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  1. PMod 2x6 Peripheral Header, J2
  2. PMod 2x6 Peripheral Header, J1
  3. Power Regulators, U1-U7
  4. Hall Effect Linear Current Sensor, U
  5. Current Sensors,
  6. ARK500-2 screw connector, J2
  7. ARK500-3 screw connector, J3
  8. Analog Digital Converter,

Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector typ (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier us only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Connectors

...

anchorTEP0002 pinout
titleText
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Connectors


J1 connector

PIN numberdescription
1PWM CH0
2PWM CH1
3PWM CH2
4not in use
5GND
6VCC
7EN CH0
8EN CH1
9EN CH2
10not in use
11GND
12VCC

J2 connector

PIN numberdescription
1ADC CH
2ADC SCK
3ADC CS
4Sensor fault
5GND
6VCC
7ADC DO0
8ADC DO1
9ADC DO2
10ADC DO3
11GND
12VCC

J3 J1 connector

PIN numberdescription
1PWM CH0DRV CH2
2PWM DRV CH1
3PWM CH2
4not in use
5GND
6VCC
7EN CH0
8EN CH1
9EN CH2
10not in use
11GND
12VCC

J2 connector

...

J3 connector

...

J4 connector

...

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Ethernet PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

ADC

ADS7947SRTER is 12bit analog to digital converter. It has 2 analog inputs. It operates at 2M sample rate (max sampling rate 2.1M).  

Current sensor

ACS711KEXLT-15AB-T is a precise Hall effect linerar AC and DC current sensor. It is specially meant for sensing low currents. 

Power and Power-On Sequence

Power Consumption

Power Distribution Dependencies

...

anchorFigure_PWR_PD
titlePower Distribution
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DRV CH0

J4 connector

PIN numberdescription
1DC IN
2GND

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


Scroll Title
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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

Quad SPI Flash



EEPROM


System Controller CPLD











Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.


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titleBoot process.

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MODE Signal State

Boot Mode








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titleReset process.

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Signal

B2BI/ONote










Signals, Interfaces and Pins

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hiddentrue
idComments

Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

Scroll Title
anchorTable_SIP_B2B
titleGeneral PL I/O to B2B connectors information

Power-On Sequence

...

anchorFigure_PWR_PS
titlePower Sequency
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Absolute Maximum Ratings

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titleModule absolute maximum ratings.

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ParameterFPGA BankMinMaxUnitsReference DocumentStorage temperature-55150oC

...

B2B ConnectorI/O Signal CountVoltage LevelNotes
































JTAG Interface

JTAG access to the TExxxx SoM through B2B connector JMX.

NB! Depending on switching frequency and load, additional cooling might be needed!
Scroll Title
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titleRecommended Operating Conditions.JTAG pins connection

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Parameter

JTAG Signal

Min

B2B Connector

Max
TMS
Units

TDI
Reference Document

TDO
RemarksInput voltage036VInput current015

A

Motor phase peak current015AOperating temperature*-4060oCdepends on power dissipation

...


TCK


JTAG_EN


MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



Scroll Title
anchorFigureTable_TSOBP_PDMIOs
titlePhysical dimensions drawingMIOs pins

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MIO PinConnected toB2BNotes






































On-board Peripherals

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hiddentrue
idComments

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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idComments

Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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titleOn board peripherals

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Chip/InterfaceDesignatorNotes
















Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.


Scroll Title
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titleQuad SPI interface MIOs and pins

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MIO PinSchematicU?? PinNotes


























RTC

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anchorTable_OBP_RTC
titleI2C interface MIOs and pins

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MIO PinSchematicU? PinNotes










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titleI2C Address for RTC

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MIO PinI2C AddressDesignatorNotes






EEPROM

Scroll Title
anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins

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MIO PinSchematicU?? PinNotes










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anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM

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MIO PinI2C AddressDesignatorNotes





LEDs

Scroll Title
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titleOn-board LEDs

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DesignatorColorConnected toActive LevelNote
















DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

Scroll Title
anchorTable_OBP_ETH
titleEthernet PHY to Zynq SoC connections

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BankSignal NameETH1ETH2Signal Description







































































CAN Transceiver

Scroll Title
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titleCAN Tranciever interface MIOs

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BankSchematicU?? PinNotes

D-Tx
Driver Input

R-Rx
Reciever Output



Clock Sources

Scroll Title
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titleOsillators

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DesignatorDescriptionFrequencyNote


MHz


MHz


KHz





Power and Power-On Sequence

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hiddentrue
idComments

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

Scroll Title
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titlePower Consumption

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Power Input PinTypical Current
VINTBD*


* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution


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Power-On Sequence

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titlePower Sequency


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Voltage Monitor Circuit

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titleVoltage Monitor Circuit


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Power Rails

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titleModule power rails.

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

























Bank Voltages

Scroll Title
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titleZynq SoC bank voltages.

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Bank          

Schematic Name

Voltage

Notes






























Board to Board Connectors

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hiddentrue
idComments
  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

    Include Page
    PD:6 x 6 SoM LSHM B2B Connectors
    PD:6 x 6 SoM LSHM B2B Connectors

? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

  • 3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)

    Operating Temperature: -??°C ~ ??°C
    Current Rating: ??A per ContactNumber of Positions: ??
    Number of Rows: ??

Technical Specifications

Absolute Maximum Ratings

Scroll Title
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titlePS absolute maximum ratings

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SymbolsDescriptionMinMaxUnit




V




V




V




V




V




V




V




V











Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Scroll Title
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titleRecommended operating conditions.

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ParameterMinMaxUnitsReference Document



VSee ???? datasheets.



VSee Xilinx ???? datasheet.



VSee Xilinx ???? datasheet.



VSee Xilinx ???? datasheet.



VSee Xilinx ???? datasheet.



VSee Xilinx ???? datasheet.



VSee Xilinx ???? datasheet.



°CSee Xilinx ???? datasheet.



°CSee Xilinx ???? datasheet.


Physical Dimensions

  • Module size: ?? mm × ?? mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? mm.

PCB thickness: ?? mm.

Page properties
hiddentrue
idComments

In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



Scroll Title
anchorFigure_TS_PD
titlePhysical Dimension


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Currently Offered Variants 

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hiddentrue
idComments

Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

    ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

    DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

For Baseboards or modules, where no overview page is available (and revision number is coded in the direct link) use shop search link, e.g. TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

   DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706


Scroll Title
anchorTable_VCP_SO
titleTrenz Electronic Shop Overview

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Trenz shop TEP0002 overview page
English pageGerman page


Revision History

Hardware Revision History

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hiddentrue
idComments

Set correct links to download  arrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

  • Date format:  YYYY-MM-DD
  • Dimension 40 x 40 mm

  • Dimension including connectors 47,7 x 40 mm

  • Thickness 1.59 mm


Scroll Title
anchorTable_VCPRH_SOHRH
titleTrenz Electronic Shop Overview Hardware Revision History

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Trenz shop TEP0002 overview page
English pageGerman page

Revision History

Hardware Revision History

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anchorTable_RH_HRH
titleHardware Revision History

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anchorFigure_RH_HRN
titleHardware Revision Number

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DateRevisionChangesDocumentation Link
2017-03-09REV01
REV01
2018-02-27REV02
REV02
2019-04-23REV03
REV03


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Scroll Title
anchorFigure_RV_HRN
titleBoard hardware revision number.


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Document Change History

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    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports

...

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titleDocument change history.

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DateRevisionContributorDescription

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