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Affected Product

Replacement
TE0600-03-72C11-ATE0600-04-72C11-A
TE0600-03-72C21-ATE0600-04-72C21-A
TE0600-03-52I11-ATE0600-04-52I11-A
TE0600-03-83I21-ATE0600-04-83I21-A
TE0600-03-52I11-MTE0600-04-52I11-M
TE0600-03-83I11-ATE0600-04-83I11-A
TE0600-03-83C21-A (???)TE0600-04-83C21-A
TE0600-03-52I11-W (nicht produziert) ???EOL
TE0600-03-52I11-C (nicht produziert, müsste S-Variante sein) ???EOLTE0600-03IC ???

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Changes

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#1 Changed DCDC EN6347QI (U2) to MPM3860GQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

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Impact: None. Minor changes in electrical characteristics.

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#3 Changed LDO LP3878SD-ADJ (U4, U14) to TPS74601PBDRVT and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

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#4 Assembled clock SiT8008BI-73-XXS-100.000000E (U12).

Type: BOM Change

Reason: ??? System clock improvement.

Impact: ???

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 Add additional system clock.

#5 Inserted internal pull-up IO resistor option for FPGA via external resistor (R83).

Type: Schematic Change

Reason:  ImprovementIncrease flexibility.

Impact: None. Default is as previous revision.

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#6 Improve led (D1) driving circuit via adding MOSFET (T1) and resistor (R84) and changed 120 Ohm resistor (R36) to 240 Ohm.

Type: Schematic Change

Reason: Improve led circuit.

Impact: None.

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#7 Changed 2.2 kOhm resistor (R29) to 100 Ohm.

Type: BOM Change

Reason: Follow AMD recommendation.

Impact: None.

#1 Changed leds (D1, D5) from 150060VS75000 to SML-P11MTT86.

Type: Schematic Change

Reason: BOM optimization.

Impact: None.

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#9 Changed diode (D3) from BAT54VV,115 to two separated diodes (D2, D3) BAT54A,215.

Type: Schematic Change

Reason: BOM optimization.

Impact: None.

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#10 Changed 2.2 kOhm resistors (R56, R57, R58) to 2.4 kOhm.

Type: BOM Change

Reason: Follow AMD recommendation.

Impact: None.

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#11 Pulled-down board revision signal "BR0" (FPGA U5, pin P17) and updated board revision documentation.

Type: Schematic Change

Reason: Update revision information.

Impact: None. Firmware reflects it but custom firmware Custom design needs to be updated by customer in cases where board revision signals are used.

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#12 Added testpoints (TP11...TP14, TP23...TP28).

Type: PCB Change

Reason: Improve voltage and system monitoring.

Impact: None.

#13 Changed fiducials to standard fiducial type.

Type: Schematic Change

Reason: Use standard fiducials.

Impact: None.

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#14 Changed stacked vias to staggered vias.

Type: PCB Change

Reason: Reliability improvement.

Impact: Reliablity improvement.

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#15 Signal trace lengths changed.

Type: PCB change

Reason: Result of changes above.

Impact: Changed trace length have to be taken into account in existing designs.

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#16 Updated B2B documentation.

Type: Documentation Update

Reason: Documentation improvementImprovement.

Impact: None.

#17 Renamed document sheets.

Type: Documentation Update

Reason: Documentation improvementImprovement.

Impact: None.

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#18 Updated legal notices, revision history, block and power diagram. Updated page count and order. 

Type: Documentation Update

Reason: Documentation improvementImprovement.

Impact: None.

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Method of Identification

The revision number is visible on the top side of the PCB.

Image Added


Production Shipment Schedule

From XXXXXAugust 2024, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.

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