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CompanyTrenz Electronic GmbH
PCN NumberPCN-20240621
TitleTE0821-01 to TE0821-02 Hardware Revision Change
SubjectHardware Revision Change
Issue Date

2024-07-0122

Products Affected

This change affects all Trenz Electronic TE0821 SoMs: TE0821-01*.

Affected Product

Changes

Replacement
TE0821-01-3BE21MA#1, #3 ... #?#30TE0821-02-3BE81MA
TE0821-01-3BE21MC#1, #3 ... #?#30TE0821-02-3BE81MC
TE0821-01-3BE21ML#1, #3 ... #?#30TE0821-02-3BE81ML
TE0821-01-3BI21MA#1, #3 ... #?#30TE0821-02-3BI81MA
TE0821-01-4DE31ML#2 ... #?#30TE0821-02-4DE91ML
TE0821-01-2AE31PA#2 ... #?#30TE0821-02-2AE91PA
TE0821-01-3AE31PA#2 ... #?#30TE0821-02-3AE91PA
TE0821-01-3BI91ND#3 ... #?#30TE0821-02-3BI91ND

ED: Tablle ist fertig!

Changes

#1 Changed DDR4 SDRAM (U2, U3) from K4A8G165WB-BIRC to K4A8G165WC-BITDTCV.

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Impact:  DDR timing needs to be considered in customer design. Trenz Reference Design reflects it without changing timing but custom firmware needs to be checked and eventually updated by customer.

#2 Changed DDR4 SDRAM (U2, U3) from K4AAG165WB-MCRC0CV to MT40A1G16TB-062E IT:F, set termination resistor (R94) from fitted to not fitted, and

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changed resistor (R68, R69) from 240 Ohm to 0 Ohm.

Type: BOM change

Reason: BOM Optimization.

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Impact: Module reset, enable, and power-up handling is modified. That means that "EN" signal from B2B connector enables DCDC U5 and DCDC U12 and can be monitored by CPLD U21 pin 27 (assembly option) (backward compatible mode with assembled resistor R113 and signal "EN" as enable input), or that signal "EN" Two different options are possible: (1) Standard option: Signal "EN" only enables DCDC U5 and DCDC U12 and CPLD U21 pin 27 is connected to signal "POR_B" via voltage translator T2; (normal mode). Normal mode is standard. 2) Backwards compatible option: "EN" signal from B2B connector enables DCDC U5 and DCDC U12 and can be monitored by CPLD U21 pin 27; Therefore, please, verify that the module meets your requierements.

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Type: Schematic Change

Reason: Orientate towards Follow (more closely) AMD recommended power sequence.

Impact: Customer system power sequencing needs to be checked/adapted according to new module power sequencing Sequence of external (B2B) available power rails is not changed. A slightly enlarged time constant between "EN" high and power up of 1.8V rail could be observed.

#4.1 Enable DCDC (U12) via net "EN".

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Type: Schematic Change

Reason: EOL of Component.

Impact: None. Minor changes in electrical characteristics.

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Impact: Improved power monitoring circuit by supervising additional voltage rails. If monitored voltages are out of range signal "PG_ALL" is triggereddeasserted.

#9 Removed pull-up resistor (R82) from signal "MR".

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Reason: Use internal pull-up resistor.

Impact: None.

#10

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Added capacitor (C143) for signal "MR".

Type: Schematic Change

Reason: Improve noise immunity.

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Reason: Enable DDR4 test improvement.

Impact: None.

#13

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Connected unused SoC (U1) bank 64 IO pins and VCCO pins together to net "GND".

Type: Schematic Change

Reason: Improvement ESD protection.

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Type: Schematic Change

Reason: Improvement Add feature to allow "POR_OVERRIDE" state changeassembly options with POR Override "high".

Impact: None. Assembly option with power override possible.

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Reason: Improved SPI interface usage with different flashs.

Impact: None.

#17

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Added additional decoupling capacitor (C144, C178, C186

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... C189).

Type: Schematic Change

Reason: Improve power supply decoupling.

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Reason: BOM Optimization.

Impact: None.

#19 Changed capacitor (C12

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... C16, C45, C49, C52, C53, C57) from 4.7 µF, 6.3 V, to 10 µF, 10 V.

Type: Schematic Change

Reason: AMD recommendation.

Impact: None.

#20 Changed 10 µF capacitor (C2,

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C18, C20, C22, C37, C41, C48, C82, C89,

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C92, C94,

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 C95, C107, C130, C132, C134) from 16 V, 0603 to 10 V, 0402.

Type: Schematic Change

Reason: BOM Optimization.

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Reason: AMD recommendation.

Impact: None.

#23 Changed 47 µF capacitor (C24, C25, C27, C33, C34, C88, C96, C110) from 0805 to 0603.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

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#24 Changed ferrid bead (L1

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... L3, L5, L7, L9

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... L12)

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from BKP0603HS121-T to MPZ0603S121HT000.

Type: BOM Change

Reason:EOL of component.

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Reason:BOM Optimization.

Impact: None.

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#26 Changed net names "PG_PS_LP" to "PG_PSLP_INTIO",

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"PS_AVCC" to "PS_MGTRAVCC",

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"PG_AVCC" to "PG_MGTRAVCC",

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"OTG_RCLK" to "OTG_REFCLK",

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"PS_AVTT" to "PS_MGTRAVTT", and

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"PG_DDR" to "PG_DDR1V2".

Type: Schematic Change

Reason: Documentation Improvement 

Impact: None.

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#27 Added testpoints (TP18, TP21

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... TP25).

Type: Schematic Change

Reason:Improve voltage measuring possibilities Voltage and system monitoring improvement.

Impact: None.

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#28 Changed signal trace lengths.

Type: PCB Change

Reason: Result of changes above.

Impact: Changed trace length have to be taken into account in existing designs. The trace length for new revision will be available in TE0821 series pinout generator. Please check if change in trace length still matches your requirements. Adaption of carrier may be necessary.

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#29 Updated "FPGA Speed grade" information table on page "TE0821 - POWER".

Type: Documentation Update

Reason: Documentation Improvement

Impact: None.

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#30 Added power diagram. Updated system overview and revision history. Updated page count and order.

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Type: Documentation Update

Reason: Documentation improvementImprovement.

Impact: None.

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Method of Identification

The revision number is shown on the top side of the PCB.

Image Added

Production Shipment Schedule

From XXXXXFebruary 2025, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.

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Contact Information

If you have any questions related to this PCN, please contact Trenz Electronics Technical Support at

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information, please contact your local Trenz Electronic sales office, technical support or local distributor.

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