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Block Diagram

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Figure 1: TEM0001-01 block diagram

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  1. Microsemi SmartFusion2 FPGA SoC, U5
  2. 8 Mbyte SDRAM 166MHz, U2
  3. Micro USB2 B socket (receptacle), J9
  4. Switch button (reset), S1
  5. Switch button (user), S2
  6. Red LED (user), D10
  7. Green LED (indicating supply voltage), D1
  8. 8x red LEDs (user), D2 - D9
  9. FTDI USB2 to JTAG/UART adapter, U3
  10. 8 Mbyte QSPI Flash memory, U1
  11. 32.768 KHz auxiliary crystal oscillator, Y1
  12. 25 MHz main crystal oscillator, Y2
  13. 1x14 pin header (2.54mm pitch), J2
  14. 1x6 pin header (2.54mm pitch), J4
  15. 3-pin header (2.54mm pitch), J3
  16. 1x14 pin header (2.54mm pitch), J1
  17. 2x6 Pmod connector, J6

Initial Delivery State

Storage device name

Content

Notes

Quad SPI Flash (U1) OTP area

DEMO Design

-
I2C Configuration EEPROM, U9

Programmed

-

Table 1: Initial delivery state of programmable devices on the module

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I/O signals of the FPGA SoC's I/O banks connected to the board's pin headers and connectors:

BankConnector DesignatorI/O Signal CountBank VoltageNotes
1J11 I/O's3.3V-
1J24 I/O's3.3V2 I/O's of bank 1 can be pulled-up to 3.3V (4K7 resistors) with 2 I/O's of Bank 7 or pins can be shared.
2J113 I/O's3.3V-
2J25 I/O's3.3V-
2J68 /O's3.3VPmod Connector.
3J45 I/O's3.3VJTAG interface.
4J32 I/O's3.3VI/O's (PROBE A, B) are dedicated to live probes.
7J22 I/O's3.3VThose 2 I/O's are dedicated to pull-up 2 I/O's of bank 1 or pins can be shared.

Table 2: General overview of single ended I/O signals connected to pin headers and connectors

FPGA I/O banks

BankVCCIOI/O's CountAvailable on ConnectorsNotes
13.3V1456 I/O's connected to FTDI chip, 1 I/O used for user button S2, 2 I/O's connected to red user LEDs D2 and D10.
23.3V37266 I/O's user for QSPI Flash, 5 I/O's connected to red user LEDs D3 ... D7.
33.3V55Bank 3 is dedicated to JTAG interface.
43.3V2402 I/O's are dedicated to live probes, all other I/O's are used as memory interface.
73.3V2222 I/O's available on header J2, 2 I/O's connected to red user LEDs D8 and D9, all other I/O's are used as memory interface.

Table 3: General overview of FPGA I/O banks

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Optionally 1x6 male pin header J4 can be fitted on board for access to the JTAG interface on board. The pin assignment of header J4 is shown on table below:

JTAG SignalPin on Header J4Note
TCK3-
TDI5-
TDO4-
TMS6-
JTAGSEL2

The JTAGSEL pin of SmartFusion2 device depends on the used JTAG programmer. 

Table 4: optional second JTAG interface or GPIO (JTAGSEL dependent)

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The QSPI interface of the FPGA device is routed to and used by the on-module QSPI flash IC U1:

SD IO Signal Schematic NameFPGA I/OFlash IC U1 PinNote
F_CSBank 2, pin K151QSPI chip select
F_CLKBank 2, pin P186QSPI clock
F_DIBank 2, pin P195QSPI data
F_DOBank 2, pin K162QSPI data
F_D2Bank 2, pin J183QSPI data
F_D3Bank 2, pin N197QSPI data

Table 5: QSPI interface signals

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The FPGA SoC module has following reference clocking signals provided by on-board oscillators:

Clock SourceSchematic NameFrequencyClock Input Destination
Microchip MEMS Oscillator, U7CLK12M12.0000 MHzFTDI FT2232 U3, pin 3; FPGA SoC bank 2, pin N16

ECS SMD Crystal Oscillator, Y1

-32.768 KHzFPGA SoC U5 auxiliary clock input, pin W17/Y17
AVX Quartz Crystal Oscillator, Y2-25.000 MHzFPGA SoC U5 main clock input, pin W18/Y18

Table 6: Clock sources overview

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There are 10 LEDs fitted on the FPGA module board. The LEDs are user configurable to indicate for example any system status.

LEDColorSignal Schematic NameFPGANotes
D1Green--Indicating 3.3V board supply voltage
D2Red'LED1'E18user
D3Red'LED2'R17user
D4Red'LED3'R18user
D5Red'LED4'T18user
D6Red'LED5'U18user
D7Red'LED6'R16user
D8Red'LED7'E1user
D9Red'LED8'D2user
D10Red'USER_LED'G17user

Table 7: LEDs of the module

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The TEM0001 FPGA module is equipped with two push buttons S1 and S2:

ButtonSignal Schematic NameFPGANotes
S1'USER_BTN'B19user configurable
S2'RESET'U17system reset

Table 8: Push buttons of the module

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Figure 3: Power Distribution Diagram

Power Consumption

FPGADesignTypical Power, 25C ambient
Mircosemi SmartFusion2 FPGA SoC M2S010-VFG400Not configuredTBD*

Table 9: Module power consumption

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Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference document

VIN supply voltage (5.0V nominal)

-0.3

6.0

V

EP53A7HQI / EP53A7LQI datasheet
I/O Input voltage for FPGA I/O bank-0.33.63VMicrosemi datasheet DS0128

Storage Temperature

-40

+90

°C

LED R6C-AL1M2VY/3T datasheet

Table 10: Absolute maximum ratings

Recommended Operating Conditions

ParameterMinMaxUnitsReference document
VIN supply voltage (5.0V nominal)4.755.25Vsame as USB-VBUS specification
I/O Input voltage for FPGA I/O bank03.45VMicrosemi datasheet DS0128
Operating temperature range0+70

°C

Winbond datasheet W9864G6GT

Table 11: Recommended operating conditions

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Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
-

01

  • First Production Release
 - TEM0001-01

Table 12: Module hardware revision history

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Figure 5: Module hardware revision number

Document Change History

 Date

Revision

ContributorsDescription

Page info
modified-date
modified-date
dateFormatyyyy-MM-dd

Ali Naseri

  • First TRM release

Table 13: Document change history

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