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Refer to https://shopwiki.trenz-electronic.de/de/Download/?path=Trenz_Electronicdisplay/PD/TE0713+TRM for the downloadableonline version of this manual and the rest of available documentation.
 

Trenz Electronic TE0713 is an industrial-grade FPGA module integrating Xilinx Artix-7 FPGA, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. All this on a tiny footprint, smaller than a credit card size at very competitive price. All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.

Block Diagram

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Main Components

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Key Features

  • Xilinx Artix-7 (15T to 200T) SoM (System on Module)series FPGA
  • Both industrial and commercial temperature ranges available
  • Rugged for high shock and high vibration resistance
  • 1 GByte DDR3L 32-bit SDRAM
  • 32 MByte QSPI Flash memory (with XiP support)
  • USB 3.0 to FIFO interface bridge
  • Programmable clock quad generator
    • GTP transceiver clock (default 125 MHz)
    • Fabric clock (default 200 MHz)
  • Plug-on module with 2 × 100-pin and 1 × 60-pin high-speed hermaphroditic strips
  • 152 FPGA I/Os (75 differential pairs) available via B2B connectors
  • 4 GTP (multi Gigabit transceiver) lanes 
  • External clock input for GTP transceivers via B2B connector
  • On-board high-efficiency DC-DC converters
  • System management and power sequencing
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • User configurable LED
  • Evenly-spread supply pins for good signal integrity

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

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Main Components

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  1. Xilinx Artix-7 XC7A series FPGA, U1
  2. 32 MByte QSPI Flash memory, U4
  3. 30.000 MHz quartz crystal, Y1
  4. System Controller CPLD, Lattice Semiconductor MachXO2-256HC, U3
  5. Green LED (SYSLED1), D1
  6. 4 Gbit DDR3L 256M x 16 SDRAM, U15
  7. Altera Enpirion 12A PowerSoC DC-DC converter, U14
  8. Silicon Labs programmable quad clock generator, U2
  9. SiTime low-power programmable oscillator @ 25.000000 MHz, U9
  10. 4 Gbit DDR3L 256M x 16 SDRAM, U19
  11. Samtec Razor Beam™ LSHM-150 B2B connector, JM1
  12. Samtec Razor Beam™ LSHM-150 B2B connector, JM2
  13. Samtec Razor Beam™ LSHM-130 B2B connector, JM3
  14. FTDI USB 3.0 to FIFO interface bridge, U11
  15. Texas Instruments 3A step-down converter (DDR_PWR), U7
  16. Texas Instruments 3A step-down converter (1.8V), U5
  17. Texas Instruments 3A step-down converter (1.2V_MGT), U8
  18. Texas Instruments 3A step-down converter (1V_MGT), U6
  19. Texas Instruments PFET load switch, Q1

Initial Delivery State

Programmable unit

Content

Notes

Xilinx Artix-7 FPGANot programmedU1
System Controller CPLDProgrammedU3
SPI Flash OTP areaEmptyU4

SPI Flash main array

EmptyU4
SPI Flash Quad Enable bitSetU4

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JTAGEN pin in B2B connector JM1 is used to select JTAG access for FPGA or SC System Controller CPLD:

JTAGENJTAG Access To
LowArtix-7 FPGA
HighSystem Controller CPLD

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System Controller I/O Pins

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Pin NameModeFunctionDefault Configuration
PGOODOutputPower goodActive high when all on-module power supplies are working properly.
JTAGENInputJTAG selectLow for normal operation, high for System Controller CPLD access.
EN1InputPower EnableWhen forced low, pulls POR_B low to emulate power on reset.
NOSEQ-No functionNot used.
MODE-No functionNot used.

On-board LEDs

The TE0713-01 module has one LED which is connected to the System Controller CPLD. Once FPGA configuration has completed, it can be used by the user's design. 

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On-board Si5338 clock generator chip is used to generate clocks with 25 MHz oscillator connected to the pin IN3 as input reference. There is a I2C I2C bus connection between the FPGA bank 14 (master) and clock generator chip (slave) which can be used to program output frequencies. See the reference design for more information.

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System Controller CPLD (Lattice Semiconductor MachXO2-256HC, U3) is used to control FPGA configuration process. The FPGA is held in reset (by driving the PROG_B signal low) until all power supplies have stabilized.

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User can create their own System Controller design using Lattice Diamond software. Once created it can be programmed into CPLD via JTAG interface.

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DDR3L SDRAM

The TE0713-01 SoM has two 4 Gbit volatile DDR3 SDRAM ICs (U15 and U19) for storing user application code and data.

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See Xilinx datasheet DS181 - "Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics" for additional information. User should also check related baseboard documentation when choosing baseboard design for TE0713 module.

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Power Rails

Power Rail Name

B2B Connector JM1 Pin

B2B Connector JM2 Pin

Direction

Notes

VIN

1, 3, 52, 4, 6, 8InputSoM supply voltage (from the baseboard).
3.3VIN13, 15-InputSoM supply voltage (from the baseboard).
DDR_PWR-19OutputModule internal supply of 1.35V level.
1V---Module internal supply of 1V level.
1V_MGT---Module internal supply of 1V for bank 216 transceivers.
1.2V_MGT---Module internal supply of 1.2V for bank 216 transceivers.

1.8V

39-Output

Module internal 1.8V level. Maximum 300mA available.

3.3V-10, 12OutputModule internal 3.3V level.
VCCIO13-1, 3Input

High-Range bank supply voltage (from the baseboard).

VCCIO15-7, 9InputHigh-Range bank supply voltage (from the baseboard).
VCCIO169, 11-InputHigh-Range bank supply voltage (from the baseboard).
VREF_JTAG-91OutputJTAG reference voltage (3.3V).

Board to Board Connectors

Include Page
IN:Samtec LSHM
IN:Samtec LSHM

Variants Currently In Production

Module Variant

FPGA

Junction Temperature

Temperature Range
TE0713-01-100-2CXC7A100T-2FGG484C0°C to 85°CCommercial grade
TE0713-01-200-2CXC7A200T-2FBG484C0°C to 85°CCommercial grade

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

  
-0.37.0

V

 
See EN63A0QI and TPS82085 datasheets.
3.3VIN supply
voltage  V Storage temperature (ambient)
voltage-0.53.75VSee LCMXO2-256HC datasheet.
HR I/O banks supply voltage (VCCO)-0.53.6
VXilinx datasheet DS181
HR I/O banks input voltage-0.4VCCO + 0.55VXilinx datasheet DS181
GTP transceivers Tx/Rx input voltage-0.51.26VXilinx datasheet DS181

Storage temperature

-55

100

°C

See IM4G16D3FABG
See IM4G16D3FABG datasheet.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
VIN supply voltage
  
2.56.0V
 
See TPS82085 datasheet.
3.3VIN supply
voltage  V 
voltage2.3753.6VSee LCMXO2-256HC datasheet.
HR I/O banks supply voltage (VCCO)1.143.465VXilinx datasheet DS181
HR I/O banks input voltage-0.20VCCO + 0.2VXilinx datasheet DS181

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Note
Assembly variants for higher storage temperature range are available on request.

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Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.
  • Mating height with standard connectors: 8mm
  • PCB thickness: 1.6mm
  • Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

All dimensions are shown in millimeters.

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Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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Weight

21 g Plain module.

8.8 g Set of nuts and bolts.

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Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Document Change History

Date

Revision

Contributors

Description

2017-05-28
Jan Kumann

Absolute and recommended ratings added.

Main components section improved. New top PCB image.

Power rails section improved.

New physical dimensions images.

2017-02-07

V1

Jan KumannInitial document.

Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices