Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.


Scroll Ignore

Download PDF version of this document.



Scroll pdf ignore

Table of Contents

Table of Contents

Overview

Scroll Only (inline)

...

Refer to https://wiki.trenz-electronic.de/display/PD/TE0710+TRM 

...

for online version of this manual and 

...

the 

...

rest 

...

of 

...

available 

...

documentation.

...

Trenz Electronic TE0710 is an industrial-grade FPGA module integrating a

...

Xilinx Artix-7

...

FPGA,

...

two 10/100

...

Mbit Ethernet

...

PHYs, 512 MByte DDR3 SDRAM

...

, 32

...

MByte Quad SPI Flash memory for configuration and operation and powerful

...

switching-mode power supplies for all on-board voltages.

...

Numerous configurable I/Os

...

are provided via rugged high-speed

...

strips. All

...

this on a tiny footprint, smaller than a credit card

...

size at

...

very competitive price. All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.

Key Features

  • Industrial-grade Xilinx Artix-7 FPGA (15T to 100T) SoM (System on Module) , supported by the free Xilinx Vivado WebPACK development tool

  • Rugged for shock and high vibration

  • 512 MByte DDR3 SDRAM

  • Dual 10/100 MBit Mbit Ethernet PHY

    • MAC Address EEPROM

  • 32 MByte QSPI Flash memory (with XiP support)

  • 100 MHz programmable MEMS oscillator

  • Plug-on module with 2 × 100-pin high-speed hermaphroditic strips

  • 112 FPGA I/Os (51 differential pairs) and are available on boardvia board-to-board connectors

  • On-board high-efficiency DC-DC converters

    • 4.0 A x 1.0 V power rail

    • 1.0 A x 1.8 V power rail

    • 1.0 A x 1.5 V power rail

  • System management and power sequencing

  • eFUSE bit-stream encryption

  • AES bit-stream encryption

  • User LED

  • Evenly-spread supply pins for good signal integrity

NB! Assembly options for cost or performance optimization are available upon request.

...

Block Diagram

Image Removed

 

  Image Removed

Top view

Bottom view

Detailed Description

PL Programmable Logic

The TE0710 board is populated with the Artix-7 Series Families FPGA. The devices can be programmed with the free Xilinx Vivado WebPACK software. Further information on the Artix-7 FPGA can be found in the Xilinx  document 7 Series FPGAs Overview (DS180). 

FPGA

Logic Cells

Flip-Flops

BRAM

XC7A15T-2CSG324C

16,640

20,800

25

XC7A35T-2CSG324C

33,280

41,600

50

XC7A50T-2CSG324C

52,160

65,200

75

XC7A75T-2CSG324C

75,520

94,400

105

XC7A100T-2CSG324C

101,440

126,800

135

Configuration Modes

The following two FPGA configuration interfaces are supported:

Mode

Setting

Notes

JTAG

JTAG

For debugging purposes

SPI Flash

SPI Master 4-bit mode

Main configuration mode: 4-Bit mode must be used when generating bitstream

 

TE0710 Configuation pin settings

Config Pin

Setting

Notes

M03.3VBootmode setting:
Master SPI

 

 

M10V
M20V
CFGBVS3.3VSelect 3.3V as Config Bank I/O Voltage
PUDCStrong pull-up to 3.3VPre-configuration pull-ups are DISABLED

 

Configuration Memory

TE0710 standard assembly option includes 32MByte SPI Flash for configuration and data storage. This memory is large enough to hold at least 4 uncompressed FPGA Bitstreams.

Parameter

Value

Notes

Memory size (MBytes)

32

 

Vendor

Spansion

http://www.spansion.com

Device type

S25FL256SAGBHI20

 

Vivado CFGMEM

s25fl256sxxxxxx0-spi-x1_x2_x4

Value to be used with Vivado labtools flash programmer

Vivado Board Part File Interface name

SPI Flash

 

Parameter values for the SPI Flash memory included in the standard assembly option.

XADC

XADC is configured with internal reference voltage option. All XADC inputs that are shared with FPGA I/O are available in the B2B Connector. There is no access to the dedicated XADC input pins.

Clock Sources

The TE0710 board has a 3.3V single ended 100MHz oscillator (U8). It is wired to an FPGA MRCC clock input on bank 35.

  • Oscillator: Si Time SiT8008AI-73-XXS-100.000000E (100 MHz)

  • Frequency stability: 50 ppm

IC Designator

Description

Frequency

Used as

FPGA Pin

IO Standard

Vivado Board Part Interface

U8

MEMS Oscillator

100 MHz

System Clock

F4

LVCMOS15

System Clock

In standard assembly option MEMS oscillator with 100MHz Frequency and 50 ppm stability is used. Other frequencies possible for custom order.

Reset Sources

Reset Type

Source

Notes

Power On ResetSystem ControllerPROG_B released after power on causing FPGA reconfiguration
Config ResetJM2.18Active low value forces FPGA reconfiguration
Dummy ResetFPGA pin D9Can be used as reset with fixed always inactive value if needed (may have to add pullup or pulldown constraint)
Soft ResetAny FPGA B2B I/OUser defined soft reset input with user defined polarity
Debug ResetMicroblaze MDMJTAG debugger soft reset

LED's

The TE0710 board has 3 LEDs. One is user led, which is connected to Pin L15 on the Bank 14. The other two are connected to the system controller. 

LED

Color

IOSTANDARD

FPGA Pin

Description

D1

red

N/A

N/A

System controller status LED

D2

green

N/A

N/A

System controller status LED

D3

red

LVCMOS33

L15

User LED, active LOW

JTAG

JTAG access is provided to the Xilinx Artix-7 FPGA (U5) and system controller (U4) through connector JM2. Selection of JTAG is controlled by the JTAGSEL pin (JM1.89) in connector JM1.

JTAG Bus Access

SignalB2B ModuleB2B BaseDescription
TCKJM2: 99 

 

TDIJM2: 95 .
TDOJM2: 97  
TMSJM2: 93  
JTAGSELJM1: 89 keep low or GND for normal operation
Note
The use of Xilinx legacy development tools (ISE, Impact) is not recommended. Impact does recognize only A100T, any smaller Artix is not even recognized as Xilinx FPGA by Impact.

 

DDR3 Memory

The TE0710 board contains one DDR3 component with a capacity of 4Gb.

...

Image Added

Figure 1: TE0710-02 block diagram.

Page break

Main Components

Image Added   Image Added

Figure 2: TE0710-02 PCB.

  1. Xilinx Artix-7 FPGA , U5
  2. Voltage regulator for DDR3 SDRAM (Texas Instruments TPS51206), U2
  3. 512 MByte DDR3 SDRAM (Memphis MEM4G08D3EABG), U12
  4. 1A PowerSoC DC-DC converter for 1.5V (Altera EN5311QI), U10
  5. 32 MByte Quad SPI Flash memory (Cypress S25FL256S), U7
  6. System Controller CPLD (Lattice Semiconductor LCMXO2-256HC), U4
  7. 4A PowerSoC DC-DC converter for 1.0V (Altera EN6347QI), U1
  8. Programmable oscillator @25.000000 MHz for Ethernet reference clock (SiTime SiT8008), U9
  9. B2B connector (0,40 mm Razor Beam™ High Speed Hermaphroditic Strip LSHM-150), JM2
  10. B2B connector (0,40 mm Razor Beam™ High Speed Hermaphroditic Strip LSHM-150), JM1
  11. 1A PowerSoC DC-DC converter for 1.5V for 1.8V (Altera EN5311QI), U11
  12. 10/100 Mbps Ethernet PHY (Texas Instruments TLK106), U3
  13. 10/100 Mbps Ethernet PHY (Texas Instruments TLK106), U6
  14. 2 Kbit serial EEPROM with UNI/O serial interface (Microchip 11AA02E48T-I/TT), U13
  15. Programmable oscillator @100.000000 MHz for reference clock (SiTime SiT8008), U8

Page break

Initial Delivery State

Storage Component

Content

Notes

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main arraay

Empty-

eFUSE USER

Not programmed

-

eFUSE Security

Not programmed

-

Table 1: TE0710-02 module initial delivery state.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGAs I/O banks, voltages and B2B connections:

BankType

B2B

Connector

I/O Signal

Count

VoltageNotes

14

HR

JM1

8 I/O pins

3.3V

HR banks support voltages from 1.2V to 3.3V.

See Xilinx Artix-7 datasheet (DS181) for voltage ranges.

15

HR

JM1

48 I/O pins

24 LVDS pairs

User

Same as above.

16

HR

JM1

6 I/O pins

3 LVDS pairs

3.3V

Same as above.
34HRJM2

50 I/O pins

24 LVDS pairs

UserSame as above.

Table 2: FPGA I/O banks.

Please refer to Pin-out tables page for more information.

Page break

JTAG Interface

JTAG access to the Xilinx Artix-7 and System Controller CPLD is provided through B2B connector JM2.

JTAG SignalB2B Pin
TMSJM2-93
TDIJM2-95
TDOJM2-97
TCK

JM2-99

Table 3: JTAG interface connector.

Note

JTAGEN pin on B2B connector JM1 is used to control which physical device is accessible via JTAG interface. If this pin is set to low or left open, JTAG interface is enabled for Xilinx Artix-7 FPGA, if set to high, JTAG interface for System Controller CPLD will be enabled.

The use of Xilinx legacy development tools (ISE, iMPACT) is not recommended. iMPACT does not recognize any Xilinx Artix-7 below A100T model.

System Controller I/O Pins

Special purpose pins are connected to the System Controller CPLD which have following default function:

Pin NameModeFunctionDefault Configuration

B2B Pin

PGOODOutputPower GoodActive high when all on-module power supplies are operating properly.JM1-30
RESINInputResetActive low, drive low to keep system in reset state (FPGA pin PROG_B will be driven by CPLD).JM2-18
EN1InputResetSame as RESIN, can be left unconnected.JM1-28
JTAGENInputJTAG SelectLow for normal operation, high (3.3V) to enable JTAG for System Controller CPLD.JM1-89
MODE--Not used by default, leave open.JM1-32
NOSEQ--Not used by default, leave open.JM1-7

Table 4: Special purpose pins description of the System Controller CPLD.

Page break

On-board LEDs

There are three LEDs available on TE0710-02 SoM. Two are status LEDs, and one can be freely used by user design. The user LED is routed to the FPGA as 'USERLED'.

When the FPGA is not configured the status LEDs will flash continuously. Once the FPGA configuration has completed, the status LEDs can be used by the user FPGA design.

LEDColorConnected toDescription and Notes
D1RedSYSLED2System Controller status LED, connected to CPLD.
D2GreenSYSLED1System Controller status LED, connected to CPLD.
D3RedUSERLEDUser LED, active LOW, connected to FPGA pin L15.

Table 5: On-board LEDs.

Clocking

The TE0710-02 SoM is equipped with two MEMS oscillators to provide clock signals for two on-board Ethernet PHYs and DDR3 SDRAM.

ClockFrequencyICConnected toNotes

Ethernet reference

25 MHz

U9, SiT8008AI-73-XXS-25.000000EICs U3, U6 TLK106RHBClock signal shared by both Ethernet PHYs.
DDR3 SDRAM reference100 MHz

U8, SiT8008AI-73-XXS-100.000000E

FPGA bank 35, pin F4Differential clock signal for DDR3 SDRAM IC, U12.

Table 6: Clocks overview.

On-board Peripherals

32 MByte Quad SPI Flash Memory

An SPI flash memory S25FL256S (U7) is provided for FPGA configuration file storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

Note

SPI Flash QE (Quad Enable) bit must be set to high or FPGA is unable to load its configuration from flash during power-on. By default this bit is set to high at the manufacturing plant.

System Controller CPLD

System Controller CPLD (Lattice MachXO2-256HC, U4) is used to control FPGA configuration process. The FPGA is held in reset (by driving the PROG_B signal low) until all power supplies have stabilized.

By driving signal RESIN to low you can reset the FPGA. This signal can be driven from the user’s baseboard PCB via the B2B connector JM2 pin 18.

Input EN1 is also gated to FPGA reset, should be open or pulled up for normal operation. By driving EN1 low, on-board DC-DC converters are not turned off.

User can create their own System Controller design using Lattice Diamond software. Once created it can be programmed into CPLD via JTAG interface.

Page break

DDR3 SDRAM

The TE0710-02 SoM has one 512 MByte volatile DDR3 SDRAM IC (U12) for storing user code and data.

  • Part number: MEM4G08D3EABG-125 (Memphis) 
  • Supply voltage: 1.5V
  • Organization:  64M words x 8 bits x 8 banks
  • Memory speed limited by Xilinx Artix-7 speed grade and MIG

Configuration of the DDR3 memory controller in the FPGA should be done using the MIG tool in the Xilinx Vivado Design Suite IP catalog.

Ethernet PHYs

The TE0710-02 is equipped with two Texas Instruments TLK106 10/100 Mbit Ethernet PHYs (U3 and U6). The I/O voltage is fixed at 3.3V. The reference clock input for both PHYs is supplied by on-board 25 MHz oscillator (U9). Both Ethernet PHYs are connected to FPGA bank 14 using MII interface.

Note: Pin ETH2_INT (power down or interrupt, default function is power down) is connected to FPGA bank 16 (pin D10).

MAC Address EEPROM

TE0710-02 module is equipped with 2 Kbit serial Electrically Erasable PROM (EEPROM, U14).  It provides pre-programmed 48-bit Extended Unique Identifier (EUI-48™) to identify network hardware MAC address which is write-protected to ensure tamper-proof designs. This EEPROM can be accessed by UNI/O® serial interface bus using Manchester encoding techniques. The clock and data are combined into a single, serial bit stream (SCIO), where the clock signal is extracted by the receiver to correctly decode the timing and value of each bit. The bus is controlled by a master device (Xilinx Artix-7) which determines the clock period, controls the bus access and initiates all operations, while the EEPROM works as a slave. Refer to Microchip's 11AA02E48 datasheet for more information.

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 2A for system startup is recommended.

 Power Input PinVoltage RangeCurrent
VIN3.3V to 5.5VTypical 200mA, depends on customer design and setup.
3.3VIN3.3VTypical 50mA, depends on customer design and setup.

Table 7: Typical power consumption during normal operation.

Tip

VIN and 3.3VIN can be connected to the same power source (3.3 V).

Lowest power consumption is achieved when powering the module from single 3.3V power supply. When using split 3.3V/5V supplies the power consumption (and heat dissipation) will rise, this is due to the DC-DC converter efficiency (it decreases when VIN/VOUT ratio rises).

Power-On Sequence

For highest efficiency of on-board DC-DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

It is important that all baseboard I/Os are 3-stated at power-on until System Controller sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10,12 or 91, meaning that all on-module voltages have become stable and module is properly powered up.

See Xilinx datasheet DS181 (for Artix7) for additional information. User should also check related baseboard documentation when choosing baseboard design for TE0710-02 module.

A 3.3V supply is also needed and must be supplied from the user's PCB. An output 3.3V supply is available on some of the board connector pins (see section 'Power Rails'). The input 3.3VIN will be switched to the internal 3.3V voltage level after the FPGA 1.0V supply is stable. Than 3.3V supply will be available on the B2B connector pins.

The regulators can be powered from the 3.3V supply or a 5V supply if preferred. The options for powering the board are as follows:

  • Apply 5V to pins VIN and 3.3V to pins 3.3VIN on the board connector
  • Apply 3.3V to pins VIN and 3.3VIN on the board connectors.

Power Rails and Bank Voltages

Voltages on B2B-

Connectors

B2B JM1-PinB2B JM2-PinDirectionNote
VIN

1, 3, 5

2, 4, 6, 8InputSupply voltage
3.3VIN13, 15-InputSupply voltage
VCCIO159, 11-InputHigh range bank voltage
VCCIO34-7, 9InputHigh range bank voltage
3.3V-10, 12OutputInternal 3.3V voltage level
JTAG VREF-91OutputJTAG reference voltage (3.3V).
1.8V39-OutputInternal 1.8V voltage level
1.5V-19OutputInternal 1.5V voltage level

Table 8: Power rails on B2B connectors.

FPGA BankSchematics NameVoltageRange
0 Config3.3V3.3V-
143.3V3.3V- 
15VCCIO15UserHR: 1.2V to 3.3V
163.3V3.3V-
34VCCIO34UserHR: 1.2V to 3.3V
351.5V1.5V- 

Table 9: FPGA bank voltages.

See Xilinx Artix-7 datasheet DS181 for allowed voltage ranges.

Board to Board Connectors

Include Page
4 x 5 SoM LSHM B2B Connectors
4 x 5 SoM LSHM B2B Connectors

Variants Currently In Production

Module Variant

FPGA

FPGA Junction Temperature

Operating Temperature Range
TE0710-02-35-2IFXC7A35T-2CSG324I-40°C to 100°CIndustrial grade
 TE0710-02-100-2IFXC7A100T-2CSG324I-40°C to 100°CIndustrial grade
 TE0710-02-35-2CFXC7A35T-2CSG324C0°C to 85°CCommercial grade
TE0710-02-100-2CFXC7A100T-2CSG324C0°C to 85°CCommercial grade

Table 10: Differences between TE0710-02 variants.

Technical Specifications

Absolute Maximum Ratings

ParameterMinMaxUnitsNotes

VIN supply voltage

-0.37.0VEN6347QI, EN5311QI datasheet
3.3VIN supply voltage

-0.1

3.6 V-
HR I/O banks supply voltage (VCCO)-0.53.6 VXilinx datasheet DS181
HR I/O banks input voltage-0.4VCCO + 0.55 VXilinx datasheet DS181
Voltage on module JTAG pins

-0.5

VCCO_0 + 0.45 VVCCO_0 is 3.3V nominal
Storage temperature-55

+100

 °C-

Table 11: Absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsNotes
VIN supply voltage2.45.5 VEN5311QI data sheet
3.3VIN supply voltage3.1353.465 V

3,3V ± 5%

HR I/O banks supply voltage (VCCO)1.143.465 V

Xilinx datasheet DS181

HR I/O banks input voltage-0.20VCCO + 0.2 V

Xilinx datasheet DS181

Voltage on JTAG pins3.1353.465 V3,3V ± 5%

Table 12: Recommended operating conditions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact Trenz Electronic for options.

Note
Please check Xilinx datasheet DS181 for complete list of absolute maximum and recommended operating ratings.

Page break

Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.
  • Mating height with standard connectors: 8mm
  • PCB thickness: 1.4mm+/-10%
  • Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

All dimensions are shown in millimeters.

Image Added   Image Added

Figure 3: Physical dimensions of the TE0710-02 SoM.

Revision History

Hardware Revision History

DateRevisionNotesPCNDocumentation Link
2014-03-0702Current hardware version
TE0710-02

01First production release

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Image Added

Document Change History

DateRevisionContributorsDescription

Page info
modified-date
modified-date
dateFormatyyyy-MM-dd

Page info
infoTypeCurrent version
prefixv.
typeFlat

Page info
infoTypeModified by
typeFlat

  • correction pcb thickness
  • change history style
2018-04-20v.9John Hartfiel
  • Update power rail section
2017-11-10v.5John Hartfiel
  • Replace B2B connector section
2017-01-26v.4Jan Kumann
  • New block diagram.
2017-01-24

v.3

Jan Kumann
  • SC I/O pins section improved.
2017-01-01
v.2

Jan Kumann

  • TRM revision.
2015-01-23v.1

Page info
infoTypeModified users
typeFlat

  • Initial version.

...

Configuration of the DDR3 memory controller in the FPGA should be done using the Xilinx MIG tool in the Vivado IP catalog. Refer to the reference design section (DDR3 Reference Design) for information on how to do this.

DDR3 Memory Connections to the FPGA

FPGA PinFPGA BankI/O StandardComment
A435DIFF_SSTL15DDR3 Clock
A335DIFF_SSTL15DDR3 Clock
B135LVCMOS15DDR3 Reset
G635SSTL15DDR3 ODT
H535SSTL15DDR3 CS
H235SSTL15DDR3 CKE
J235SSTL15DDR3 RAS
H635SSTL15DDR3 CAS
G435SSTL15DDR3 WE
D335SSTL15DDR3 Address 0
B235SSTL15DDR3 Address 1
G135SSTL15DDR3 Address 2
D435SSTL15DDR3 Address 3
E135SSTL15DDR3 Address 4
D235SSTL15DDR3 Address 5
F135SSTL15DDR3 Address 6
D535SSTL15DDR3 Address 7
C135SSTL15DDR3 Address 8
B335SSTL15DDR3 Address 9
E335SSTL15DDR3 Address 10
A135SSTL15DDR3 Address 11
E235SSTL15DDR3 Address 12
B435SSTL15DDR3 Address 13
C235SSTL15DDR3 Address 14
H135SSTL15DDR3 Address 15
J435SSTL15DDR3 Bank0
F335SSTL15DDR3 Bank1
G235SSTL15DDR3 Bank2
C535SSTL15DDR3 Data 0
B735SSTL15DDR3 Data 1
B635SSTL15DDR3 Data 2
C635SSTL15DDR3 Data 3
C735SSTL15DDR3 Data 4
D835SSTL15DDR3 Data 5
E535SSTL15DDR3 Data 6
E735SSTL15DDR3 Data 7
A635DIFF_SSTL15DDR3 Data Strobe
A535DIFF_SSTL15DDR3 Data Strobe
E635SSTL15DDR3 Data Mask

Ethernet PHY

The TE0710 board has two 10/100M Ethernet PHY's TLK106 connected using MII interface to FPGA bank 14.

Ethernet PHY Connections

FPGA PinFPGA BankNet NameI/O StandardComment
U1414ETH-RSTLVCMOS33Ethernet Reset, active-low
T1414ETH_TXCLKLVCMOS33Ethernet transmit clock input from PHY
R1614ETH_TX_D0LVCMOS33Ethernet transmit data 0. Output to Ethernet PHY.
U1814ETH_TX_D1LVCMOS33Ethernet transmit data 1. Output to Ethernet PHY.

R18

14ETH_TX_D2LVCMOS33Ethernet transmit data 2. Output to Ethernet PHY.
R1714ETH_TX_D3LVCMOS33Ethernet transmit data 3. Output to Ethernet PHY.
R1514ETH_TX_ENLVCMOS33Ethernet transmit enable. Output to Ethernet PHY. 
N1514ETH_RXCLKLVCMOS33Ethernet receive clock input from PHY.
U1214ETH_RX_D0LVCMOS33Ethernet receive data 0. Input from Ethernet PHY. 
V1214ETH_RX_D1LVCMOS33Ethernet receive data 1. Input from Ethernet PHY. 
U1314ETH_RX_D2LVCMOS33Ethernet receive data 2. Input from Ethernet PHY. 
T1514ETH_RX_D3LVCMOS33Ethernet receive data 3. Input from Ethernet PHY. 
V1014ETH_RX_DVLVCMOS33Ethernet receive data valid. Input from Ethernet PHY. 
V1114ETH_RX_ERLVCMOS33Ethernet receive error. Input from Ethernet PHY.
T914ETH_COLLVCMOS33

Ethernet collision detect input from Ethernet PHY.

T1814ETH_INTLVCMOS33

Ethernet power down or interrupt.

(default function is power down)

V1514LINK_LEDLVCMOS33

Ethernet LED Pin to indicate status. Mode 1: LINK Indication LED; Mode 2: ACT Indication LED

T1314MDCLVCMOS33Ethernet to PHY MII Management clock
V1414MDIOLVCMOS33PHY MDIO data I/O ( 3-state buffer)
P1714ETH2_TXCLKLVCMOS33Ethernet 2 transmit clock input from PHY.
M1314ETH2_TX_D0LVCMOS33Ethernet 2 transmit data 0. Output to Ethernet PHY.

M16

14ETH2_TX_D1LVCMOS33Ethernet 2 transmit data 1. Output to Ethernet PHY.
M1714ETH2_TX_D2LVCMOS33Ethernet 2 transmit data 2. Output to Ethernet PHY.
L1614ETH2_TX_D3LVCMOS33Ethernet 2 transmit data 3. Output to Ethernet PHY.
N1614ETH2_TX_ENLVCMOS33Ethernet 2 transmit enable. Output to Ethernet PHY.
p1514ETH2_RXCLKLVCMOS33Ethernet 2 receive clock input from PHY.
V1714ETH2_RX_D0LVCMOS33Ethernet 2 receive data 0. Input from Ethernet PHY.
T1614ETH2_RX_D1LVCMOS33Ethernet 2 receive data 1. Input from Ethernet PHY.
U1714ETH2_RX_D2LVCMOS33Ethernet 2 receive data 2. Input from Ethernet PHY.
N17 14ETH2_RX_D3 LVCMOS33Ethernet 2 receive data 3. Input from Ethernet PHY.
R11 14ETH2_RX_DV LVCMOS33Ethernet 2 receive data valid. Input from Ethernet PHY. 
U16 14ETH2_RX_ER LVCMOS33Ethernet 2 receive error. Input from Ethernet PHY.
P14 14ETH2_COL LVCMOS33

Ethernet 2 collision detect input from Ethernet PHY.

D10 16ETH2_INT LVCMOS33

Ethernet 2 power down or interrupt

T1014LINK_LED2LVCMOS33

Ethernet LED Pin to indicate status. Mode 1: LINK Indication LED; Mode 2: ACT Indication LED

N14 14MDC2LVCMOS33Ethernet 2 to PHY MII 2 Management clock
P18 14MDIO2LVCMOS33PHY MDIO data I/O ( 3-state buffer)

MAC Address EEPROM

The TE0710 board has a UNI/O serial EEPROM with EUI-48™ Node Identity. This device is a 2 Kbit Serial Electrically Erasable PROM. It is organized in blocks of x8-bit memory and supports single I/O UNI/O® serial bus. It has a built-in 48-bit Extended Unique Identifier (EUI) that is needed to identify the network hardware’s physical address. These built-in MAC addresses enable designer to buy addresses only when needed, and also eliminate the need for serialization and programming. The address is also EUI-64 compatible, and it is write-protected to ensure tamper-proof designs. It contains an 8-bit instruction register and is accessed via the SCIO pin. The Address Data is embedded into the I/O stream through Manchester encoding. The bus is controlled by a master device which determines the clock period, controls the bus access and initiates all operations, while the serial EEPROM works as slave.

  • Part number: 11AA02E48T-I/TT (Microchip)
  • Supply voltage: 3.3V
  • Pre-programmed Globally Unique, 48-bit Node Address

  • Compatible with EUI-48™ and EUI-64™
  • 256 x 8 Bit Organization
FPGA PinBankI/O StandardCommentFunction
D916LVCMOS33Serial bit stream (SCIO)Serial Clock, Data Input/Output

For more information about this device, please refer to the Microchip 11AA02E48 Datasheet.

Board-to-Board Connectors

...

View and download the connector pinout for this module in the master pinout table here: Master Pinout Table

Initial Delivery state

Storage device name

Content

Notes

SPI Flash OTP AreaEmpty, not programmedExcept serial number programmed by flash vendor
SPI Flash Quad Enable bitProgrammedMust be programmed for SPI Flash Boot
SPI Flash main arraydemo design 
EFUSE USERNot programmed 
EFUSE SecurityNot programmed 

Revision History For This Product

Revision

Changes

02

Current Hardware Revision

Technical Specification

Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Vin supply voltage

-0.3

6.0

V

 

Vin33 supply voltage

-0.4

3.6

V

 

I/O voltage on any FPGA I/O

-0.4

Vcco+0.55 

V

 

Voltage on JTAG pins

-0.5

3.75

V

When Vin33 is powered

Storage Temperature

-40

+100

C

 

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference document
Vin supply voltage2.45.5V  
Vin33 supply voltage13.465V  
PL IO Bank supply voltage for HR I/O banks (VCCO)1.143.465V Xilinx document DS181
I/O input voltage for HR I/O banks-0.20Vcco+0.20V Xilinx document DS181
Voltage on Module JTAG pins3.1353.465V Xilinx document DS181
Note
Please check Xilinx Datasheet for complete list of Absolute maximum and recommended operating ratings for the Artix-7 device (DS181).

Physical Dimensions

  • Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8mm

  • PCB thikness: 1.6mm

  • Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

Download physical dimensions here: TE0710 Physical Dimensions

Power Supplies

Vin

3.3 V to 5.5 V

Typical 200mA, depending on customer design and connections.

Vin 3.3 V

3.3 V

Typical 50mA, depending on customer design and connections.

For startup, a power supply with minimum current capability of 2A is recommended.

Tip

Vin and Vin 3.3V can be connected to the same source (3.3 V).

Temperature Ranges

Commercial grade modules

0 °C to +70 °C

Industrial grade modules

-40 °C to +85 °C

Note

Depending on the customer design, additional cooling might be required.

Weight

WeightNote

11.5 g

without bolts

20.3 g

with bolts

Downloads For This Product

Recommended Software: Xilinx Vivado WebPACK (free license)

Note

A15T, A35T, A50T, A75T are not supported by Xilinx legacy tools (ISE, Impact).

The schematic is available for download here: TE0710 Schematic

Resources 

Document Change History

DateRevisionAuthorsDescription2016-01-18  2015-12-150.1

 

Antti Lukats  AllAntti Lukats 

Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices