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| Company | Trenz Electronic GmbH |
|---|---|
| PCN Number | PCN-20190107 |
| Title | TE0803-02-* to TE0803-03-* DDR RAM and SPI Flash Hardware Revision Change |
| Subject | BOM change |
| Issue Date | 2019-0106-0705 |
Products Affected
This change affects Trenz Electronic TE0803-02 SoMs: TE0803-02-*
Affected Product | Changes | Replacement |
|---|---|---|
| TE0803-02-02CG-1EA | #1 , #2- #6 | TE0803-03-2AE11-A |
| TE0803-02-02EG-1EA | #1 - #6 | TE0803-03-2BE11-A |
| TE0803-02-03CG-1EA | #1 , #2- #6 | TE0803-03-3AE11-A |
| TE0803-02-04CG03EG-1EA | #1 , #2- #6 | TE0803-03-3BE11-A |
| TE0803-02-04CG03-1EA-1EBS | #1 still aktive - #6 | TE0803-03-3BE11-AS |
| TE0803-02-04EG04CG-1EA | #1 , #2 new name?- #6 | TE0803-03-4AE11-A |
| TE0803-02-04EG-1EA | #1 - #6 | TE0803-03-4BE11-A1IA#2 |
| TE0803-02-04EG-1IC1E3 | #2 still aktive ?- #6 | TE0803-03-4BE21-L |
| TE0803-02-04EG-1E31ID | #2 - #6 | TE0803-03-4BI21-A |
| TE0803-02-04EV-1EA | #1 , #2 still aktive- #6 | TE0803-03-4DE11-A |
| TE0803-02-04EV-1E3 | #2 - #6 | TE0803-03-4DE21-L |
| TE0803-02-05EV-1EA | #1 , #2- #6 | TE0803-03-5DE11-A |
| TE0803-02-05EV-1IA | #2 - #6 | TE0803-03-5DI21-A |
Changes
#1 Change DDR4 RAM from NT5AD256M16B2-GN to NT5AD256M16D4-HR
Type: BOM change
Reason: End of Life announced.
Impact: New DDR timings need to be considered in designs.
Method of Identification
Locate DDR4 RAM (U12, U9, U2, U3) on top side of PCB:
| old | new |
|---|---|
NT5AD256M16B2-GN | NT5AD256M16D4-HR |
|
|
#2 Change SPI Flash from N25Q512A11G1240E
...
to MT25QU512ABB8E12-
...
0SIT
Type: BOM change
Reason: N25Q512A11G1240E became obsolete.
Impact: None. Both have same JEDEC ID changed from BB20h to 701Ah. Manufacturer ID changed form 20h to 9DhBB20h and manufacturer ID 20h.
Method of Identification
Locate DDR4 RAM (U12, U9, U2, U3) on top side and Flash (U7, U17) on bottom side of PCB:
| old | new |
|---|---|
N25Q512A11G1240E | |
NT5AD256M16B2-GN | NT5AD256M16D4-HR |
|
|
N25Q512A11G1240E | IS25WP512M-RHLE |
|
MT25QU512ABB8E12-0SIT | |
|
|
#3 Added support of DDP DDR4
Type: PCB change
Reason: Request for larger RAM
Impact: Dual Die Package Chips supported
#4 Added support of low power FPGA (-L1/L2).
Type: PCB change
Reason: Request for power optimization
Impact: Low power FPGAs supported
#5 Revised testpoints
Type: PCB change
Reason: Prepare for automatic testing
Impact: Testpoint positions changed
#6 Revised J1-J4 connectors net label style
Type: Schematic change
Reason: Improve readability
Impact: None
Method of Identification
The model code and revision number (e.g. TE0803-02 or TE0803-03) are printed on the top side of the PCB.
Production Shipment Schedule
From Januar Mai 2019, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.
Contact Information
If you have any questions related to this PCN, please contact Trenz Electronics Technical Support at
- forum.trenz-electronic.de
- wiki.trenz-electronic.de
- support%trenz-electronic.de (subject = PCN-20190107)
phone
national calls: 05223 65301-0
international calls: 0049 5223 65301-0
Disclaimer
Any projected dates in this PCN are based on the most current product information at the time this PCN is being issued, but they may change due to unforeseen circumstances. For the latest schedule and any other information, please contact your local Trenz Electronic sales office, technical support or local distributor.
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