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Refer to https://wiki.trenz-electronic.de/display/PD/TE0725LP+TRM for online version of this manual and the rest of available documentation of the product. |
The Trenz Electronic TE0725LP is a low cost small-sized FPGA module integrating a Xilinx Artix-7 and 32 MByte Flash memory for configuration and operation.
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Xilinx Artix-7 XC7A100T FPGA
32 MByte QSPI Flash memory
2 x 50-pin headers with 2,54mm pitch, ideal for breadboard use
- 92 x GPIOs (42 + 42 + 8)
- 25.000000 MHz system clock
- I2C EEPROM for FPGA bitstream
3.3V single power supply with on-board voltage regulators
JTAG/UART connector
1 user LED
- Optional HyperRAM (8 to 32 MByte)
- Commercial temperature grade (Industrial on Request)
- Size 73 x 35 mm
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Figure 1: TE0725LP-01 Block Diagram.
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Main Components
Figure 2: TE0725LP-01 FPGA module (Variant TE0725LP-01-100-2D depicted).
- XMOD header, JB1
- 14-pin header placeholder for connector, J3
- Xilinx Artix-7 FPGA, U1
- 1.8V, 256 MBit (32 MByte) quad SPI serial flash memory, U7
- Red LED (SYSLED), D2
- Cypress S26KS512S 512 Mbit (64 MByte) 1.8V HyperFlash™ memory, U4 (optional)
- Low-power programmable oscillator @25.000000 MHz, U3
- Low VIN high-efficiency step-down converter (1.5A max.), U5
- Low VIN high-efficiency step-down converter (1.5A max.), U6 (optional)
- 50-pin header placeholder for breadboard connector, J1
- 50-pin header placeholder for breadboard connector, J2
- Ultra-low supply-current voltage monitor with optional watchdog, U8
- 128K I2C CMOS serial EEPROM, U2
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I/O signals connected to the SoCs I/O bank and B2B connector:
Bank | Type | B2B Connector | I/O Signal Count | Bank Voltage |
---|---|---|---|---|
14 | HR | J3 | 8 I/O's, 4 LVDS pairs | 1.8V |
34 | HR | J2 | 42 I/Os, 21 LVDS pairs | VCCIO34 |
35 | HR | J1 | 42 I/Os, 21 LVDS pairs | VCCIO35 |
Table x: General overview of PL I/O signals connected to the B2B connectors.
PL I/O-Banks
Bank | VCCIO | Available I/O's Count | B2B I/O Count | Notes | |
---|---|---|---|---|---|
0 | 3.3V | 11 | 0 | 4 | 4 I/O's used for JTAG interface, 3 control signals (DONE, PROG_B, INIT).JTAG |
14 | 3.3V | 0 (3) | 12 | 11 | 8 I/O's (4 LVDS pairs) connected to J3, 3 I/O in XMOD-JTAG - for use as UART's to XMOD header JB1 (2 UART I/O's, 1 user I/O), 1 I/O to LED D2. |
15 | 1.8V | 18 | 0 | Used for optional hyper Hyper RAM U4. | |
34 | User select | 42 | 42 | 0R 0-Ohm resistor R17 option to select 3.3V1.8V I/O-bank VCCIO. | |
35 | User select | 42 | 42 | 0R 0-Ohm resistor R25 option to select 3.3V1.8V I/O-bank VCCIO. |
Table x: General overview of PL I/O-bank signals.
JTAG Interface
JTAG access to the Xilinx Artix-7 device is provided through connector XMOD header JB1.
Signal | Pin Number |
---|---|
TCK | JB1-4 |
TDO | JB1-8 |
TDI | JB1-10 |
TMS | JB1-12 |
Connector JB1 Header JB1 (2 x 6 pin header) is compatible with XMOD-JTAG adapter TE0790. This adapter can be inserted from top onto the TE0725LP, if JB1 is fitted with male pin header. Optionally JB1 can be fitted with pin header from bottom, in that case the JTAG cable connector must be on the base board.When
XMOD FTDI JTAG-
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Adapter Header JB1
The JTAG interface of the FPGA can be accessed via XMOD header JB1, so in use with the XMOD-FT2232H adapter-board TE0790 the FPGA can be configured via USB2.0 interface. The TE0790 board provides also an UART interface to the FPGA device which can be accessed by the USB2.0 interface of the adapter-board while the signals between these serial interfaces will be converted.
Following table describes the signals and interfaces of the XMOD header JB1:
Pin Schematic Name | XMOD Header JB1 Pin | Note |
---|---|---|
F_TCK | C (pin J3-4) | - |
F_TDO | D (pin J3-8) | - |
F_TDI | F (pin J3-10) | - |
F_TMS | H (pin J3-12) | - |
UART_RXD | A (pin J3-3) | UART receive line, connected to PL I/O-bank 14. |
UART_TXD | B (pin J3-7) | UART transmit line, connected to PL I/O-bank 14. |
XMOD_E | E (pin J3-9) | User configurable, connected to PL I/O-bank 14, pin M17. |
NRST | G (pin J3-11) | Assigned to 'PROG_B' (configuration reset-signal of FPGA) via IC U8. |
Table 6: XMOD header JX1 signals and connections.
When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VCCIO will be sourced by the FPGA module's supply voltage (1.8V or 3.3V). The adapter board's VCC has to be sourced by the USB Host interface.
For this configuration, set the XMOD DIP-switch as follows in table below:
XMOD DIP-switches | Position |
---|---|
Switch 1 | ON |
Switch 2 | OFF |
Switch 3 | OFF |
Switch 4 | ON |
Table 7: XMOD adapter board DIP-switch positions for voltage configuration.
Note |
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Use Xilinx compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the Xilinx Zynq devices. The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download. |
When using XMOD-JTAG please check its DIP-switch S2 settings to be sure that correct power and I/O reference voltages ares are set. TE0790 can be in some cases used to power up TE0725LP, however this is not recommended. TE0790-01 can not supply enough power for TE0725LP (LED may blink but the module is not operating properly, especially in case of larger and more sophisticated FPGA designs).
UART Interface
UART interface is available on B2B connector JM2. With the TE0790 XMOD USB2.0 adapter, the UART signals can be converted to USB2.0 interface signals:
UART Signal Schematic Name | B2B | XMOD Header JX1 | Pin Header J3 | Note |
---|---|---|---|---|
B14_L0 | JM2-99 | JX1-7 | J3-7 | UART-TX (transmit line) |
B14_L25 | JM2-97 | JX1-3 | J3-3 | UART-RX (receive line) |
Table 10: UART interface signals.
QSPI Interface
The QSPI interface of the FPGA device is routed to and used by the on-module QSPI flash IC U7:
SD IO Signal Schematic Name | FPGA I/O | Flash IC U7 Pin | Note |
---|---|---|---|
SPI-DQO | Bank 14, pin K17 | D3 | QSPI data |
SPI-DQ1 | Bank 14, pin K18 | D2 | QSPI data |
SPI-DQ2 | Bank 14, pin L14 | C4 | QSPI data |
SPI-DQ3 | Bank 14, pin M14 | D4 | QSPI data |
SPI_SCK | Bank 0, pin E9 | B2 | QSPI clock |
SPI-CS | Bank 14, pin L13 | C2 | QSPI chip select |
Table 11: QSPI interface signals.
I2C Interface
The I2C interface of the FPGA device is routed to and used by the on-module EEPROM IC U2:
I²C Signal Schematic Name | FPGA I/O | EEPROM IC U2 Pin | Notes |
---|---|---|---|
I2C_SDA | Bank 14, pin U18 | 5 | I²C data line, 1.8V reference voltage |
I2C_SCL | Bank 14, pin U17 | 6 | I²C clock line, 1.8V reference voltage |
I2C_WP | Bank 14, pin T18 | 7 | Write-protect signal of EEPROM |
Table 10: I2C interface signals.
On-board Peripherals
Quad SPI Flash Memory
On-module QSPI flash memory (U7) is provided by Micron Serial NOR Flash Memory N25Q256A with 256 Mbit (32 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.
HyperFlash RAM
Configaration EEPROM
Oscillators
On-board LEDs
There is one red LED connected to the FPGA bank 14, pin M16. This LED is user configurable to indicate for example any system status.
LED | Color | FPGA | Notes |
---|---|---|---|
D2 | Red | M16 | SYSLED |
Table x: LEDs of the module.
Connectors
All connectors are are for 100mil headers, all connector locations are in 100 mil grid.
100mil (2.54mm) grid. The module's PCB provides footprints to mount and solder optional (B2B connector) headers, if those are not factory-fitted on module.
Power and Power-On Sequence
To power-up a module, power supply with minimum current capability of 1A is recommended.
Power Supply
TE0725LP needs one single power supply with nominal of 3.3V.
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FPGA | Design | Typical Power, 25C ambient |
---|---|---|
A100T | Not configured | TBD* |
Table x: General overview of PL I/O signals connected to the B2B connectors.
*TBD - To Be Determined.
Actual power consumption depends on the FPGA design and ambient temperature.
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Module Variant | FPGA Chip Model | PL Clock | VIN Supply Voltage |
---|---|---|---|
TE0725LP-01-100-2C | XC7A100T-2CSG324C | 25 MHz | 3.3 V |
TE0725LP-01-100-2D | XC7A100T-2CSG324C | 25 MHz | 1.8 V |
TE0725LP-01-100-2L | XC7A100T-2CSG324C | 25 MHz | 1.8 V |
Table x: General overview of PL I/O signals connected to the B2B connectors.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference document |
---|---|---|---|---|
3.3V supply voltage | -0.1 | 3.6 | V | |
HR I/O banks supply voltage (VCCO) | -0.5 | 3.6 | V | Xilinx datasheet DS181 |
HR I/O banks input voltage | -0.4 | VCCO + 0.55 | V | Xilinx datasheet DS181 |
Storage Temperature | -40 | +85 | °C |
Table x: General overview of PL I/O signals connected to the B2B connectors.
Recommended Operating Conditions
Parameter | Min | Max | Units | Reference document |
---|---|---|---|---|
VIN supply voltage | 3.135 | 3.45 | V | |
HR I/O banks supply voltage (VCCO) | 1.14 | 3.465 | V | Xilinx datasheet DS181 |
HR I/O banks input voltage | -0.20 | VCCO + 0.20 | V | Xilinx datasheet DS181 |
Operating Temperature | 0 | +85 | °C |
Table x: General overview of PL I/O signals connected to the B2B connectors.
Note |
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Please check Xilinx datasheet DS181 for complete list of absolute maximum and recommended operating ratings for the Artix-7 device. |
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Physical Dimensions
Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). This is because of the 100mil pin headers used, see also explanation below. To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.
All 100 mil pin headers are in 100 mil grid, the M3 mounting holes are in 50 mil grid aligned to the centers of the 100mil headers. The module is symmetrical, turning it 180 degrees will keep all I/O and Power pins in both 50 pin headers in compatible places.page-break
Operating Temperature Ranges
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Date | Revision | Notes | PCN | Documentation Link |
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2016-07-21 | 01 | Prototypes |
Table x: General overview of PL I/O signals connected to the B2B connectors.
Hardware revision number is printed on the PCB board together with the module model number separated by the dash.
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Date | Revision | Contributors | Description | ||||||||
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| Jan Kumann | Initial version. |
Table x: General overview of PL I/O signals connected to the B2B connectors.
Disclaimer
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