Page History
| Company | Trenz Electronic Gmbh |
|---|---|
| PCN Number | PCN-20140730 |
| Title | TE0720-01 to TE0720-02 |
| Subject | Trenz Electronic TE0720 SoM (system on module): revision 1 to revision 2 upgrade |
| Issue Date | 20140730 |
Products Affected
This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.
affected product | suggested upgrade |
|---|---|
TE0720-01-* | TE0720-02-* |
Changes
Type
Impact
Reason for change
#1
JTAG only boot mode is now supported
Type: Enhancement
Reason: Enhancement of functionality
Impact: None
#2 Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256
May have to re-evaluate applications
that write to the SPI Flash
Type: Enhancement
Reason: Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado)
W25Q256 is only supported by u-boot, linux and Vivado SDK Programmer
Impact: May have to re-evaluate applications that write to the SPI Flash
#3 Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with TPS51206
Type: BOM change
Reason: TPS51206 was changed due to BOM optimization
Impact: None
#4
Changed MDIO pullup from 10k to 4k7
Type: BOM change
Reason: Avoiding potential problems when PHY management bus is configured at high speeds
Impact: None
#5 Changed eMMC core supply from switched 3.3Vout to 3.3Vin
Type: Schematic change
Reason: eMMC startup timing improvement
Impact: None
#6 MAC EEPROM power changed from 3.3V to 1.8V
Type: Schematic change
Reason: PCB and System Controller optimization
Impact: None
#7
I2C Multiplexing no longer needed (to select between RTC and MEMS), all
I2C devices are on the same bus.
Type: Schematic change
Reason: Change to new type of MEMS with only one I2C
Impact: None (if the old GPIO based I2C mux is used it just has no effect now)
#8
ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS
is no longer assembled in standard assembly variants
Type: BOM change
Reason: ST LSM303DLM MEMS has been discontinued
Impact: None for designs that did not use the MEMS sensor
, please contact us for customized BOM if necessary
#9
Removed test pads on top layer
Type: Layout change
Reason: No longer needed as the System Controller factory programming is done during tests using main B2B Connectors
Impact: None (test pads only used at factory)
| #10 | Enhancement | Increased component clearance from mounting holes on bottom layer |
| None | Decreasing the possibility to damage the module with improper extraction methods | |
| #11 | Enhancement | System Controller in-system programming via B2B JTAG pins |
| None | Enhancement for Factory tests and programming | |
| #12 | Enhancement | JM1 pin 89 has new function that enables System Controller JTAG Chain, no impact for old designs that connect this pin to GND |
| None | Enhancement for Factory tests and programming |
Method of Identification
The model code and revision number (e.g. TE0720-01 or TE0720-02) are printed on the top side of the PCB.
Production Shipment Schedule
From June 2014.
Contact Information
If you have any questions related to this PCN, please contact Trenz Electronic's Technical Support at
- forum.trenz-electronic.de
- wiki.trenz-electronic.de
- support%trenz-electronic.de (subject = PCN-20140730)
phone
national calls: 05223 65301-0
international calls: 0049 5223 65301-0
Disclaimer
Any projected dates in this PCN are based on the most current product information at the time this PCN is being
issued, but they may change due to unforeseen circumstances. For the latest schedule and any other information,
please contact your local Trenz Electronic sales office, technical support or local distributor.
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