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Table of Contents

Table of Contents

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The Trenz Electronic TE0716 is a commercial-grade* SoM (System on Module) based on Xilinx Zynq-7000 SoC XC7Z020*, with 1GB of DDR3L-1600 SDRAM*, 32MB of SPI flash memory, 10x 12-Bit Low Power SAR ADCs, 512Kb Serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB 2.0 to UART/JTAG Interface (Xilinx License included), and powerful switching-mode power supplies for all on-board voltages. A large number of configurable I/Os are provided via rugged high-speed board-to-board connectors.

Refer to http://trenz.org/te0716-info for the current online version of this manual and other available documentation.

Notes: * standard values but depends on assembly version. Additional assembly options are available for cost or performance optimization upon request.

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  • SoC/FPGA
    • Package: CLG484
    • Device: Xilinx Z-7020
    • Speed: -1 *
    • Temperature: C grade *.
  • RAM/Storage
    • Low Power DDR3 SDRAM on PS
      • Data width: 32bit
      • Size: def. 1GB *
      • Speed: 1600 Mbps **
    • QSPI boot Flash
      • Data width: 4bit
      • size: 32MB *
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48).
    • 512Kb user MAC address serial EEPROM.
  • On Board
    • 10x 12-Bit Low Power SAR ADCs up to 2 MSPS (NCD98011).
    • Low Power Oscillators.
    • Gigabit Ethernet PHY transceiver (Marvell Alaska 88E1512).
    • High-Speed USB 2.0 ULPI transceiver with full OTG support (Microchip USB3320C).
    • Single chip High-Speed USB 2.0 to UART/JTAG Interface (Xilinx License included) (FTDI FT2232H).
    • 2xUser RGB 2x User RGB LEDs (Green), LED FPGA "Done" (Green).
    • 2 x Tactile 2x Tactile Switches (User), 1 x Tactile Switche (Reset).
  • Interface
    • 120 x 120x HR PL I/Os (3 banks).
    • 2x PS MIOs (shared with UART TX/RX ZYNQ-FTDI).
    • 1 Gbps RGMII Ethernet interface.
    • High Speed USB 2.0 ULPI with full OTG support.
    • High Speed USB 2.0 to UART/JTAG interface, including microUSB-B connector.
    • microSD™
    • JTAG

...

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Main Components

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Storage device name

IC Designator

Content

Notes

Quad SPI Flash

U7Empty

-

512Kb Serial EEPROMU21Empty

-

2Kb 24AA025E48 EEPROMU24Pre-programmed globally unique, 48-bit node address (MAC).-
4Kb M93C66-R EEPROMU40Xilinx JTAG Programmer License-For FTDI IC only (U39).



Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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JTAG Signal

B2B Connector

Notes
TMSJP2-73.3V Voltage level. Also Connected to U39 (FTDI)
TDIJP2-113.3V Voltage level. Also Connected to U39 (FTDI)
TDOJP2-103.3V Voltage level. Also Connected to U39 (FTDI)
TCK

JP2-8

3.3V Voltage level. Also Connected to U39 (FTDI)

VREF_JTAGJP2-5Module Vout


UART Interface

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USB Signal

B2B Connector

Notes
xx
USB_OTG_D_ PJP2-
x
643.3V Voltage level.
xx
USB_OTG_D_ NJP2-
x
653.3V Voltage level.
xx
USB_OTG_IDJP2-
x
663.3V Voltage level.
xx
USB_VBUS_E NJP2-
x
673.3V Voltage level.
xx
USB_VBUSJP2-
x
68
3.3V Voltage level.

Max. voltage: 5.5V


ETH Interface

The TE0716 provides ETH access to the TE0716 SoM through B2B connector JP1. The ETH interface is connected later to the Zynq Ethernet PS (Ethernet 0), by using a ETH PHY.

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ETH Signal

B2B Connector

Notes
xx

PHY_MDI0_P

PHY_MDI0_ N

JP1-5

JP1-

x

4

3.3V Voltage level.
xx

PHY_MDI1_P

PHY_MDI1_ N

JP1-7

JP1-

x

8

3.3V Voltage level.
xx

PHY_MDI2_P

PHY_MDI2_ N

JP1-68

JP1-

x

67

3.3V Voltage level.
xx

PHY_MDI3_P

PHY_MDI3_ N

JP1-

x
3.3V Voltage level.

65

JP1-

x

64

3.3V Voltage level.


ADC Interface

The analog inputs of the ADCs are connected to B2B connector JP1.

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ADC Signal

B2B Connector

Notes
ADC0_P
ADC0_N
JP1-106..107

SAR ADC, U1.
3.3V Max. Voltage on any pin.

ADC1_P
ADC1_N
JP1-46..47

SAR ADC, U3.
3.3V Max. Voltage on any pin.

ADC2_P
ADC2_N
JP1-109..110

SAR ADC, U10.
3.3V Max. Voltage on any pin.

ADC3_P
ADC3_N
JP1-49..50

SAR ADC, U15.
3.3V Max. Voltage on any pin.

ADC4_P
ADC4_N
JP1-112..113

SAR ADC, U17.
3.3V Max. Voltage on any pin.

ADC5_P
ADC5_N
JP1-52..53

SAR ADC, U2.
3.3V Max. Voltage on any pin.

ADC6_P
ADC6_N
JP1-115..116

SAR ADC, U4.
3.3V Max. Voltage on any pin.

ADC7_P
ADC7_N
JP1-55..56

SAR ADC, U11.
3.3V Max. Voltage on any pin.

ADC8_P
ADC8_N
JP1-118..119

SAR ADC, U16.
3.3V Max. Voltage on any pin.

ADC9_P
ADC9_N
JP1-58..59

SAR ADC, U19.
3.3V Max. Voltage on any pin.


PWM Interface

@Guillermo: Hier die JP2 Stecker Pins  wo PWN rausgeführt wird 

Micro USB -JTAG/UART

A microUSB-B connector (J13) is connected to the FTDI. It provides the ability to communicate to the PL FPGA via JTAG, as well as to the PS UART (UART 0).

Caution: because the TE0716 also provides UART and JTAG access to the FPGA through B2B connectors JP1 and JP2 respectively, ONLY ONE connection for UART, and ONLY ONE connection for JTAG, should be used at the time! (please read "UART Interface" and "JTAG Interface" above in the "Board to Board (B2B)" Section).

Micro SD Socket

...

The PWM signals are connected to B2B connector JP2. All this digital signals are connected to PL Bank 33 (except for PWM_6_H  and PWM_6_L which are connected to PL Bank 13). These signals could be also used as normal single ended I/Os.

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PWM Signal

B2B Connector

Notes
PWM_0_H         JP2-103 3.3V Max. Voltage on any pin.
PWM_0_L         JP2-1043.3V Max. Voltage on any pin.
PWM_1_H         JP2433.3V Max. Voltage on any pin.
PWM_1_L         JP2-443.3V Max. Voltage on any pin.
PWM_10_H        JP2-1183.3V Max. Voltage on any pin.
PWM_10_L        JP2-1193.3V Max. Voltage on any pin.
PWM_11_H        JP2-583.3V Max. Voltage on any pin.
PWM_11_L        JP2-593.3V Max. Voltage on any pin.
PWM_2_H         JP2-1063.3V Max. Voltage on any pin.
PWM_2_L         JP2-1073.3V Max. Voltage on any pin.
PWM_3_H         JP2-463.3V Max. Voltage on any pin.
PWM_3_L         JP2-473.3V Max. Voltage on any pin.
PWM_4_H         JP2-1093.3V Max. Voltage on any pin.
PWM_4_L         JP2-1103.3V Max. Voltage on any pin.
PWM_5_H         JP2-493.3V Max. Voltage on any pin.
PWM_5_L         JP2-503.3V Max. Voltage on any pin.
PWM_6_H         JP2-1123.3V Max. Voltage on any pin.
PWM_6_L         JP2-113 3.3V Max. Voltage on any pin.
PWM_7_H         JP2-52 3.3V Max. Voltage on any pin.
PWM_7_L         JP2-533.3V Max. Voltage on any pin.
PWM_8_H         JP2-1153.3V Max. Voltage on any pin.
PWM_8_L         JP2-1163.3V Max. Voltage on any pin.
PWM_9_H         JP2-553.3V Max. Voltage on any pin.
PWM_9_L         JP2-563.3V Max. Voltage on any pin.


Micro USB -JTAG/UART

A microUSB-B connector (J13) is connected to the FTDI. It provides the ability to communicate to the PL FPGA via JTAG, as well as to the PS UART (UART 0).

Caution: because the TE0716 also provides UART and JTAG access to the FPGA through B2B connectors JP1 and JP2 respectively, ONLY ONE connection for UART, and ONLY ONE connection for JTAG, should be used at the time! (please read "UART Interface" and "JTAG Interface" above in the "Board to Board (B2B)" Section).

Micro SD Socket

A microSD™ card connector (J2) is connected via U35 (SD/SDIO Multiplexer - Level Translator) to Zynq PS (Bank501/SDIO 0). It is a Push-On/Push-Off socket type, and work with a voltage level of 3.3V.

MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI


PS MIO banks 500/501 signal connections to interface.

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MIO PinConnected toB2BNotes
1..6

SPI-CS , SPI-DQ0... SPI-DQ3

SPI-SCK

-QSPI Flash, U7
11..13LED1_R..G..B-LED D4
14, 15UART_RX_ZYNQ, UART_TX_ZYNQJP13.3V Voltage level. Also Connected to U36-2. To use this signal from B2B connector, "UART_OB_DISABLE" (JP1-11) must be "High".
16..27ETH-TXCK, ETH-TXD0..ETH-TXD3, ETH-TXCTL, ETH-RXCK, ETH-RXD0..ETH-RXD3, ETH-RXCTL-Gigabit ETH Transceiver, U8
28..39OTG-DATA0..OTG-DATA7, OTG-DIR, OTG-STP, OTG-NXT, OTG-CLK-USB 2.0 ULPI transceiver, U18
40..45PS_SD_CLK, PS_SD_CMD, PS_SD_DAT0..PS_SD_DAT3J23.3V Voltage level. Connected to PS via U35 (SD/SDIO Multiplexer - Level Translator)

...

46, 47I2C_SCL, I2C_SDA-General Purpose EEPROM, U21
MAC EEPROM, U24
51PHY-RST-Gigabit ETH Transceiver, U8
USB 2.0 ULPI transceiver, U18
52, 53ETH-MDC, ETH-MDIO-Gigabit ETH Transceiver, U8


Test Points

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you must fill the table below with group of MIOs Test Point which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematicindicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalMIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI

...

10PWR_PL_OKJ2-120



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Test Point
MIO Pin
SignalConnected to
B2B
Notes
Notes
TP1+1.
.6

SPI-CS , SPI-DQ0... SPI-DQ3

SPI-SCK

-QSPI Flash, U7
11..13LED1_R..G..B-LED D4
14, 15UART_RX_ZYNQ, UART_TX_ZYNQJP13.3V Voltage level. Also Connected to U36-2. To use this signal from B2B connector, "UART_OB_DISABLE" (JP1-11) must be "High".
16..27ETH-TXCK, ETH-TXD0..ETH-TXD3, ETH-TXCTL, ETH-RXCK, ETH-RXD0..ETH-RXD3, ETH-RXCTL-Gigabit ETH Transceiver, U8
28..39OTG-DATA0..OTG-DATA7, OTG-DIR, OTG-STP, OTG-NXT, OTG-CLK-USB 2.0 ULPI transceiver, U18
40..45PS_SD_CLK, PS_SD_CMD, PS_SD_DAT0..PS_SD_DAT3J23.3V Voltage level. Connected to PS via U35 (SD/SDIO Multiplexer - Level Translator)
46, 47I2C_SCL, I2C_SDA-General Purpose EEPROM, U21
MAC EEPROM, U24
51PHY-RST-Gigabit ETH Transceiver, U8
USB 2.0 ULPI transceiver, U18
52, 53ETH-MDC, ETH-MDIO-Gigabit ETH Transceiver, U8

...

0V

U37, DC-DC Converter

PL-VCCINT
TP2ADC_VAAU38, LDO Regulator
ADC_VAA Analog supply/reference, (3.3V)
TP3+1.5VU43, DC-DC Converter-
TP4+1.8VU45, DC-DC Converter-
TP5VTTU47, DDR Termination Regulator(0.75V)
TP6VTTREFU47, DDR Termination Regulator(0.75V)
TP7+5.0VJP1-(1,2,3)
JP2-(1,2,3)
Main Digital Power Input
TP8+3.3VU46, DC-DC Converter-
TP9+5.0V_VAAJP1-(43,44)Main Analog Low Power Input
TP10+3.3V_ADCU23, LDO RegulatorADC's Digital I/O supply
TP11GND--
TP12GND--
TP13SPI-DQ3/M0MIO_5Remove SD card and short with TP14 for JTAG only mode
TP14GND--


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


J2-120

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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OK


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Test PointSignalConnected toNotes
TP1+1.0V

U37, DC-DC Converter

PL-VCCINT
TP2ADC_VAAU38, LDO Regulator
ADC_VAA Analog supply/reference, (3.3V)
TP3+1.5VU43, DC-DC Converter-
TP4+1.8VU45, DC-DC Converter-
TP5VTTU47, DDR Termination Regulator(0.75V)
TP6VTTREFU47, DDR Termination Regulator(0.75V)
TP7+5.0VJP1-(1,2,3)
JP2-(1,2,3)
Main Digital Power Input
TP8+3.3VU46, DC-DC Converter-
TP9+5.0V_VAAJP1-(43,44)Main Analog Low Power Input
TP10+3.3V_ADCU23, LDO RegulatorADC's Digital I/O supply
TP11GND--
TP12GND--
TP13SPI-DQ3/M0MIO_5Remove SD card and short with TP14 for JTAG only mode
TP14GND--

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

...

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Notes :

...

Chip/InterfaceDesignatorNotes
DDR3 SDRAMU12, U13-
Quad SPI FlashU7-
MAC EEPROMU24-
General Purpose EEPROMU21-
SAR ADCsU1, U2, U3, U4, U10, U11, U15, U16, U17, U19-
Clock SourcesU6, U9, U14, U41-
Gigabit Ethernet PHYU8-
USB 2.0 ULPI transceiverU18-
FTDI USB 2.0 to UART/JTAGU39-
LEDsD3, D4, D5-
SwitchesS1, S2, S3-


DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE0716 module has two 500MByte DDR3L SDRAM chips (U12 & U13) fully connected to PS DDR BANK 502, and arranged into 32-bit wide memory bus providing total on-board memory size of 1GByte.

  • Configuration: 256Mx16*
  • Supply voltage: 1.35V (1.5V tolerant).
  • Speed: 1.25ns @ CL11 (DDR3-1600)*
  • Temperature: Industrial Range -40°C to +95°C Tcase.

Notes: * standard value but depends on assembly version.

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

On-board 32MByte QSPI flash memory S25FL256S (U7) could be used to store the initial FPGA configuration file. After configuration completes, the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

  • Part number: S25FL256SAGBHI20*
  • Supply voltage: 3.3V (2.7V - 3.6V).
  • Speed: 133MHz max.*
  • Temperature: Industrial Range -40°C to +85°C.

Notes: * standard number/value but depends on assembly version.

Designator
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MIO PinSchematicU7 Pin
Chip/Interface
Notes
DDR3 SDRAMU12, U13-Quad SPI FlashU7-MAC EEPROMU24
MIO1SPI-CSCS#-
General Purpose EEPROMU21-SAR ADCsU1, U2, U3, U4, U10, U11, U15, U16, U17, U19-Clock SourcesU6, U9, U14, U41-Gigabit Ethernet PHYU8-USB 2.0 ULPI transceiverU18-FTDI USB 2.0 to UART/JTAGU39-LEDsD3, D4, D5-SwitchesS1, S2, S3-

DDR3 SDRAM

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hiddentrue
idComments

Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE0716 module has two 500MByte DDR3L SDRAM chips (U12 & U13) fully connected to PS DDR BANK 502, and arranged into 32-bit wide memory bus providing total on-board memory size of 1GByte.

  • Configuration: 256Mx16*
  • Supply voltage: 1.35V (1.5V tolerant).
  • Speed: 1.25ns @ CL11 (DDR3-1600)*
  • Temperature: Industrial Range -40°C to +95°C Tcase.

Notes: * standard value but depends on assembly version.

Quad SPI Flash Memory

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hiddentrue
idComments

Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

On-board 32MByte QSPI flash memory S25FL256S (U7) could be used to store the initial FPGA configuration file. After configuration completes, the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

MIO3SPI-DQ1/M1SO/IO1-
MIO4SPI-DQ2/M2WP#/IO2-
MIO2SPI-DQ3/M3HOLD#/IO3-
MIO5SPI-DQO/M0SI/IO0-
MIO6SPI-SCK/M4SCK-


EEPROM

There are 2x EEPROMs sharing the same I2C bus (I2C interface is connected to the Zynq I2C PS (I2C 0).:

MAC-Address EEPROM

A 2Kbit 24AA025E48 serial EEPROM I2C memory (U24), connected to the BANK501 PSMIOs, contains a globally unique 48-bit node address, which is compatible with EUI-48TM specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks, the upper half of the array (80h-FFh), stores the 48-bit node address and is permanently write-protected, while the other block is available for application use.

  • Part number: 24AA025E48T-I/OT
  • Supply voltage: 1.8V (1.7V - 5.5V).
  • FCLK: 100KHz (@VCC=1.8V)
  • Temperature: Industrial Range -40°C to +85°C.


General Purpose EEPROM

The TE0716 module has also a 512Kb Serial EEPROM I2C memory (U21).

  • Part number: CAT24C512WI-GT3
  • Supply voltage: 1.8V (1.8V - 5.5V).
  • FCLK: 100KHz/400KHz/1MHz
  • Part number: S25FL256SAGBHI20
  • Supply voltage: 3.3V (2.7V - 3.6V).
  • Speed: 133MHz max.
  • Temperature: Industrial Range -40°C to +85°C.

...

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MIO PinSchematic
U7
U21/U24 PinNotes
MIO1SPI-CSCS#-
MIO3SPI-DQ1/M1SO/IO1-
MIO4SPI-DQ2/M2WP#/IO2-
MIO2SPI-DQ3/M3HOLD#/IO3-
MIO5SPI-DQO/M0SI/IO0-
MIO6SPI-SCK/M4SCK-

EEPROM

There are 2x EEPROMs sharing the same I2C bus (I2C interface is connected to the Zynq I2C PS (I2C 0).:

MAC-Address EEPROM

A 2Kbit 24AA025E48 serial EEPROM I2C memory (U24), connected to the BANK501 PSMIOs, contains a globally unique 48-bit node address, which is compatible with EUI-48TM specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks, the upper half of the array (80h-FFh), stores the 48-bit node address and is permanently write-protected, while the other block is available for application use.

  • Part number: 24AA025E48T-I/OT
  • Supply voltage: 1.8V (1.7V - 5.5V).
  • FCLK: 100KHz (@VCC=1.8V)
  • Temperature: Industrial Range -40°C to +85°C.

General Purpose EEPROM

The TE0716 module has also a 512Kb Serial EEPROM I2C memory (U21).

...

MIO46I2C_SCL         SCL-
MIO47I2C_SDA         SDA-



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I2C DeviceI2C AddressDesignatorNotes
2K Serial EEPROMs with EUI-48™

0x53 (7bit)

U24-
512Kb Serial EEPROM

0x50 (7bit)

U21-


ADCs

The TE0716 module has 10x 12-Bit Low Power SAR Analog-to-Digital Converter, fully differential input, signed output, with SPI−compatible interface (NCD98011), which are connected to the FPGA PL BANK34.

  • Part number: NCD98011XMXTAG
  • Analog supply and ADC reference voltage (VCC): 3.3V (1.65V – 3.6V).
  • Digital I/O supply voltage (VDD): 3.3V (1.65V – 3.6V).
  • Differential analog inputs: 1 per ADC.
  • Full−Scale Analog Input Voltage Span: +VCC max Vppd, -VCC min Vppd, (VCM to VCC/2).
  • Absolute Voltage Range Vinp or Vinn to GND: VCC + 0.1V
  • Sampling rate: 2 MSPS max.
  • SNR: 70dB @1KHz fIN.
  • THD: -80dB @1KHz fIN.
  • Junction Temperature: Range -40°C to +125°C.

All the analog inputs are connected to B2B JP1 as follows:

...

Scroll Title
anchorTable_OBP_EEPINADC
titleI2C EEPROM ADC Analog interface MIOs and pins

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MIO Pin
DesignatorSchematic
U21/U24 PinNotes
MIO46I2C_SCL         SCL-
MIO47I2C_SDA         SDA-
Scroll Title
anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM
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I2C DeviceI2C AddressDesignatorNotes
2K Serial EEPROMs with EUI-48™

0xA6 (write)
0xA7 (read)
0x53 (7bit)

U24-
512Kb Serial EEPROM

0xA0 (write)
0xA1 (read)
0x50 (7bit)

U21-

ADCs

The TE0716 module has 10x 12-Bit Low Power SAR Analog-to-Digital Converter, fully differential input, signed output, with SPI−compatible interface (NCD98011), which are connected to the FPGA PL BANK34.

  • Part number: NCD98011XMXTAG
  • Analog supply and ADC reference voltage (VCC): 3.3V (1.65V – 3.6V).
  • Digital I/O supply voltage (VDD): 3.3V (1.65V – 3.6V).
  • Differential analog inputs: 1 per ADC.
  • Full−Scale Analog Input Voltage Span: +VCC max Vppd, -VCC min Vppd, (VCM to VCC/2).
  • Absolute Voltage Range Vinp or Vinn to GND: VCC + 0.1V
  • Sampling rate: 2 MSPS max.
  • SNR: 70dB @1KHz fIN.
  • THD: -80dB @1KHz fIN.
  • Junction Temperature: Range -40°C to +125°C.

...

B2B JP1 pinNotes
U1ADC0_P
ADC0_N
106 - 107 

3.3V Max Voltage on any pin.

U2

ADC5_P
ADC5_N

52 - 53 3.3V Max Voltage on any pin.
U3

ADC1_P
ADC1_N

46 - 47 3.3V Max Voltage on any pin.
U4

ADC6_P
ADC6_N

115 - 116 3.3V Max Voltage on any pin.
U10

ADC2_P
ADC2_N

109 - 110 3.3V Max Voltage on any pin.
U11

ADC7_P
ADC7_N

55 - 56 3.3V Max Voltage on any pin.
U15

ADC3_P
ADC3_N

49 - 50 3.3V Max Voltage on any pin.
U16

ADC8_P
ADC8_N

118 - 119 3.3V Max Voltage on any pin.
U17

ADC4_P
ADC4_N

112 - 113 3.3V Max Voltage on any pin.
U19

ADC9_P
ADC9_N

58 - 59 3.3V Max Voltage on any pin.


All the digital signals are connected to PL Bank 34 as follows:

106 - 107 
Scroll Title
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titleADC Analog to PL interface and pins

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DesignatorSchematic
B2B JP1 pin
PL PinNotes
U1
ADC0_P
ADC0_N
U3

ADC1_P
ADC1_N

46 - 47 

S0_CLK          

S0_CSN          

S0_OUT          

J18

J16

K18

3.3V Max Voltage on any pin.
U2

ADC5_P
ADC5_N

52 - 53 3.3V Max Voltage on any pin.

S5_CLK          

S5_CSN          

S5_OUT          

M21

T16

T17

3.3V Max Voltage on any pin.
U4
U3

ADC6_P
ADC6_N

115 - 116 3.3V Max Voltage on any pin.U10

ADC2_P
ADC2_N

109 - 110 

S1_CLK          

S1_CSN          

S1_OUT          

L18

J21

L19

3.3V Max Voltage on any pin.
U11

ADC7_P
ADC7_N

55 - 56 
U4

S6_CLK          

S6_CSN          

S6_OUT          

J22

K21

J20

3.3V Max Voltage on any pin.
U15

ADC3_P
ADC3_N

49 - 50 
U10

S2_CLK          

S2_CSN          

S2_OUT          

M22 

R21 

R20 

3.3V Max Voltage on any pin.
U16

ADC8_P
ADC8_N

118 - 119 
U11

S7_CLK          

S7_CSN          

S7_OUT          

L22 

M20 

M19 

3.3V Max Voltage on any pin.
U17
U15

ADC4_P
ADC4_N

112 - 113 3.3V Max Voltage on any pin.U19

ADC9_P
ADC9_N

58 - 59 

S3_CLK          

S3_CSN          

S3_OUT          

J17 

J15 

L17 

3.3V Max Voltage on any pin.