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titleFigure 3: Power Distribution Diagram
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Power Consumption

FPGADesignTypical Power, 25C ambient
Mircosemi SmartFusion2 FPGA SoC M2S010-VFG400Intel Cyclone 10LP 10CL025 FPGA SoCNot configuredTBD*

Table 912: Module power consumption

*TBD - To Be Determined.

Actual power consumption depends on the FPGA design and ambient temperature.

Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed.

Determined.

Actual power consumption depends on the FPGA design and ambient temperature.

Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed.

Power Rails

Connector DesignatorVCC / VCCIO Schematic NameVoltageDirectionPinsNotes
J25V5.0VOutPin 14-
VIN5.0VInPin 13-
3.3V3.3VOutPin 12-
J6

3.3V

3.3V

OutPin 6, 12-
J9

USB_VBUS

5.0VInPin 1-

Table 13: Connector power pin description

Bank Voltages

Bank

Voltage

Voltage Range

13.3Vall bank voltages fixed
23.3V
33.3V
43.3V
53.3V
63.3V
73.3V
83.3V

Table 14: FPGA SoC VCCO bank voltages

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference document

VIN supply voltage (5.0V nominal)

-0.3

6.0

V

EP53A7HQI / EP53A7LQI datasheet
I/O Input voltage for FPGA I/O bank-0.33.63VMicrosemi datasheet DS0128

Storage Temperature

-40

+90

°C

LED R6C-AL1M2VY/3T datasheet

Table 1013: Absolute maximum ratings

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ParameterMinMaxUnitsReference document
VIN supply voltage (5.0V nominal)4.755.25Vsame as USB-VBUS specification
I/O Input voltage for FPGA I/O bank03.45VMicrosemi datasheet DS0128
Operating temperature range0+70

°C

Winbond datasheet W9864G6GT

Table 1114: Recommended operating conditions

Note
Please check Microsemi datasheet  DS0128 for complete list of absolute maximum and recommended operating ratings for the FPGA device.

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DateRevision

Notes

PCNDocumentation Link
-

02

Second Production Release

 -TEI0003-02
-01First Production Release-TEI0003-01

Table 12: Module hardware revision history

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