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Affected Product

Replacement
TE0706-03TE0706-04-A
TE0706-03-DTE0706-04-B

3. L3, L5 Ferrit beads BKP0603HS121-T replaced with MPZ0603S121HT000.

4. EOL component J9 was replaced.

5. Pin Headers J10 - J13 were replaced.

6. EOL component U3 (EN5311QI) was replaced with MPM3834CGPA-Z.

7. EOL component U1 (EN6347QI) was replaced with MPM3860GQW-Z.

8. Added Diode D1, D2 for USB ESD protection.

9. Eth Phy Powersupply modified: L1, R27 removed from shematic; for U6 DVDD supply used internal LDOs.

10. Q1 (TPS27081ADDCR) was replaced with MP5077GG-Z. 

11. EOL component J4 micro SD Card was replaced.

12. Added testpoints TP1 - TP9.

13. Added series terminator R27 to avoid ringing effect.

14. The signals were renamed:

      - VCCIOB ---> VCCIOC,

      - VCCIOC ---> VCCIOD

according to Trenz Module Connection Table.

15. Added Legal Notices page.

16. Added Power diagram page.

17. Added Block diagramm.

18. Addes series terminators R50-55 to avoid ringing effect.

19. PGOOD connected to S1-1 DIP Switch and pulled-up by resistor R56 to 3.3V.

20. Added a pull-up resistor R57 on RESIN. Not all 4x5 modules have internal pull-up for this pin on the module.

21. Added mechanical components:

      - Screw M3x6 (2 pcs.); 

      - Standoff M3x10;

      - U2 - TE0790-03 XMOD FTDI JTAG Adapter;

      - J14 - J18 -  Jumpers 2,54mm Pitch.

Changes

#13 Removed track-it traceability pad S/N. (???)

Type: Schematic Change

Reason: EOL of Component.

Impact: None.

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Changes

#1 Changed DCDC EN6347QI (U1) to MPM3860GQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Minor changes in electrical characteristics.

#1 Changed DCDC EN5311QI (U3) to MPM3834CGPA-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Minor changes in electrical characteristics.

#3 Changed load switch TPS27081ADDCR (Q1) to MP5077GG-Z and adapted circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#7 Changed SD Card connector (J4) from 504077-1891 to 104031-0811.

Type: Schematic Change

Reason: EOL of Component.

Impact: Mechanical component size increased.

#13 Changed ETH PHY (U6) power supply to use internal LDOs.

Type: Schematic Change

Reason: Follow Marvell recommendation.

Impact: None.

#13 Added ESD protection diode (D1, D2) for USB.

Type: Schematic Change

Reason: ESD Protection.

Impact: None. Added ESD protection.

#10 Added series resistor (R27) for ETH PHY clock signal.

Type: Schematic Change

Reason: Improve signal integrity.

Impact: None.

#10 Added series termination resistor (R50 ... R55) for SDIO signals.

Type: Schematic Change

Reason: Improve signal integrity.

Impact: None.

#10 Added pull-up resistor (R57) to signal "RESIN".

Type: Schematic Change

Reason: Harmonize "RESIN" signal handling.

Impact: None. Module internal pull-up resistor for signal "RESIN" is not needed anymore.

#10 Connected signal "PGOOD" to DIP switch S1 and pulled it up to voltage rail 3.3V via resistor (R56).

Type: Schematic Change

Reason: (???)

Impact: PGOOD signal can be modified with DIP switch S1.

#11 Changed inductor (L3, L5) from BKP0603HS121-T to MPZ0603S121HT000.

Type: BOM Change

Reason:EOL of component.

Impact: None.

#11 Changed pin header (J9)

Type: BOM Change

Reason:EOL of component. (What is the reason? Component is not EOL, or?)

Impact: None.

#11 Changed pin header (J10 ... J13)

Type: BOM Change

Reason:(What is the reason? Component is not EOL, or?)

Impact: None.

#71 Added testpoint (TP1 ... TP9).

Type: Schematic Change

Reason: Voltage and system monitoring improvement.

Impact: None.

#13 Renamed power rail name from "VCCIOC" to "VCCIOD".

Type: Schematic Change

Reason: Use AMD boot mode name convention. Follow Trenz module connection table.

Impact: None.

#13 Renamed power rail name from "VCCIOB" to "VCCIOC".

Type: Schematic Change

Reason: Use latest component dataAMD boot mode name convention. Follow Trenz module connection table.

Impact: None.

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#1 Added XMOD (U2) and mechanical components.

Type: BOM Schematic Change

Reason: EOL of componentBOM Optimization.

Impact: None.

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#1 Added jumper (J14 ... J18).

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. 

#13 Removed track-it traceability pad S/N. (???)

Type: Schematic Change

Reason: EOL of Component.

Impact: None.

#15 Updated components from library.

Type: Schematic Change

Reason: Use latest component data.

Impact: None.

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#80 Added legal notices, power and block diagram. Updated revision history. Updated page count and order. 

Type: Documentation Update

Reason:  Documentation improvement.

Impact: None.

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Method of Identification

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