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The 7.5 x 10 cm modules use four Samtec AcceleRate HD High-Density on the bottom side.

• 4 x ADM6-60-01.5-L-4-2 (compatible to ADF6-60-01.5-L-4-2), (240 pins, "60" per row)

The carriers for 7.5 x 10 cm modules use four Samtec AcceleRate HD High-Density on the bottom side.

• 4 x ADF6-60-03.5-L-4-2 (compatible to ADF6-60-01.5-L-4-2), (240 pins, "60" per row)

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• Board-to-Board Connector 240-pins, 60 contacts per row
• 0.025" (0.635 mm) pitch
• Data Rate: max 56 Gbps 
• Mates with: ADM6/APF6
• Insulator Material: LCP, Black
• Contact Material:  Copper Alloy
• Plating: Au or Sn over 50 µ" (1.27 µm) N
• Operating Temperature Range: -55 ºC to +125 ºC
• • PCIe 5.0 capable: Yes
• Lead-Free Solderable: Yes
• RoHS Compliant: Yes

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The module can be manufactured using other connectors upon request.

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