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Refer to "https://shop.trenz-electronic.de/de/Download/?path=Trenz_Electronic/TE0722/REV02/Documents" for downloadable version of this manual and additional technical documentation of the product. |
The Trenz Electronic TE0722-02 is a DIPFORTy1 "Soft Propeller" based on the Xilinx ZYNQ-7000 SoC.
Block Diagram
Main Components
- Xilinx ZYNQ XC7Z010 SoC, U1
- Micro SD card socket with card detect, J8
- Red LED, D3
- Green LED, D2
- Red LED, D6
- 20-pin connector placeholder, P1
- Red LED, D5
- Proximity/ambient light sensor, U4
- RGB LED, D4
- Red LED, D1
- 20-pin connector placeholder, P2
- Ultra-low supply-current voltage monitor, U4
- 2 x 5-pin connector placeholder, J1
- 2 x 5-pin connector placeholder, J2
- 2 x 5-pin connector placeholder, J3
- 16 MByte QSPI Flash memory, U5
- Low power programmable oscillator @ 33.333333 MHz, U8
- 1A PowerSoC DC-DC converter (1.0V), U2
- 1A PowerSoC DC-DC converter (1.8V), U3
Key Features
- Xilinx ZYNQ XC7Z010 SoC
- 16 MByte QSPI Flash
- Dual core ARM A9+
- Micro SD Card socket with card detect signal
- DIP40 form factor (size 18 x 51 mm)
- 34 I/Os on DIP40 header pins
- System status LED (DONE)
- RGB LED connected to PL I/O
- Green user LED connected to ARM CPU GPIO
- Proximity and ambient light sensor
Additional assembly options are available for cost or performance optimization upon request.
Initial Delivery State
Storage device name | Content | Notes |
|---|---|---|
QSPI Flash | Empty |
Signals, Interfaces and Pins
I/O Signals
List of signals between PL banks and external connectors:
| Bank | Type | Connector | I/O Signal Count | Voltage | Notes |
|---|---|---|---|---|---|
| 34 | HR | P1 | 8 | 3.3 | P0 - P7 |
| 34 | HR | P2 | 8 | 3.3 | P24 - P31 |
| 34 | HR | P2 | 10, 5 LVDS pairs | 3.3 | |
| 34 | HR | J1 | 6 | 3.3 | X2A - X2F |
| 34 | HR | J2 | 2 | 3.3 | |
| 34 | HR | J3 | 4 | 3.3 | X1A - X1D |
| 35 | HR | P1 | 8, 4 LVDS pairs | 3.3 |
JTAG Interface
JTAG access to the Xilinx ZYNQ XC7Z010 SoC is provided through J2 connector.
JTAG Signal | J2 Connector Pin |
|---|---|
| TCK | 4 |
| TDI | 9 |
| TDO | 10 |
| TMS | 8 |
LEDs
| LED | Color | Connected To | Description and Notes |
|---|---|---|---|
| D1 | Red | LED2, U4 | |
| D2 | Green | MIO7, U1 | User controlled, default OFF (when PS7 has not been booted). |
| D3 | Red | LED1, U4 | |
| D4 | RGB | RGB_R, U1 RGB_G, U1 RGB_B, U1 | |
| D5 | Red | LED3, U4 | |
D6 | Green | DONE, U1 | Reflects inverted DONE signal. ON when FPGA is not configured, OFF as soon as PL is configured. |
Default PS MIO Mapping
| MIO | Function | Connector Pin | Notes |
|---|---|---|---|
| 0 | - | - | - |
| 1 | QSPI | - | SPI Flash-CS |
| 2 | QSPI | - | SPI Flash-DQ0 |
| 3 | QSPI | - | SPI Flash-DQ1 |
| 4 | QSPI | - | SPI Flash-DQ2 |
| 5 | QSPI | - | SPI Flash-DQ3 |
| 6 | QSPI | - | SPI Flash-SCK |
| 7 | GPIO | - | Green LED D2 |
| 8 | - | - | - |
| 9 | - | - | - |
| 28 | SD CARD | J8-5 | CLK |
| 29 | SD CARD | J8-3 | CMD |
| 30 | SD CARD | J8-7 | DAT0 |
| 31 | SD CARD | J8-8 | DAT1 |
| 32 | SD CARD | J8-1 | DAT2 |
| 33 | SD CARD | J8-2 | CD/DAT3 |
| 36 | I2C | - | SCL |
| 37 | I2C | - | SDA |
| 39 | GPIO | - | Si1143 INT pin |
| 49 | SD CARD | J8-G4 | Card detect switch |
I2C Interface
On-board I2C interface is provided via ZYNQ SoC PS bank 501 pins MIO36 (SCL) and MIO37 (SDA). I2C addresses for on-board devices are listed in the table below:
| I2C Device | I2C Address | Notes |
|---|---|---|
| Si1143-A11-GMR | 0x5A | Proximity and ambient light sensor. |
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
VIN supply voltage | -0.5 | 3.6 | V | Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics". |
Storage temperature | -40 | +85 | °C | Silicon Labs Si1141/42/43 datasheet. |
Recommended Operating Conditions
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| Supply voltage | 1.14 | 3.465 | V | Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics". |
| Note |
|---|
| Assembly variants for higher storage temperature range are available on request. |
Physical Dimensions
Module size: 18 mm × 51 mm. Please download the assembly diagram for exact numbers.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 4 mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Industrial grade: -40°C to +85°C.
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Weight
... g - Plain module
... g - Set of bolts and nuts
Revision History
Hardware Revision History
| Date | Revision | Notes | PCN | Documentation Link |
|---|---|---|---|---|
| 2015-10-23 | 02 | TE0722-02 | ||
01 |
|
Hardware revision number is printed on the PCB board together with the module model number separated by the dash.
Document Change History
Date | Revision | Contributors | Description |
|---|---|---|---|
| 2017-02-09 | Jan Kumann | Initial document. |
Disclaimer
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|---|---|---|---|---|
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