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Refer to https://wiki.trenz-electronic.de/display/PD/TE0820+TRM for online version of this manual and additional technical documentation of the product.
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The Trenz Electronic TE0820 is 4 x 5 cm standard footprint MPSoC module integrating a Xilinx Zynq UltraScale+ with up to 4 GByte 32-Bit DDR4 SDRAM, max. 512 MByte SPI Boot Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.
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See also TE0820 System Controller CPLD page.
eMMC Flash Memory
eMMC Flash memory device(U6) is connected to the ZynqMP PS MIO bank 500 pins MIO13..MIO23. eMMC chips MTFC4GACAJCN-4M IT (FLASH - NAND Speicher-IC 32 Gb (4 G x 8) MMC ) is used.
DDR4 Memory
By default TE0820-02 module has two 16-bit wide Nanya NT5AD256M16B2 DDR4 SDRAM chips arranged into 32-bit wide memory bus providing total of 1 GBytes of on-board RAM. Different memory sizes are available optionally.
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Date | Revision | Contributors | Description | ||||||||
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| John Hartfiel |
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| 2017-09-25 | v.48 | John Hartfiel |
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| 2017-09-18 | v.4947 | John Hartfiel |
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| 2017-08-30 | v.46 | Jan Kumann |
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2017-08-24 | v.36 | John Hartfiel |
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| 2017-08-21 | v.34 | John Hartfiel |
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| 2017-08-21 | v.33 | Jan Kumann |
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2017-08-18 | v.7 | John Hartfiel |
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2017-08-07 | v.5 | Jan Kumann | Initial version. |
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