Page History
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| Description | Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256 |
|---|---|
| Type | Enhancement |
| Reason | Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado) W25Q256 is only supported by u-boot, linux and Vivado SDK Programmer. |
| Impact | May have to re-evaluate applications that write to the SPI Flash |
| Description | Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with TPS51206 |
|---|---|
| Type | BOM change |
| Reason | TPS51206 was changed due to BOM optimization |
| Impact | None |
| Description | Changed MDIO pullup from 10k to 4k7 |
|---|---|
| Type | BOM change |
| Reason | Avoiding potential problems when PHY management bus is configured at high speeds |
| Impact | None |
| Description | Changed eMMC core supply from switched 3.3Vout to 3.3Vin. |
|---|---|
| Type | Schematic change |
| Reason | eMMC startup timing improvement |
| Impact | None |
| Description | MAC EEPROM power changed from 3.3V to 1.8V |
|---|---|
| Type | Schematic change |
| Reason | PCB and System Controller optimization |
| Impact | None |
| Description | I2C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus. |
|---|---|
| Type | Schematic change |
| Reason | Change to new type of MEMS with only one I2C |
| Impact | None (if the old GPIO based I2C mux was is used it just has no effect now) |
| Description | ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled in standard assembly variants. |
|---|---|
| Type | BOM change |
| Reason | ST LSM303DLM MEMS has been discontinued. |
| Impact | None for designs that did not use the MEMS sensor |
| Description | Removed test pads on top layer |
|---|---|
| Type | Layout change |
| Reason | No longer needed as the System Controller factory programming is done during tests using main B2B Connectors |
| Impact | None (test pads only used at factory) |
| Description | Increased component clearance from mounting holes on bottom layer |
|---|---|
| Type | Enhancement |
| Reason | Decreasing the possibility to damage the module with improper extraction methods |
| Impact | None |
| Description | System Controller in-system programming via B2B JTAG pins |
|---|---|
| Type | Enhancement |
| Reason | Enhancement for Factory tests and programming |
| Impact | None |
| Description | JM1 pin 89 has new function that enables System Controller JTAG Chain, no impact for old designs that connect this pin to GND |
|---|---|
| Type | Enhancement |
| Reason | Enhancement for Factory tests and programming |
| Impact | None |
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