Page History
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| Company | Trenz Electronic GmbH |
|---|---|
| PCN Number | PCN-20240610 |
| Title | TE0727-02 to TE0727-04 Hardware Revision Change |
| Subject | Hardware Revision Change |
| Issue Date | 2024-0608-1026 |
Products Affected
This change affects all Trenz Electronic TE0727 SoMs: TE0727-02*.
Affected Product | Replacement |
|---|---|
| TE0727-02-41C34 | TE0727-04-41C34 |
ED: Tabelle ist fertig!
| 41C38 |
Changes
#1 Changed DCDC EP53A7HQI (U9, U13) / EP53A7LQI (U11, U12) to MPM3834CGPA-Z and adapted power circuit.
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Impact: None. Minor changes in electrical characteristics.
#2 Changed flash (U5) from S25FL127SABMFV10 to
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S25FL128LAGMFI013.
Type: BOM change
Reason: EOL of Component.
Impact: None, no changes in our 2023.2 reference design are necessary. JEDEC manufacturer and device IDs are is still the same. (???)Modified device IDs and temperature grade from -40° C - 105 °C to -40 °C - 85 °C.
#3 Changed I2C MUX PCA9540BGD,125 (U16) to PCA9540BDP,118.
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Type: Schematic Change
Reason: Improved Improve power-on sequence.
Impact: None. Updated power sequence.
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Type: Schematic Change
Reason: Improved power supply. (???)Improve boot-up process.
Impact: None. Increased output current. (???)Improved boot-up process.
#10 Added DIP switch (S1) and resistor (R53) to enable JTAG only boot mode.
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Reason:BOM Optimization.
Impact: None.
#13 Renamed signal name from "SPI-DQ0/M0" to "SPI-DQ0/M3"
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Type: Schematic Change
Reason: Use AMD boot mode name convention.
Impact: None.
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and signal name from "SPI-DQ3/M3" to "SPI-DQ3/M0".
Type: Schematic Change
Reason: Use AMD boot mode name convention.
Impact: None.
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#14 Added pull-up resistor assembly option (R140) (default: not fitted) for signal "DDR3-CKE".
Type: Schematic Change
Reason: Follow AMD recommendation.
Impact: None.
#15 Added optional connection between FTDI chip (U3) signal ADBUS0 and signal ADBUS4 via resistor (R63) (default: not fitted).
Type: Schematic Change
Reason: Improve JTAG usage.
Impact: None.
#16 Added additional decoupling capacitors C52, C53, C73
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.
Type: Schematic Change
Reason: Follow AMD recommendation.
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Reason: Follow AMD recommendation.
Impact: None.
#20 Changed 10 µF capacitor (C13, C25) from 10 %, 0805 to 20 %, 0402.
Type: Schematic Change
Reason: BOM Optimization.
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Reason: Follow AMD recommendation.
Impact: None.
#23 Changed capacitor (C85) from 10 µF, 10 V, 10 %, 0805 to 47 µF, 6.3 V, 20 %, 0603.
Type: Schematic Change
Reason: BOM Optimization.
Impact: None.
#24 Changed 47 µF capacitor (C7, C16, C54, C71, C93) from 0805 to 0603.
Type: Schematic Change
Reason: Follow AMD recommendationBOM Optimization.
Impact: None.
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#25 Changed testpoint (TP1, TP3, TP5, TP7) from 1 mm to 0.8 mm diameter.
Type: PCB Change
Reason: Harmonize testpoints.
Impact: None.
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#26 Added block and power diagram. Updated legal notices and revision history.
Type: Documentation Update
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