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Scroll Title
anchorTable_OBP
titleOn board peripherals

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Chip/InterfaceDesignatorNotes
FTDIU1
LEDsD1...D5
Push ButtonsS1-S2
EEPROMU3
Oscillator
U4-U8


EEPROM

There is an EEPROM IC, U3 provided for storing the FTDI (U1) configuration.

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anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM

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MIO PinI2C AddressDesignatorNotes





Push Buttons

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titleOn-board Push Buttons

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DesignatorSchematicConnected toFunctionalityNote
S1M_RESETB2B, J11ResetUser LEDS
S2ButtonBUTTONUser ButtonPower Status LED


LEDs

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titleOn-board LEDs

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DesignatorColorConnected toActive LevelNote
D1...D4GreenB2B, J11Active HighUser LEDS
D5Green5VINActive HighPower Status LED
D6RedPG_DCDCActive Low


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Power supply with minimum current capability of xx 2 A for system startup is recommended.

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Voltage
Scroll Title
anchorTable_PWR_PR
titleModule power rails.

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Scroll Title
anchorTable_PWR_BV
titleZynq SoC bank voltages.
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Bank          

Schematic Name
Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

Bank Voltages

Notes

























Board to Board Connectors

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titlePS absolute maximum ratings

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V
SymbolsDescriptionMinMaxUnit
VINInput Supply Voltage-5+5VV
T_STGStorage Temperature-55160°C


Recommended Operating Conditions

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Scroll Title
anchorTable_TS_ROC
titleRecommended operating conditions.

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See Xilinx ???? datasheet.
ParameterMinMaxUnitsReference Document
VINV4.065.58See ???? datasheets.VSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.°Cthe carrier datasheets.
T_OPT-4585°C


Physical Dimensions

  • Module size: 115 mm × 70 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 5 mm.

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