Page History

Overview

Refer to https://wiki.trenz-electronic.de/display/PD/TE0713+TRM for the online version of this manual and the rest of available documentation.

Trenz Electronic TE0713 is an industrial-grade FPGA module integrating Xilinx Artix-7 FPGA, USB 3.0 to FIFO bridge, 1 GByte of DDR3L SDRAM, 32 MByte Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips. All this on a tiny footprint, smaller than a credit card size at very competitive price. All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.

Key Features

• Xilinx Artix-7 (15T to 200T) series FPGA
• Both industrial and commercial temperature ranges available
• Rugged for high shock and high vibration resistance
  
• 1 GByte DDR3L 32-bit SDRAM
• 32 MByte QSPI Flash memory (with XiP support)
• USB 3.0 to FIFO interface bridge
  
• Programmable clock quad generator
  • GTP transceiver clock (default 125 MHz)
    
  • Fabric clock (default 200 MHz)
    
• Plug-on module with 2 × 100-pin and 1 × 60-pin high-speed hermaphroditic strips
• 152 FPGA I/Os (75 differential pairs) available via B2B connectors
• 4 GTP (multi Gigabit transceiver) lanes 
• External clock input for GTP transceivers via B2B connector
• On-board high-efficiency DC-DC converters
  
• System management and power sequencing
• eFUSE bit-stream encryption
• AES bit-stream encryption
• User configurable LED

• Evenly-spread supply pins for good signal integrity

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Main Components

1. Xilinx Artix-7 XC7A series FPGA, U1
2. 32 MByte QSPI Flash memory, U4
3. 30.000 MHz quartz crystal, Y1
4. System Controller CPLD, Lattice Semiconductor MachXO2-256HC, U3
5. Green LED (SYSLED1), D1
6. 4 Gbit DDR3L 256M x 16 SDRAM, U15
7. Altera Enpirion 12A PowerSoC DC-DC converter, U14
8. Silicon Labs programmable quad clock generator, U2
9. SiTime low-power programmable oscillator @ 25.000000 MHz, U9
10. 4 Gbit DDR3L 256M x 16 SDRAM, U19
11. Samtec Razor Beam™ LSHM-150 B2B connector, JM1
12. Samtec Razor Beam™ LSHM-150 B2B connector, JM2
13. Samtec Razor Beam™ LSHM-130 B2B connector, JM3
14. FTDI USB 3.0 to FIFO interface bridge, U11
15. Texas Instruments 3A step-down converter (DDR_PWR), U7
16. Texas Instruments 3A step-down converter (1.8V), U5
17. Texas Instruments 3A step-down converter (1.2V_MGT), U8
18. Texas Instruments 3A step-down converter (1V_MGT), U6
19. Texas Instruments PFET load switch, Q1

Initial Delivery State

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGA banks and I/O signals connected to the B2B connectors:

JTAG Interface

JTAG access to the Xilinx Artix-7 FPGA and System Controller CPLD devices is provided through B2B connector JM2.

JTAGEN pin in B2B connector JM1 is used to select JTAG access for FPGA or System Controller CPLD:

System Controller I/O Pins

Special purpose pins are connected to System Controller CPLD and have following default configuration:

On-board LEDs

The TE0713-01 module has one LED which is connected to the System Controller CPLD. Once FPGA configuration has completed, it can be used by the user's design. 

Clocking

On-board Si5338 clock generator chip is used to generate clocks with 25 MHz oscillator connected to the pin IN3 as input reference. There is a I²C bus connection between the FPGA bank 14 (master) and clock generator chip (slave) which can be used to program output frequencies. See the reference design for more information.

On-board Peripherals

32 MByte Quad SPI Flash Memory

On-board QSPI flash memory S25FL256S (U14) is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

System Controller CPLD

System Controller CPLD (Lattice Semiconductor MachXO2-256HC, U3) is used to control FPGA configuration process. The FPGA is held in reset (by driving the PROG_B signal low) until all power supplies have stabilized.

By driving signal RESIN to low you can reset the FPGA. This signal can be driven from the user’s baseboard PCB via the B2B connector JM2 pin 18.

Input EN1 is also gated to FPGA reset, should be open or pulled up for normal operation. By driving EN1 low, on-board DC-DC converters will be not turned off.

User can create their own System Controller design using Lattice Diamond software. Once created it can be programmed into CPLD via JTAG interface.

DDR3L SDRAM

The TE0713-01 SoM has two 4 Gbit volatile DDR3 SDRAM ICs (U15 and U19) for storing user application code and data.

• Part number: IM4G16D3FABG-125I
• Supply voltage: 1.35V
• Organization: 32M words x 16 bits x 8 banks
• Memory speed: limited by Xilinx Artix-7 speed grade and MIG

 Configuration of the DDR3 memory controller in the FPGA should be done using the MIG tool in the Xilinx Vivado Design Suite IP catalog.

USB 3.0 to FIFO Bridge

TE0713-01 is equipped with the FTDI FT600Q high performance USB 3.0-to-FIFO interface bridge chip.

Power and Power-On Sequence

Power Supply

Single 3.3V power supply (for both VIN and 3.3VIN power rails) with minimum current capability of 3A for system startup is recommended.

Power Consumption

Typical module power consumption is between 2-3W. Exact power consumption is to be determined.

TE0713-01 module can also be powered by split 5V/3.3V power sources if preferred. In such case apply 5V to B2B connectors VIN pins and 3.3V to 3.3VIN pins, although lowest power consumption is achieved when powering the module from single 3.3V supply. When using split 5V/3.3V supplies the power consumption (and heat dissipation) will rise due to the DC-DC converter efficiency (it decreases when VIN/VOUT ratio rises).

Power-On Sequence

For the highest efficiency of the on-board DC-DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

It is important that all baseboard I/Os are 3-stated at power-on until System Controller sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10 and 12, meaning that all on-module voltages have become stable and module is properly powered up.

See Xilinx datasheet DS181 - "Artix-7 FPGAs Data Sheet: DC and AC Switching Characteristics" for additional information. User should also check related baseboard documentation when choosing baseboard design for TE0713 module.

Power Rails

Board to Board Connectors

Variants Currently In Production

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

• Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.
• Mating height with standard connectors: 8mm
• PCB thickness: 1.6mm
• Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

All dimensions are shown in millimeters.

Weight

21 g Plain module.

8.8 g Set of nuts and bolts.

Revision History

Hardware Revision History

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Document Change History

Disclaimer