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Reason: EOL of Component.

Impact: Reduced Increased eMMC memory density from 16 4 GByte to 8 GByte. Increased operating temperature range from (-25 °C - +85 °C) to (-40 °C - +85 °C). Changed package from 169 ball WFBGA to 153 ball BGA.

#11 Restructered PCIe clock system tree. Differential clock (signals "CLK0_N" and "CLK0_P") coming from connector (J2) is distributed via new added fanout buffer NB3L202KMN (U56) to PCIe connector (J11) (signals "PCI_REF_P" and "PCI_REF_N") and B2B connector (J2) (signals "B505_CLK0_P" and "B505_CLK0_N"). Removed clock oscillator DSC1123CI2-100.0000T (U6).

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