Page History

major

Issuer

Trenz Electronic GmbH

Place

Bünde, Germany, EU

Products Affected

This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.

Description of Change

Changes

#1

JTAG only boot mode

is now supported

enhancement: added support for MIO to JTAG special mux (for efuse programming)

enhancement: added i2c mux for internal i2c bus to MIO10/MIO11 .

Type: Enhancement

Reason: Enhancement of functionality

Impact: None

#2 Winbond W25Q256FV

SPI Flash memory replaced with Spansion

S25FL256

Type: Enhancement

Reason: Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado) W25Q256 is only supported by u-boot, Linux and Vivado SDK Programmer

Impact: May have to re-evaluate applications that write to the SPI Flash

#3

Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with

TPS51206

Type: BOM change

Reason: TPS51206 was changed due to BOM optimization

Impact: None

#4 Changed MDIO pullup from 10k to 4k7

Type: BOM change

: changed

Reason: Avoiding potential problems when PHY management bus is configured at high speeds

Impact: None

#5 Changed eMMC core supply from switched

3.3Vout to 3.3Vin

Type: Schematic change

Reason: eMMC startup timing improvement

Impact: None

#6 MAC EEPROM power changed from 3.3V to 1.8V

Type: Schematic change

Reason: PCB and System Controller optimization

Impact: None

#7 I2C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus.

Type: Schematic change

Reason: Change to new type of MEMS with only one I2C

Impact: None (if the old GPIO based I2C mux is used it just has no effect now)

#8

ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled

in standard assembly variants

Type: BOM change

Reason: ST LSM303DLM MEMS has been discontinued

Impact: None for designs that did not use the MEMS sensor, please contact us for customized BOM if necessary

#9 Removed test pads on top layer

Type: Layout change

Reason: No longer needed as the System Controller factory programming is done during tests using main B2B Connectors

Impact: None (test pads only used at factory)

#10 Increased component clearance from mounting holes on bottom layer

Type: Enhancement

Reason: Decreasing the possibility to damage the module with improper extraction methods

Impact: None

#11 System Controller in-system programming via B2B JTAG pins

Type: Enhancement

Reason: Enhancement for Factory tests and programming

Impact: None

#12 JM1 pin 89 has new function that enables System Controller JTAG Chain no impact for old designs that connect this pin to GND

Type: Enhancement

Reason: Enhancement for Factory tests and programming

Impact: None

Reason for Change

1. Spansion XXX quad SPI Flash memory is better supported by Xilinx design tools. than the Winbond one.
2. Sink/Source DDR Termination Regulator is smaller and cheaper than Texas Instruments TPS51200.
3. ST LSM303DLM MEMS has been discontinued.

Application Impact

Proposed Countermeasures

Method of Identification

The model code and revision number (e.g. TE0720-01 or TE0720-0102) are printed on the top or bottom side of the PCB.

Production Shipment Schedule

From June 2014.

Contact Information

If you have any questions related to this PCN, please contact Trenz Electronic's Technical Support at

• forum.trenz-electronic.de
• wiki.trenz-electronic.de
• support%trenz-electronic.de (subject = PCN-yyyymmaa20140730)

• phone

  • national calls: 05223 65301-0

  • international calls: +49 0049 5223 65301-0

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being
issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information,
please contact your local Trenz Electronic sales office, technical support or local distributor.