Page History
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| Company | Trenz Electronic GmbH |
|---|---|
| PCN Number | PCN-20240610 |
| Title | TE0727-02 to TE0727-04 Hardware Revision Change |
| Subject | Hardware Revision Change |
| Issue Date | 2024-0608-1026 |
Products Affected
This change affects all Trenz Electronic TE0727 SoMs: TE0727-02*.
Affected Product | Replacement |
|---|---|
| TE0727-02-41C34 | TE0727-04-41C34 |
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| 41C38 |
Changes
#1 Changed DCDC EP53A7HQI (U9, U13) / EP53A7LQI (U11, U12) to MPM3834CGPA-Z
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and adapted power circuit.
Type: Schematic Change
Reason: EOL of Component.
Impact: None. Minor changes in electrical characteristics.
#2 Changed flash (U5) from S25FL127SABMFV10 to S25FL128LAGMFI013.
Type: BOM change
Reason: EOL of Component.
Impact: None, no changes in our 2023.2 reference design are necessary. JEDEC manufacturer is still the same. Modified device IDs and temperature grade from -40° C - 105 °C to -40 °C - 85 °C.
#3 Changed I2C MUX PCA9540BGD,125 (U16) to PCA9540BDP,118.
Type: Schematic Change
Reason: EOL of Component.
Impact: None. Changed package.
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#4 Changed MEMS oscillator (U7) from SiT8008AI-73-XXS-12.000000E to SiT8008BI-73-XXS-12.000000E.
Type: Schematic Change
Reason: EOL of Component.
Impact: None. Clock revision changed.
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#5 Changed MEMS oscillator (U14) from SiT8008AI-73-XXS-33.333333E to SiT8008BI-73-XXS-33.333333E.
Type: BOM change
Reason: EOL of Component.
Impact: None. Clock revision changed.
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#6 Changed MEMS oscillator (U15) from SiT8008AI-73-XXS-52.000000E to SiT8008BI-73-XXS-52.000000E
Type: BOM change
Reason: EOL of Component.
Impact: None. Clock revision changed.
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#7 Changed SoC (U1) bank 35 power supply from 1.8 V to 3.3 V.
Type: Schematic Change
Reason: Use specified HDMI voltage levels.
Impact: None.
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#8 Changed power-up sequencing.
Type: Schematic Change
Reason: Improved Improve power-on sequence.
Impact: None. Updated power sequence.
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#9 Changed
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power multiplexer (U10) current limit from 1.24 A to 2.037 A via resistor (R28) change from 100 kOhm to 56 kOhm.
Type: Schematic Change
Reason: Improved power supply. (???)Improve boot-up process.
Impact: None. Increased output current. (???)
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Improved boot-up process.
#10 Added DIP switch (S1) and resistor (R53) to enable JTAG only boot mode.
Type: Schematic Change
Reason: QSPI programming problems with newer Vivado versions.
Impact: None. JTAG boot mode directly accessible. Fix QSPI programming problems with newer Vivado versions according to AR#00002 - QSPI Programming issues.
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#11 Changed ferrid bead (L1 ... L7, L10) from BKP0603HS121-T to MPZ0603S121HT000.
Type: BOM Change
Reason:EOL of component.
Impact: None.
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#12 Changed LED (D1 ... D3) from 150060VS75000 to 19-213/G6C-BM1N2/DT.
Type: Schematic Change
Reason:BOM Optimization.
Impact: None.
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#13 Renamed signal name from "SPI-DQ0/M0" to "SPI-DQ0/M3"
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Type: Schematic Change
Reason: Use AMD boot mode name convention.
Impact: None.
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and signal name from "SPI-DQ3/M3" to "SPI-DQ3/M0".
Type: Schematic Change
Reason: Use AMD boot mode name convention.
Impact: None.
#14 Added pull-up resistor assembly option (
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R140) (default: not fitted) for signal "DDR3-CKE".
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
#15 Added optional connection between FTDI chip (U3) signal ADBUS0 and signal ADBUS4 via resistor (R63) (default: not fitted).
Type: Schematic Change
Reason: Improve JTAG usage.
Impact: None.
#16 Added additional decoupling capacitors C52, C53, C73
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.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#17 Changed capacitor (C55, C56) from 470 nF, 0201 to 47 µF, 0603.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#18 Changed capacitor (C51) from 470 nF, 0201 to 10 µF, 0402.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#19 Changed capacitor (C1, C4, C12, C15, C18, C19, C24, C35, C57, C63, C65, C79, C81, C87, C89) from 4.7 µF to 10 µF.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
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#20 Changed 10 µF capacitor (
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C13, C25) from 10
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%, 0805 to
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20 %, 0402.
Type: Schematic Change
Reason: BOM Optimization. (???)
Impact: None.
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#21 Changed capacitor (C29, C32, C33, C41, C42, C43, C44, C47) from 10 µF, 0402 to 22 µF, 0603.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
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#22 Changed capacitor (C86) from 10 µF to 47 µF.
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
#23 Changed capacitor (C85) from 10 µF, 10 V, 10 %, 0805 to 47 µF, 6.3 V, 20 %, 0603.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
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#24 Changed 47 µF capacitor (C7, C16, C54, C71, C93) from 0805 to 0603.
Type: Schematic Change
Reason: Follow AMD recommendationBOM Optimization.
Impact: None.
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#25 Changed testpoint (TP1, TP3, TP5, TP7) from 1 mm to 0.8 mm diameter.
Type: PCB Change
Reason: Harmonize testpoints.
Impact: None.
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#26 Added block and power diagram. Updated legal notices and revision history.
Type: Documentation Update
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