Page History
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| Company | Trenz Electronic GmbH |
|---|---|
| PCN Number | PCN-20220309 |
| Title | TE0715-04 to TE0715-05 Hardware Revision Change |
| Subject | Hardware Revision Change |
| Issue Date | 2022-03-2014 |
Products Affected
This change affects all Trenz Electronic TE0715 SoMs of revision 04.
Affected Product | Replacement |
|---|---|
| TE0715-04-* | TE0715-05-* |
Changes
#1 Replace EN6347QI (U1) by MPM3840GQV-Z.
Type: Schematic Change
Reason: Enpirion DCDCs are discontinued.
Impact: None.
#2 Replace TPS82085SIL (U2, U3, U8, U24) by MPM3834CGPA.
Type: Schematic Change
Reason: Supply chain optimization.
Impact: None.
#3 Replace TPS27082LDDCR (Q1) by MP5077GG-Z.
Type: Schematic Change
Reason: Supply chain optimization.
Impact: None.
#4 Add power supervisor BD39040MUF (U25).
Type: Schematic Change
Reason: Improved voltage rail supervision.
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Type: Schematic Change
Reason: Monitor or set POR-signal.
Impact: None. If custom CPLD design used, check for compatibility.
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#12 Remove GND connection from FPGA "RSVDGND" pin (U5.G12).
Type: Schematic Change
Reason: Xilinx recommendation.
Impact: None.
#13 Replace
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BKP0603HS121-T (L1, L2, L3, L4, L5, L6, L7, L8, L9, L11) by MPZ0603S121HT000.
Type: Schematic Change
Reason: Ferrite beads are discontinued.
Impact: None.
#14 Change decoupling capacitor (C9, C30) from net "1.8V" at
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pin U5 bank 501 to net "1V".
Type: Schematic Change
Reason: Decoupling improvement for "1V" voltage rail.
Impact: None.
#15 Remove decoupling capacitor (C12) for net "1.8V" at
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pin U5 bank 501.
Type: Schematic Change
Reason: Decoupling improvementXilinx decoupling recommendation.
Impact: None. Designator changed.
#16 Add decoupling capacitor (C50, C51, C88, C89, C108, C118) for net "1V".
Type: Schematic Change
Reason: Decoupling improvement for "1V" voltage rail.
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#17 Change decoupling capacitor (C21, C144) for VCCPLL.
Type: Schematic Change
Reason: Decoupling improvement for VCCPLL.
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#18 Add/Change decoupling capacitor (C107, C128) for VCCAUX and VCCPAUX.
Type: Schematic Change
Reason: Decoupling improvement for VCCAUX and VCCPAUX.
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#19 Add decoupling capacitor (C128) for AVDD3.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
#20 Change decoupling capacitor (C136, C142, C139, C145) for net DDR_PWR.
Type: Schematic Change
Reason: Decoupling improvement for VCCPLL.
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#21 Add/Change decoupling capacitor (C50, C51, C86, C88, C89, C108, C118) for VCCBRAM.
Type: Schematic Change
Reason: Decoupling improvement for VCCBRAM.
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#22 Add input capacitor (C153, C154) for DCDC U4.
Type: Schematic Change
Reason: Decoupling improvement for VDDQSNS and VDD.
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Impact: None. Physical dimension changed.
#24
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Type: PCB Change
Reason: DCDCs with new footprints need to be used.
Impact: None.
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LIB update.
Type: SCH and PCB Change
Reason: Update schematic symbols and footprints to latest versionImprove production yield.
Impact: None.
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#25 Change PCB layout of Samtec B2B signals.
Type: PCB Change
Reason: Result of this PCN changes.
Impact: The length of the tracks has been changed. Pinout of Samtec B2B connectors is not affected. Changed trace length has to be taken into account in existing designs. The trace length for new revision are added to the 4x5 series pinout generator. Please, check if change in trace length still matches your requirements. Adaption of carrier may be necessary.
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#26 Change schematic documentation.
Type: DOC Change
Reason: Documentation optimization.
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