capability. Minor changes in electrical characteristicsReplacement has same capacity as used on corresponding affected variant. Reference designs for vivado versions 2019.2 and 2020.2 were tested and work properly without any changes. (???)
#2 Changed DCDC EN5311QI (U28, U43) to MP2164GG-Z and adapted power circuit.
Type: Schematic Change
Reason: EOL of Component.
Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)
#2 Changed battery power supply circuit (U37, D16).
Type: Schematic Change
Reason: Change battery voltage supply from 1.8 V to 1.2 V to follow AMD recommendation.
Impact: (???)
#2 Changed diode (D16) from SDMG0340LC-7-F to BAS70-05W.
Type: Schematic Change
Reason: (???)
Impact: (???)
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#10 Restructered PCIe clock system tree. Differential clock (signals "CLK0_N" and "CLK0_P") is distributed via new added fanout buffer NB3L202KMN (U56) to PCIe connector (J11) (signals "PCI_REF_P" and "PCI_REF_N") and B2B connector (J2) (signals "B505_CLK0_P" and "B505_CLK0_N"). Removed clock oscillator DSC1123CI2-100.0000T (U6).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact:
#11 Changed AC coupling (C93/C94) to DC coupling (R263/R264) for differential clock signal "CLK0_N" and "CLK0_P".
Type: Schematic Change
Reason: BOM OptimizationHarmonize with TEBF0818 series.
Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)
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#12 Changed
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power supply for SFP+ connector (J14) from power rail "3.3V_PCI" to power rail "3.3V_PER".
Type: Schematic Change
Reason: Harmonize with TEBF0818 series
Type: PCB Change
Reason: Follow PCIe recommendation.
Impact: None.
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#13 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).
Type: PCB Schematic Change
Reason: Improve signal integrityHarmonize with TEBF0818 series.
Impact: None.
#3 Changed CAN bus signals net names (CAN_H → CAN_P, CAN_L → CAN_N) to route them with 120 Ohm differential impedance.
Type: PCB Change
#14 Changed pull-up resistor voltage (R18, R21, R86, R87, R113 ... R115, R121 ... R123).
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesReason: Improve signal integrity.
Impact: None.
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#15 Reordered MGT signal connection at FireFly connector (J6, J21).
Type: Schematic Change
Reason: Improve FireFly handling and harmonize with TEBF0818 series.
Impact: If FireFly is used custom firmware needs to be adapted by customer.
#3 Renamed following signals (IN2_P → IN2_CLK_P and IN2_N → IN2_CLK_N).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#16 Inserted level shifter circuit (T7, T8) between CPLD (U39) (signal "PWROK") and ATX connector (J20) (signal "PWR_OK").
Type: Schematic Change
Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB".
Impact: None.
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#17 Inserted MOSFET (T9) circuit for level shifting and logic level inverting.
Type: Schematic Change
Reason: Change voltage level between CPLD voltage rail "3V3SB" and ATX connector voltage rail "5VSB" and harmonize with TEBF0818 series.
Impact: None. CPLD firmware reflects it but customer firmware needs to be checked/adapted by customer.
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#18 Connected all shield signals for connector (J7) together to net "FGND".
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#19 Renamed shield net to FGND2 for connector (J13) and changed shield components from 0 Ohm resistor (R43, R44) to 1 MOhm resistor (R143) and 100 pF capacitor (C149).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series. (???)
Impact: None.
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#20 Inserted FGND3 with resistor (R43) and capacitor (C93) for SFP+ connector (J14) shield.
Type: Schematic Change
Reason: Improve ESD protection.
Impact: None.
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#21 Changed Fan F455B-05LD (M1) to Fan MF40060V2-1000U-A99 (MP1) and updated according mechanical screws and nuts.
Type:Schematic Change BOM change
Reason: Harmonize with TEBF0818 series EOL of Component.
Impact:None.
#1 Change eMMC (U2) from MTFC16GJVEC-2M WT to SDINBDG4-8G-XI2.
Type: BOM change
Reason: EOL of Component.
Impact: None. Replacement has same capacity as used on corresponding affected variant. Reference designs for vivado versions 2019.2 and 2020.2 were tested and work properly without any changes. (???)
#17 Changed resistor (R14) from 4.99 kOHm to 2 kOhm.
Type: BOM Change
Specified airflow of fan decreases slightly from 0.03 m³/min to 0.028 m³/min. (???)
#22 Added assembly option (default: not fitted) for cooling solution with fan controller LM96163CISD/NOPB (U54), temperature sense MMBT3904 (T12), and AND Gate (U55)
Type: Schematic Change
Reason: Reason: Harmonize with TEBF0818 series.
Impact: None.
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#23 Connected fan controller LM96163CISD/NOPB (U54) to I2C bus (signals "SC_SCL" and "SC_SDA").
Type: Schematic Change
Reason:Voltage and system monitoring improvement. (???)Fan controller handling.
Impact: None. For assembled fan controller I2C address 0x4C is used.
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#24 Changed
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pin header (J19) from two pins to four pins.
Type: Schematic Change
Reason:BOM Optimization Harmonize with TEBF0818 series.
Impact: None.
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Consider to use correct pins.
#25 Used resistor (R164) as pull-up resistor for signal "POK_1V8.
Type: BOM change Schematic Change
Reason: EOL of ComponentUse external pull-up resistor.
Impact: Specified airflow of fan decreases slightly from 0.03 m³/min to 0.028 m³/min. (???)
#12 Added assembly option (default: not fitted) for cooling solution with fan controller LM96163CISD/NOPB (U54), temperature sense MMBT3904 (T12), and AND Gate (U55)
Type: Schematic Change
None.
#26 Added debounce circuit (R235, R236, C211, C213) for button (S1, S2).
Type: Schematic Change
Reason: Improve button behaviourReason: Harmonize with TEBF0818 series.
Impact: None.
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#27 Added pull-up resistor (R228 ... R234) for signal ("PRSNT1", "PERST", "WAKE", "PRSNT2", "PRSNT3", "PRSNT4", "PRSNT5").
Type: Schematic Change
Reason:Fan controller handling Harmonize with TEBF0818 series.
Impact: None. For assembled fan controller I2C address 0x4C is used.
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.
#28 Added pull-up resistor (R293) for signal "I2C_RST".
Type: Schematic Change
Reason: Use external pull-up resistor.
Impact: None.
#29 Added termination resistor (R134) assembly option for differential clock signal "CLK0_N" and "CLK0_P".
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None. Consider to use correct pins.
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#30 Changed LED (D8, D10) from 150060VS75000 to 19-213/G6C-BM1N2/DT.
Type: PCB change Schematic Change
Reason:Improve module orientation visibilityBOM Optimization.
Impact: None.
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#31 Changed power inductor (L8, L9, L11, L12) from 1 µH to 4.7 µH.
Type: Schematic Change
Reason: Use external pull-up resistorFollow SFP+ recommendation.
Impact: None.
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#32 Changed
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Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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capacitor (C121 ... C124, C179, C182, C185, C221 ... C223) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesFollow AMD recommendation.
Impact: None.
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#33 Changed
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capacitor (C197, C200, C202, C203) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.
Type: Schematic Change
Reason: Follow SATA recommendation.
Impact: None.
#34 Changed capacitor (C69, C70) from 100 nF, 6.3 V to 220 nF, 50 V
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Type: Schematic Change
Reason: Enable OTG capability.
Impact: None. (???)
#1 Restructered PCIe clock system tree. Differential clock (signals "CLK0_N" and "CLK0_P") is distributed via new added fanout buffer NB3L202KMN (U56) to PCIe connector (J11) (signals "PCI_REF_P" and "PCI_REF_N") and B2B connector (J2) (signals "B505_CLK0_P" and "B505_CLK0_N"). Removed clock oscillator DSC1123CI2-100.0000T (U6).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact:
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.
Type: Schematic Change
Reason: Harmonize with TEBF0818 seriesFollow PCIe recommendation.
Impact: None.
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#35 Changed capacitor (C47, C48, C50, C52, C57, C58, C60, C62) from 470 nF, 6.3 V to 100 nF, 10 V.
Type: Schematic Change
Reason:Harmonize with TEBF0818 series Follow SFP+ recommendation.
Impact: None.
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.
#36 Changed capacitor (C39, C82, C207) from 4.7 µF, 6.3 V
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to 10
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µF, 10 V
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.
Type: Schematic Change
Reason: Follow AMD recommendationHarmonize with TEBF0818 series.
Impact: None.
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#37 Changed capacitor (
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C49,
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C51,
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C59,
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C61) from
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10 µF, 6.3 V,
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0603 to
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22 µF,
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25 V,
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0805.
Type: Schematic Change
Reason: Follow SATA SFP+ recommendation.
Impact: None.
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#38 Changed
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resistor (
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R40) from
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4.99 kOhm to 0 Ohm.
Type: Schematic Change
Reason: Follow PCIe recommendationHarmonize with TEBF0818 series.
Impact: None.
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#39 Changed resistor (R27, R196) from 4.99 kOhm to 100 Ohm.
Type: Schematic Change
Reason: Improve power qualityBOM optimization.
Impact: None.
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#40 Changed resistor (R14) from 4.99 kOHm to 2 kOhm.
Type: Schematic ChangeBOM Change
Reason: Improve power supply input protectionHarmonize with TEBF0818 series.
Impact: None.
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#41 Changed pull-up resistor (R18, R21, R87, R115, R121, R122) from 4.99 kOhm to 7
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.5 kOhm.
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
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#42 Changed
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resistor (R41) from 4.99 kOhm to 200 kOhm.
Type: Schematic Change
Reason: Follow SFP+ recommendationHarmonize with TEBF0818 series.
Impact: None.
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#7 Changed
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resistor (R65) from 8.06 kOhm to 1 kOhm.
Type: Schematic Change
Reason: Follow SFP+ recommendationEnable OTG capability.
Impact: None. (???)
#22
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Added ferrid bead (L25) for fan power supply.
Type: Schematic Change
Reason: Follow SFP+ recommendationImprove power quality.
Impact: None.
#22 Added additional decoupling capacitor (
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C263, C281 ... C287).
Type: Schematic Change
Reason: Improve power supply.
Impact: None.
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#3 Set capacitor (C16, C17) to not fitted.
Type: Schematic Change
Reason:Use external pull-up resistor Harmonize with TEBF0818 series.
Impact: None.
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#24 Set resistor (R98, R198) as not fitted.
Type: Schematic Change
Reason:Improve power supply Harmonize with TEBF0818 series.
Impact: None.
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#3 Changed
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net name (IN2_P → IN2_CLK_P and IN2_N → IN2_CLK_N).
Type: Schematic Change
Reason:BOM optimization Harmonize with TEBF0818 series.
Impact: None.
...
: None.
#24 Changed net name from "3.3V_MOD" to "VCC_MOD".
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.
Impact: None.
#24
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Changed net name from "5VSBIN" to "5VSB".
Type: Schematic Change
Reason:Improve button behaviour Harmonize with TEBF0818 series.
Impact: None.
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#28 Added testpoint (TP17, TP20 ... TP22).
Type: Schematic Change
Reason: Harmonize with TEBF0818 series.Voltage and system monitoring improvement. (???)
Impact: None.
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#3 Changed impedance for differential PCIe signals to 90 Ohm differential.
Type: Schematic PCB Change
Reason: Harmonize with TEBF0818 seriesFollow PCIe recommendation.
Impact: None.
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#3 Routed in schematic with "D100" marked signals with 100 Ohm differential impedance.
Type: Schematic PCB Change
Reason: Harmonize with TEBF0818 seriesImprove signal integrity.
Impact: None.
#33 Added legal notices, system and power overview. Updated revision history. Updated page count and order.
Type: Documentation Update
#3 Changed CAN bus signals net names (CAN_H → CAN_P, CAN_L → CAN_N) to route them with 120 Ohm differential impedance.
Type: PCB Change
Reason: Improve signal integrityReason: Documentation improvement.
Impact: None.
#22 Updated PCB with rules, signal layout, layerstack, polygons.
Type: Schematic PCB Change
Reason: Improve routing.
Impact: None.
#7 Added module orientation mark in silkscreen top side.
Type: PCB change
Reason: Improve module orientation visibility.
Impact: None.
28 Added UKCA logo.
Type: PCB Change
Reason: Required for export to UK.
Impact: None.
#33
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Updated schematic sheet from template.
Type: Documentation Update
Reason: Documentation improvement.
Impact: None.
#33 Updated
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block diagram.
Type: Documentation Update
Reason: Documentation improvement.
Impact: None.
#33
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Added power overview, I2C address table, and Power Voltage Range table. Updated revision history. Updated page count and order.
Type: Documentation Update
Reason: Documentation improvement.
Impact: None.
#1
Type:
Reason:
Impact:
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Method of Identification
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