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Issuer

Trenz Electronic GmbH

Place

Bünde, Germany, EU

Code

PCN-201406xx

Title

TE0720-01 to TE0720-02

Subject

Trenz Electronic TE0720 SoM (system on module): revision 1 to revision 2 upgrade

Change Level

major

Products Affected

This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.

affected productsuggested upgrade
TE0720-01-1CFTE0720-02-1CF
TE0720-01-1CF1TE0720-02-1CF
TE0720-01-1CRTE0720-02-1CR
TE0720-01-2EFTE0720-02-2EF
TE0720-01-2ERcontact us
TE0720-01-2IFTE0720-02-2IF
TE0720-01-2IFC1TE0720-02-2IF
TE0720-01-2IFC2TE0720-02-2IF

Description of Change

  1. Replaced Winbond W25Q256FV quad SPI Flash memory with Spansion XXX quad SPI Flash memory.
  2. MEMS no longer populated

Reason for Change

  1. Spansion XXX quad SPI Flash memory is better supported by Xilinx design tools. than the Winbond one.
  2. MEMS discontinued

Application Impact

  1.  

Proposed Countermeasures

  1.  

Method of Identification

Method of identifying changed product.

Production Shipment Schedule

June 2014

Contact Information

If you have any questions related to this PCN, please contact Trenz Electronic's Technical Support at

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being
issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information,
please contact your local Trenz Electronic sales office, technical support or local distributor.