Page History

major

Issuer

Trenz Electronic GmbH

Place

Bünde, Germany, EU

Products Affected

This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.

Description of Change

Changes

#1

JTAG only boot mode is now supported

Type: Enhancement

Reason: Enhancement of functionality

Impact: None

#2

Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256

Type: Enhancement

Reason: Spansion S25FL256 is supported by current Xilinx design tools (ISE14.

7, Vivado) W25Q256 is only supported by u-boot, Linux and Vivado SDK Programmer

Impact: May have to re-evaluate applications that write to the SPI Flash

#3 Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with TPS51206

Type: BOM change

Reason: TPS51206 was changed due to BOM optimization

Impact: None

#4 Changed MDIO pullup from 10k to 4k7

Type: BOM change

: changed

Reason: Avoiding potential problems when PHY management bus is configured at high speeds

Impact: None

#5 Changed eMMC core supply from switched 3.3Vout to 3.3Vin

Type: Schematic change

Reason: eMMC startup timing improvement

Impact: None

#6 MAC EEPROM power changed from 3.3V to 1.8V

Type: Schematic change

Reason: PCB and System Controller optimization

Impact: None

#7 I2C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus.

Type: Schematic change

Reason: Change to new type of MEMS with only one I2C

Impact: None (if the old GPIO based I2C mux is used it just has no effect now)

#8 ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled in standard assembly variants

Type: BOM change

Reason: ST LSM303DLM MEMS has been discontinued

Impact: None for designs that did not use the MEMS sensor, please contact us for customized BOM if necessary

#9 Removed test pads on top layer

Type: Layout change

Reason: No longer needed as the System Controller factory programming is done during tests using main B2B Connectors

Impact: None (test pads only used at factory)

#10 Increased component clearance from mounting holes on bottom layer

Type: Enhancement

Reason: Decreasing the possibility to damage the module with improper extraction methods

Impact: None

#11

System Controller in-system programming via B2B JTAG pins

Type: Enhancement

Reason: Enhancement for Factory tests and programming

Impact: None

#12 JM1 pin 89 has new function that enables System Controller JTAG Chain

no impact for old designs that connect this pin to GND

Type: Enhancement

Reason

for Change

Enhancement of functionality.

Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado) W25Q256 is only supported by u-boot, linux and Vivado SDK Programmer.

TPS51206 was changed due to BOM optimization.

Avoiding potential problems when PHY management bus is configured at high speeds. 

eMMC startup timing improvement.

PCB and System Controller optimization.

Change to new type of MEMS with only one I2C.

ST LSM303DLM MEMS has been discontinued.

no longer needed as the System Controller factory programming is done during tests using main B2B Connectors.

decreasing the possibility to damage the module with using improper extraction methods.

enhancement

: Enhancement for Factory tests and programming

.enhancement for Factory tests and programming. 

Application Impact

1. none
2. May have to re-evaluate applications that write to the SPI Flash
3. none
4. none
5. none
6. none
7. none (if the old GPIO based I2C mux was used it just has no effect now)
8. none for designs that did not use the MEMS sensor
9. none (test pads only used at factory)
10. none
11. none
12. none

Proposed Countermeasures

Impact: None

Method of Identification

The model code and revision number (e.g. TE0720-01 or TE0720-02) are printed on the top side of the PCB.