Page History

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Impact: Power supply selection option 1.25 V removed. Increased output current capability. Minor changes in electrical characteristics.

#3 Changed DCDC EN6347QI (U19) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#4 Changed DCDCs 171050601 (U22, U26, U29) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Minor changes in electrical characteristics.

#5 Changed DCDC 171050601 (U18) to MPM3683GMN-10 and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#6 Changed DCDCs EN5311QI (U28, U43) to MP2164GG-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#7 Changed load switch TPS27082LDDCR (Q1, Q2, Q3) to MP5077GG-Z and adapted circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Minor changes in electrical characteristics.

#8 Changed battery power supply circuit architecture. Changed LDO LDO (U37) from TPS780180300 from TPS780180300 to TPS7A0212PDBVR and diode (D16) from SDMG0340LC-7-F to BAS70-05W. Added capacitor (C278), resistor (R269), and assembly option (default: not fitted) resistor (R270). 

Type: Schematic Change

Reason: Follow AMD recommendation.

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Impact: FireFly using custom firmware needs to be adapted by customer.

#10 Changed eMMC (U2) from MTFC4GACAJCN-4M IT to SDINBDG4-8G-XI2.

Type: Schematic change

Reason: EOL of Component.

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Impact: None. Clock revision changed.

#14 Changed power supply for SFP+ connector (J14) from power rail "3.3V_PCI" to power rail "3.3V_PER".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#15 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Resistors were not fitted on previous revision.

#16 Changed pull-up resistor voltage for resistor (R18, R21, R86, R87, R113 ... R115, R121 ... R123).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

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Reason: Improve ESD protection.

Impact: None.

#22 Changed Fan F455B-05LD (M1) to Fan MF40060V2-1000U-A99 (MP1) and updated according mechanical screws, nuts, crimp contacts, and housing (JX1).

Type: BOM change

Reason:  EOL of Component.

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Reason:EOL of component.

Impact: None.

#36 Changed 33 nF capacitor (C192) from 50 V, 0603 to 25 V, 0402.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#37 Changed capacitor (C121 ... C124, C179, C182, C185, C221 ... C223) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow AMD recommendation.

Impact: None.

#38 Changed capacitor (C197, C200, C202, C203) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow SATA recommendation.

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Reason: Harmonize with TEBF0818 series.

Impact: None.

#54 Changed pull-up resistor (R18, R21, R86, R87, R113, R114, R115, R121 ... R123) from 4.99 kOhm to 7.5 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

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Reason: Set HDMI Hot Plug level properly.

Impact: None.

#56 Changed resistor (R65) from 8.06 kOhm to 1 kOhm.

Type: Schematic Change

Reason: Enable OTG capability.

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Reason: Improve signal integrity for FireFly connector (J6, J21).

Impact: None.

#60 Set Set LDO TPS79901DRV (U47) and LDO related components,   ferrid bead (L20), capacitor (C127) and resistor (R181)   to not fitted.

Type: Schematic Change

Reason:  BOM Optimization.

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Reason: Harmonize with TEBF0818 series.

Impact: None.

#66 Added testpoint (TP14, TP16, TP17, TP20 ... TP25).

Type: Schematic Change

Reason: Signal monitoring improvement.

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Reason: Improve signal integrity.

Impact: None.

#70 Updated PCB rules, PCB layout, and PCB layerstack.

Type: PCB Change

Reason: Improve board quality.

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