Page History

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Reason: Improve Layout and support for small BGA cooler with BGA frame clips.

Impact: Package placed 1.5mm 5 mm closer to connector J3.

Note: Due to the changes above the height profile of the module is changed. Using TE0808-05 board as a replacement or in system designed for TE0808-04, review and adaption of mechanics e.g. cooling solutions have to be done.

Method of Identification

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