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- Xilinx Zynq XC7Z010 SoC
- Dual-core ARM A9+ (TE0722-02-07S-1C variant has single-core ARM A9+)
- 16 MByte QSPI Flash
- Micro SD Card socket with card detect signal
- 34 I/Os on DIP40 header pins
- System status LED (DONE)
- RGB LED connected to PL I/O
- Green user LED connected to ARM CPU GPIO
- Proximity and ambient light sensor
- DIP40 form factor (size 18 x 51 mm)
...
Figure 3: TE0722-02 PCB bottom side.
- Xilinx ZYNQ Zynq XC7Z010 or SoC, U1
- Micro SD card socket with card detect, J8
- Red LED, D3
- Green LED, D2
- Red LED, D6
- 20-pin connector placeholder, P1
- Red LED, D5
- Proximity/ambient light sensor, U4
- RGB LED, D4
- Red LED, D1
- 20-pin connector placeholder, P2
- Ultra-low supply-current voltage monitor, U4
- 2 x 5-pin connector placeholder, J1
- 2 x 5-pin connector placeholder, J2
- 2 x 5-pin connector placeholder, J3
- 16 MByte QSPI Flash memory, U5
- Low power programmable oscillator @ 33.333333 MHz, U8
- 1A PowerSoC DC-DC converter (1.0V), U2
- 1A PowerSoC DC-DC converter (1.8V), U3
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Storage device name | Content | Notes |
---|
QSPI Quad SPI Flash | Empty | |
Table 1: .
Boot Process
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Variants Currently in Production
Module Variant | Zynq SoC | ARM Cores | Operating Temperature | Temperature Range |
---|
TE0722-02I | XC7Z010-1CLG225I |
---|
Dual-core ARM Cortex-A9 | –40°C to +85°C | Industrial |
TE0722-02 | XC7Z010-1CLG225I |
---|
Dual-core ARM Cortex-A9 | 0°C to +70°C | Commercial |
TE0722-02-07S-1C | XC7Z007S-1CLG225C |
---|
Single-core ARM Cortex-A9 | 0°C to +70°C | Commercial |
Table 8: Module variants.
Technical Specifications
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