Page History
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Company | Trenz Electronic GmbH |
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PCN Number | PCN-20240610 |
Title | TE0727-02 to TE0727-04 Hardware Revision Change |
Subject | Hardware Revision Change |
Issue Date | 2024-08-0126 |
Products Affected
This change affects all Trenz Electronic TE0727 SoMs: TE0727-02*.
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Impact: None. Minor changes in electrical characteristics.
#2 Changed flash (U5) from S25FL127SABMFV10 to S25FL128LAGMFI013.
Type: BOM change
Reason: EOL of Component.
Impact: None, no changes in our 2023.2 reference design are necessary. JEDEC manufacturer is still the same. Modified device Modified device IDs and temperature grade from -40° C - 105 °C to -40 °C - 85 °C.
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Reason:BOM Optimization.
Impact: None.
#13 Renamed signal name from "SPI-DQ0/M0" to "SPI-DQ0/M3"
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Type: Schematic Change
Reason: Use AMD boot mode name convention.
Impact: None.
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and signal name from "SPI-DQ3/M3" to "SPI-DQ3/M0".
Type: Schematic Change
Reason: Use AMD boot mode name convention.
Impact: None.
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#14 Added pull-up resistor assembly option (R140) (default: not fitted) for signal "DDR3-CKE".
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#15 Added optional connection between FTDI chip (U3) signal ADBUS0 and signal ADBUS4 via resistor (R63) (default: not fitted).
Type: Schematic Change
Reason: Improve JTAG usage.
Impact: None.
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#16 Added additional decoupling capacitors C52, C53, C73.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#17 Changed capacitor (C55, C56) from 470 nF, 0201 to 47 µF, 0603.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#18 Changed capacitor (C51) from 470 nF, 0201 to 10 µF, 0402.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#19 Changed capacitor (C1, C4, C12, C15, C18, C19, C24, C35, C57, C63, C65, C79, C81, C87, C89) from 4.7 µF to 10 µF.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#20 Changed 10 µF capacitor (C13, C25) from 10 %, 0805 to 20 %, 0402.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
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#21 Changed capacitor (C29, C32, C33, C41, C42, C43, C44, C47) from 10 µF, 0402 to 22 µF, 0603.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
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#22 Changed capacitor (C86) from 10 µF to 47 µF.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#23 Changed capacitor (C85) from 10 µF, 10 V, 10 %, 0805 to 47 µF, 6.3 V, 20 %, 0603.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
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#24 Changed 47 µF capacitor (C7, C16, C54, C71, C93) from 0805 to 0603.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
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#25 Changed testpoint (TP1, TP3, TP5, TP7) from 1 mm to 0.8 mm diameter.
Type: PCB Change
Reason: Harmonize testpoints.
Impact: None.
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#26 Added block and power diagram. Updated legal notices and revision history.
Type: Documentation Update
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