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Overview

The Trenz Electronic TE0xxx-xx ... is an industrial-grade ... module ... based on Xilinx ...TEMB0005 is a carrier for the module TEM00005. The carrier is equipped with a LAN socket, a FTDI JTAG/UART to USB2.0 solution, three low speed and one high speed CRUVI B2B Connectors, a PMod Connector.

Refer to http://trenz.org/tec0850temb0005-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • <Replace for module use "SoC/FPGA" for Carrier "Modules">
    • ...TEM0005
  • RAM/Storage
    • ...2KB EEPROM
  • On Board
    • ...
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
  • Notes
    • ...

Block Diagram

    • FT2232H FTDI
    • 4x User LEDs
    • 2x Push Buttons
    • 2x MEMS Oscillators
  • Interface
    • 1x Samtec Razor Beam (SS5) B2B Connector
    • 1x Samtec Razor Beam (SS4) High Speed CRUVI Connector
    • 3x Samtec Low Speed CRUVI Connectors
    • 1x PMod SMD (2x6) Connector
    • 1x SMD Header (1x6)
    • 1x RJ45 LAN Socket
    • 1x Micro USB2.0 Connector
  • Power
    • 5V Input Power Supply 
  • Dimension
    • 115 x 70 mm
  • Notes


Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTExxxx TEMB0005 block diagram


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draw.io Diagram
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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleTExxxx TEMB0005 main components


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  1. ...
  2. ...
  3. ...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module
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  1. SMD Header 6x1, J3
  2. RJ45 LAN Socket, J1
  3. B2B Connector, J11
  4. Barrel Jack, J4
  5. Green LEDs, D1...4
  6. User Push Button, S2
  7. PMod 2x6 SMD Host Socket, J9
  8. FT2232H FTDI, U1
  9. Reset Push Button, S1
  10. Micro USB2.0 Socket, J2
  11. Red LED (PG_DCDC), D8
  12. Green LED (5VIN), D5
  13. High Speed CRUVI Connectors, J5
  14. Low Speed CRUVI Connectors, J8
  15. Low Speed CRUVI Connectors, J7
  16. Low Speed CRUVI Connectors, J6

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


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Storage device name

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Content

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Notes

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Quad SPI Flash

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Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.
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titleBoot process.Initial delivery state of programmable devices on the module

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Storage device name

Content

Notes

EEPROMProgrammedFTDI Confirguration


Configuration Signals

MODE Signal State
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Comments
  • Overview of Boot Mode, Reset, Enables.


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titleReset process.

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Signal

B2BI/OConnected toNote

Signals, Interfaces and Pins

M_RESETJ11- 11Push Button, S1Module Reset
EN_VADJJ11-110DCDC, U6pull-down, input from module
SEL_VADJJ11-108DCDC, U6

pull-up, input from module.
'low' → 1.8V,
'high'→ 2.5V


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:The carrier TEMB0005 is equipped with a Samtec (SS4) B2B Connector. More information in the following table.

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titleGeneral PL I/O to B2B connectors information

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FPGA Bank
Designators
B2B Connector
InterfaceI/O Signal Count
Voltage Level
Connected toNotes

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J11






JTAG

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4x Single EndedFTDI, U1
MSIOD24x Single Ended, 12x Differential PairsCRUVI B2B, J5A0...5, B0...5 (N/P)
MSIO/GPIO8x Single EndedCRUVI B2B, J6A_X0...7
MSIO8x Single EndedCRUVI B2B, J7B_X0...7
MSIO/GPIO8x Single EndedCRUVI B2B, J8C_X0...7
LEDs (2x MSIO, 2x MSIO/GPIO)4x Single EndedD1...4LED1...4
MSIO8x Single EndedPmod Header, J9
Push Button1x Single EndedPush Button, S1M_RESET
Push Button1x Single EndedPush Button, S2pull-up, User Button
MSIO/GPIO/I2C2x Single EndedCRUVI B2B J6I2C
ETH

2x Differential Pairs

2x Single Ended

RJ45 Socket, J1

RJ45 LEDs, J1


Yellow and Green LEDs

UART2x Single EndedFTDI, U1UART RX/TX
FTDI I/O2x Single EndedFTDI, U1BDBUS2-BDBUS3
CLK

1x Single Ended

Oscillator, U8

30 MHz

MSIOD

4x Single Ended

CRUVI B2B, J5

RESET, HSIO, HSO, HSI

IO (3x MSIO, 4x MSIO/GPIO, 2x MSIO GPIO/I2C)9x Single EndedCRUVI B2B, J5
Power Signal1x Single Ended

RED LED, D8


PG_DCDC
SC_SPI4x Single Endedpin header, J3SC_CLK, SC_SDO, SC_SDI, SC_SS
GOLDEN1x Single EndedTestpoint, TP1GOLDEN
JTAGSEL1x Single EndedTestpoint, TP2JTAGSEL


CRUVI B2B Connectors

The TEMB0005 is equipped with three Low Speed Connectors J6...8 and a High Speed Connector J5. These connectors are provided for CRUVI extension cards. More information is provided in the  B2B Connectors section.

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titleJTAG pins connection

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JTAG Signal

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B2B Connector

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MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

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SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

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titleMIOs pins

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Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

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Signal
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titleTest Points InformationCRUVI B2B connectors information

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SpeedDesignatorsSchematic
Test Point
Connected toNotes

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

LowJ6A_X0...1B2B, J11alternative GPIO

A_X2...5B2B, J11alternative SPI

A_X6...7B2B, J11alternative I2C0 SDA/SCL
J7B_X0...7|B2B, J11
J8C_X0...7B2B, J11alternative GPIO
HighJ5A0...A5 (N/P)B2B, J11HS I/O
B0...B5 (N/P)B2B, J11HS I/O
HSIO, HI, HO, RESETB2B, J11HS I/O single ended

SMB_ALERT, SMB_SDA, SMB_SCL, MODE, REFCLK

B2B, J11
DI,DO,SCK,SELB2B, J11alternative GPIO


USB2.0 Socket

There is a USB2.0 Socket, J2 provided in order to use JTAG/UART via FTDI, U1.

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titleUSB2.0 Socket information

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titleOn board peripherals

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Pin SchematicConnected to
Chip/Interface
Notes

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins
IDN.CN.C
D+DL_PFTDI, U1Through Line Filter, L1
D-DL_NFTDI, U1Through Line Filter, L1
VbusVBUSDiode, U2


RJ45 LAN Socket

There is a RJ45 Ethernet LAN Socket, J1 connected to B2B, J11 via 2x channels data receive and transmit.

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Notes
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titleI2C interface MIOs and pinsRJ45 LAN Socket information

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MIO PinSchematicU? Pin
Pin SchematicConnected toNotes
TD+ETH1_TX_PB2B, J11
TD-ETH1_TX_NB2B, J11
RD+ETH1_RX_PB2B, J11
RD-ETH1_RX_NB2B, J11
Green LEDETH1_LED0B2B, J11Link/Activity indicator
Yellow LEDETH1_LED1B2B, J11Speed indicator