Page History

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Impact: Power supplies are separated. It is not possible to supply the board simultaneously with both connectors (J20, J25) at the same time. It is not possible to supply one connector and draw power from the other connector.

#2 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: Power supply selection option 1.25 V removed. Increased output current capability. Minor changes in electrical characteristics.

#3 Changed DCDC EN6347QI (U19) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#4 Changed DCDCs 171050601 (U22, U26, U29) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Minor changes in electrical characteristics.

#5 Changed DCDC 171050601 (U18) to MPM3683GMN-10 and adapted power circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#6 Changed DCDCs EN5311QI (U28, U43) to MP2164GG-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#7 Changed load switch TPS27082LDDCR (Q1, Q2, Q3) to MP5077GG-Z and adapted circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Minor changes in electrical characteristics.

#8 Changed battery power supply circuit architecture. Changed LDO LDO (U37) from TPS780180300 from TPS780180300 to TPS7A0212PDBVR and diode (D16) from SDMG0340LC-7-F to BAS70-05W. Added capacitor (C278), resistor (R269), and assembly option (default: not fitted) resistor (R270). 

Type: Schematic Change

Reason: Follow AMD recommendation.

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Impact: FireFly using custom firmware needs to be adapted by customer.

#10 Changed eMMC (U2) from MTFC4GACAJCN-4M IT to SDINBDG4-8G-XI2.

Type: Schematic change

Reason: EOL of Component.

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Impact: None. Clock revision changed.

#14 Changed power supply for SFP+ connector (J14) from power rail "3.3V_PCI" to power rail "3.3V_PER".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#15 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Resistors were not fitted on previous revision.

#16 Changed pull-up resistor voltage for resistor (R18, R21, R86, R87, R113 ... R115, R121 ... R123).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

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Reason: Improve ESD protection.

Impact: None.

#22 Changed Fan F455B-05LD (M1) to Fan MF40060V2-1000U-A99 (MP1) and updated according mechanical screws, nuts, crimp contacts, and housing (JX1).

Type: BOM change

Reason:  EOL of Component.

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Reason:EOL of component.

Impact: None.

#36 Changed 33 nF capacitor (C192) from 50 V, 0603 to 25 V, 0402.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#37 Changed capacitor (C121 ... C124, C179, C182, C185, C221 ... C223) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow AMD recommendation.

Impact: None.

#38 Changed capacitor (C197, C200, C202, C203) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow SATA recommendation.

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Reason: Harmonize with TEBF0818 series.

Impact: None.

#54 Changed pull-up resistor (R18, R21, R86, R87, R113, R114, R115, R121 ... R123) from 4.99 kOhm to 7.5 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

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Reason: Set HDMI Hot Plug level properly.

Impact: None.

#56 Changed resistor (R65) from 8.06 kOhm to 1 kOhm.

Type: Schematic Change

Reason: Enable OTG capability.

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Reason: Improve signal integrity for FireFly connector (J6, J21).

Impact: None.

#60 Set Set LDO TPS79901DRV (U47) and LDO related components,   ferrid bead (L20), capacitor (C127) and resistor (R181)   to not fitted.

Type: Schematic Change

Reason:  BOM Optimization.

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Reason: Harmonize with TEBF0818 series.

Impact: None.

#66 Added testpoint (TP14, TP16, TP17, TP20 ... TP25).

Type: Schematic Change

Reason: Signal monitoring improvement.

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Reason: Improve signal integrity.

Impact: None.

#70 Updated PCB rules, PCB layout, and PCB layerstack.

Type: PCB Change

Reason: Improve board quality.

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