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Scroll Title
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titleOn board peripherals

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Chip/InterfaceDesignatorNotes

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

















EEPROM

Scroll Title
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titleQuad SPI I2C EEPROM interface MIOs and pins

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MIO PinSchematicU?? PinNotes

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U? Pin
Scroll Title
anchorTable_OBP_RTCI2C_EEPROM
titleI2C interface MIOs and pinsaddress for EEPROM

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MIO Pin
Schematic
I2C AddressDesignatorNotes





LEDs

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anchorTable_OBP_I2C_RTCLED
titleI2C Address for RTC
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MIO PinI2C AddressDesignatorNotes

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On-board LEDs

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Scroll Title
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titleI2C EEPROM interface MIOs and pins

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MIO PinSchematicU?? PinNotes
Scroll Title
anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM
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MIO PinI2C AddressDesignatorNotes

LEDs

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anchorTable_OBP_LED
titleOn-board LEDs

false
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DesignatorColorConnected toActive LevelNote

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DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

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Ethernet

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titleEthernet PHY to Zynq SoC connections

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U?? Pin Signal NameConnected toSignal DescriptionNote







































































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Scroll Title
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titleOsillators

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DesignatorDescriptionFrequencyNote
U4MEMS Oscillator12 MHz
U8MEMS Oscillator30 MHz
KHz


Programmable Clock Generator

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Scroll Title
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titlePower Consumption

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Power Input PinTypical Current
VIN5VTBD*


* TBD - To Be Determined

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titlePower Sequency


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draw.io Diagram
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Voltage Monitor Circuit

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Scroll Title
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titleVoltage Monitor Circuit
Scroll Ignore

Create DrawIO object here: Attention if you copy from other page, objects are only linked.

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image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed


Power Rails

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titleModule power rails.

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

























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Scroll Title
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titlePS absolute maximum ratings

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V
SymbolsDescriptionMinMaxUnitVMinMaxUnitVVV




V




V




V











Recommended Operating Conditions

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Scroll Title
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titleRecommended operating conditions.

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ParameterMinMaxUnitsReference Document



VSee ???? datasheets.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.



VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.V



See Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.



°CSee Xilinx ???? datasheet.


Physical Dimensions

  • Module size: ?? 115 mm × ?? 70 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? mm.

PCB thickness: ?? 1.7 mm.

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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleHardware Revision History

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DateRevisionChangesDocumentation Link
2020-05-20RV01REV01Initial Release---


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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