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CompanyTrenz Electronic Gmbh
PCN Number

...

PCN-
201406xx
20140730
TitleTE0720-01 to TE0720-02
SubjectTrenz Electronic
TE0720 SoM
TE0720 SoM (system on module): revision 1 to revision 2 upgrade
Change Level
Issue Date

major

Issuer

Trenz Electronic GmbH

Place

Bünde, Germany, EU

20140730

Products Affected

This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.

affected product

suggested upgrade

TE0720-01-*

TE0720-02-*

Changes

Description

#1 JTAG only boot mode is now supported

Type

: Enhancement

Reason

: Enhancement of functionality

Impact

: None

 

Description

#2 Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256

Type

: Enhancement

Reason

: Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado) W25Q256 is only supported by u-boot,

linux

Linux and Vivado SDK Programmer

.

Impact

: May have to re-evaluate applications that write to the SPI Flash

Description

#3 Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with

TPS51206 

TPS51206

Type

: BOM change

Reason

: TPS51206 was changed due to BOM optimization

Impact

: None

Description

#4 Changed MDIO pullup from 10k to

4k7 

4k7

Type

: BOM change

Reason

: Avoiding potential problems when PHY management bus is configured at high speeds

Impact

: None

Description

#5 Changed eMMC core supply from switched 3.3Vout to 3.3Vin

.

Type

: Schematic change

Reason

: eMMC startup timing improvement

Impact

: None

Description

#6 MAC EEPROM power changed from 3.3V to 1.8V

Type

: Schematic change

Reason

: PCB and System Controller optimization

Impact

: None

Description

#7 I2C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus.

 

Type

: Schematic change

Reason

: Change to new type of MEMS with only one I2C

Impact

 None

: None (if the old GPIO based I2C mux is used it just has no effect now)

Description ST

#8 ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled in standard assembly variants

.

Type

 BOM

: BOM change

Reason

 ST

: ST LSM303DLM MEMS has been discontinued

.

Impact

 None

: None for designs that did not use the MEMS sensor

Description

, please contact us for customized BOM if necessary

#9 Removed test pads on top layer

Type

: Layout change

Reason

: No longer needed as the System Controller factory programming is done during tests using main B2B Connectors

Impact

: None (test pads only used at factory)

Description

#10 Increased component clearance from mounting holes on bottom layer

Type

: Enhancement

Reason

: Decreasing the possibility to damage the module with improper extraction methods

Impact

: None

Description

#11 System Controller in-system programming via B2B JTAG pins

Type

: Enhancement

Reason

: Enhancement for Factory tests and programming

Impact

: None

Description

#12 JM1 pin 89 has new function that enables System Controller JTAG Chain

,

no impact for old designs that connect this pin to GND

Type

: Enhancement

Reason

: Enhancement for Factory tests and programming

Impact

: None

 

Method of Identification

The model code and revision number (e.g. TE0720-01 or TE0720-02) are printed on the top side of the PCB.

Production Shipment Schedule

From June 2014.

Contact Information

If you have any questions related to this PCN, please contact Trenz Electronic's Technical Support at

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being
issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information,
please contact your local Trenz Electronic sales office, technical support or local distributor.