Page History
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| Company | Trenz Electronic GmbH |
|---|---|
| PCN Number | PCN-2020080420200806 |
| Title | TE0724-03 to TE0724-04 Hardware Revision Change |
| Subject | Hardware Revision Change |
| Issue Date | 2020-09-04 |
Products Affected
This change affects all Trenz Electronic TE0724 SoMs of revision 03: TE0724-03-*.
Affected Product | Replacement | |
|---|---|---|
| TE0724-03-10-1I | TE0724-04-41I33-A | |
| TE0724-03-20- | *1I | TE0724-04-*61I33-A |
Changes
#1 Replaced I2C pullups by 2K (R20 and R21)
Type: BOM change
Reason: Pullups too weak in similar configurations.
Impact: None.
#2 Connected WP (pin 7) of EEPROM (U10) via R79 GND, added not fitted R72 to 1.8V rail.
Type: Schematic change
Reason: Support different DDR4 chips EEPROM was constantly write protected or had to be patched.
Impact: Support of B-die DDR4 Industrial grade chips
#2 Changed U28 to TPS27081ADDCR, added R93, changed value of C62
Type: Schematic change
EEPORM is not write protected, no patch needed. For enabling write protection R72 can be assembled instead of R79.
#3 Changed C7, C8, C21, C47, C74, C91 from X5R to X7S
Type: BOM change
Reason: This parts were identified as critical for very high ambient temperaturesReason: Former chip not recommended for new designs.
Impact: None. With R93 and changed value of C62 the circuit behaves as before.
#3 Added R89
Type: Schematic change
Parts are specified for up to 125°C and therefore the module can cope better with higher ambient temperatures.
#4 Moved following components away from FPGA: C28, C29, C77, C80, R2, R12, R18, R43, R47, R51, R54, R57, R62, L8, L9.
Type: PCB change
Reason: Request for usage of BGA cooler with clip on mounting frame.
Impact: BGA cooler can now be used without any interferring components. No other impact, all Routing length have been perserved.
#5 Replaced DDR3 from IM4G16D3FABG-125I to IS43TR16256BL-125KBLI
Type: BOM change
Reason: Part is obsolete.
Impact: New DDR timings need to be considered in designs.
#6 Replaced Flash from S25FL256SAGBHI20 to IS25LP512M-RHLE
Type: BOM change
Reason: Ensure long time availability.
Impact: Jedec Manufacturer ID changed from 01h to 9Dh, the device ID from 18h to 19h. 512Mbit flash are now available.
#7 Set S/N to not fitted.
Type: BOM change
Reason: Part is end of life.
Impact: Track it pad no more available.
#8 Added legal notices to Schematic
Type: Documentation change
Reason: Increase awareness of legal usage.
Impact: None.
#9 Full update from Library
Type: PCB change
Reason: Improve production yieldReason: Datasheet recommendation.
Impact: None.
Method of Identification
The revision number is printed on the top and on the bottom side both sides of the PCB.
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Production Shipment Schedule
The new revison 04 is available from Novembre 2020January 2021, after old Stock is gone. If you still need revision 03 please contact us.
Contact Information
If you have any questions related to this PCN, please contact Trenz Electronics Technical Support at
- forum.trenz-electronic.de
- wiki.trenz-electronic.de
- support%trenz-electronic.de (subject = PCN-20200806)
phone
national calls: 05741 3200-0
international calls: 0049 5741 3200-0
Disclaimer
Any projected dates in this PCN are based on the most current product information at the time this PCN is being issued, but they may change due to unforeseen circumstances. For the latest schedule and any other information, please contact your local Trenz Electronic sales office, technical support or local distributor.
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