Page History
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ETH1 | ETH2 | SD Card | USB Host | |
---|---|---|---|---|
TE0710 | , 3.3V B16 I/O | |||
TE0711 | , 1.8V B16 I/O | , device only(14) | ||
TE0712 | 100 MBit | , 1.8V B13 I/O | ||
TE0713 | , device only(14) | |||
TE0715-15 | ||||
TE0715-30 (2) | ||||
TE0720 | ||||
TE0741 (4) | , MGTs | |||
TE0820 (2) | (15) | (6) | ||
TE0821 (2) | (15) | (6) | ||
TE0823 (2) | (6) | |||
TE0841 (2)(3) | , MGTs |
- (2) HP IO Banks only support 1.8V
- (3) MGT's Lanes connected to SD-Level shifter: TE0703-06: Leave J11 open; TE0703-05 and before: It's recommended to desolder level shifter.
- (4) MGT's Lanes connected to SD-Level shifter, but module side 1.8V is not connected.
- (6) REV03 select correct SDIO voltage by jumper. REV02 and before: Works, but without carrier board modification out of specification (TE0703 SD Levelshifter powered fix by 1.8V, TE0820 SD MIO-Bank by 3.3V).
- (14) via FTDI FIFO bridge, VBUS Network is default assembled for host usage
- (15) ETH-RXCK is connected via 0Ohm to JB3-31 (R18)and JB3-58 (R19). Usage depends on Module and AMD IP restrictions. For TE0820/TE0821 normally remove R18 to archive better performance.
TEB0707
ETH | SD Card | USB Host | HS CA(15) | HS CB(15) | HS CC(15) | LS CA(16) | User LEDs(17) | USB UART | USB JTAG | |
---|---|---|---|---|---|---|---|---|---|---|
TE0710 | , 3.3V B16 I/O | |||||||||
TE0711 | , 1.8V B16 I/O |
CR0200, CR00202 | ||||||||
TE0712 | 100 MBit | , 1.8V B13 I/O | , some fix 3.3V B14 I/O | |||||||
TE0713 | (19) | |||||||||
TE0715-15 | (3x PL, 3x PS) | |||||||||
TE0715-30 (2) | , max 1.8V | , max 1.8V | (3x PL, 3x PS) | |||||||
TE0720 | (3x PL, 3x PS) | |||||||||
TE0741 (4) | , MGTs | (18) | ||||||||
TE0820 (2) | (6) | , max 1.8V | , max 1.8V | , max 1.8V | (3x PL, 3x PS) | |||||
TE0821 (2) | (6) | , max 1.8V | (3x PL, 3x PS) | |||||||
TE0823 (2) | (6) | , max 1.8V | , max 1.8V | , max 1.8V | (3x PL, 3x PS) | |||||
TE0841 (2)(3) | , MGTs | , max 1.8V | , max 1.8V | (3x PL, 3x PS) |
- (2) HP IO Banks only support 1.8V
- (3) MGT's Lanes connected to SD-Level shifter: TEB0707 - Leave J4 open.
- (4) MGT's Lanes connected to SD-Level shifter, but module side 1.8V is not connected.
- (6) Select correct SDIO voltage by jumper.
- (15) Fix 3.3V signals of CRUVI HS connectors are connected to MAX10 CPLD and can be used firmware dependent (In standard firmware not implemented).
- (16) Signals on CRUVI LS connector are connected to MAX10 CPLD and can be used firmware dependent (In standard firmware 4 input and 4 output).
- (17) LEDs are connected to MAX10 CPLD and can be used firmware dependent (In standard Firmware implemented.)
- (18) Not available on assembly variants with K70T.
- (19) Two diff. pairs connected to FT600 USB3 lanes. Other signals usable.
...
- (12) FMC_VADJ powers VCCIOC connected to power input of Bank 34 VCCO34 on TE0720 needed to start up. In standard Firmware dip S3-2 can be used to switch ON FMC_VADJ without FMC installed.
- (13) FMC_VADJ powers VCCIOC connected to power input of Bank 65 VCCO_65 and VDDO0 of CLK0 on TE0820. In standard Firmware dip S3-2 can be used to switch ON FMC_VADJ without FMC installed. Select VADJ_FMC 1.8V (HP bank)!
- (14) via FTDI FIFO bridge, VBUS Network is default assembled for host usage
TEB2000
ETH | SD Card | USB Host | Reset | User LEDs | USB UART | Debug UART | USB JTAG | |
---|---|---|---|---|---|---|---|---|
TEM0007 |
3rd Party Carrier
Name | Manufacturer | Product Link | Trenz Shop |
---|---|---|---|
EMC2-DP | Sundance | PC/104 OneBank Carrier for SoC Modules | EMC2-DP |
oi110 | Sundance | oi110 – Dual CameraLink | --- |
oi111 | Sundance | oi111 – Dual SDI + Analog Video | --- |
oi115 | Sundance | oi115 – HDMI In / Out | --- |
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