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Template Revision 2.6

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"

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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
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        titleText


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        ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>


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Note for Download Link of the Scroll ignore macro:


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Download PDF version of this document.


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Table of Contents

Table of Contents

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The Trenz Electronic TEI0015 is an a commercial-grade module based on Intel® , low cost and small size module integrated with Intel® MAX 10. Intel   Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.

Refer to http://trenz.org/tei0015-info for the current online version of this manual and other available documentation.

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Notes :

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Note:
Use 'Key Features' description in shoping page, for example: https://shop.trenz-electronic.de/de/TE0728-04-1Q-SoC-Micromodul-mit-Xilinx-Automotive-Zynq-7020-512-MByte-DDR3L-6-x-6-cm

  • ...
  • ....
  • ....

Block Diagram

For more information regarding how to draw a diagram

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add drawIO object here.

Note
  • Intel® MAX 10 Commercial [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C to 85°C

    • Package compatible device 10M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to 32 Mbyte (8Mbyte default)

  • USB 2.0 Multipurpose UART/FIFO IC (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)

  • 8x User LED 
  • 18 Bit 2MSPS Analog to Digital Converter
  • 2x SMA Female Connector

  • I/O interface: 23x GPIO - Arduino MKR compatible

  • Power Supply: 5V

  • Dimension: 86.5mm x 25mm

  • Others:

    • Instrumentation Amplifier

    • Differential Amplifier

    • Operational Amplifier

Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleTExxxx TEI0015 block diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
anchorFigure_OV_BD
titleTEI0015 main components


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  1. SMA Connector, J5...

  2. ...
  3. ...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module

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Storage device name

...

Content

...

Notes

...

Quad SPI Flash

...

Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.
  1. 6

  2. Amplifier, U12 - U14 - U6

  3. Voltage Reference, U8

  4. Analog to Digital Converter, U15

  5. Voltage Regulator, U10 - U13 - U16

  6. Switching Voltage Regulator/LDO, U11 - U4

  7. SDRAM Memory, U2

  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5

  10. 12.00 MHz MEMS oscillator, U7

  11. FTDI USB2 to JTAG/UART adapter, U3

  12. User LEDs, D2...9

  13. FTDI configuration EEPROM, U9

  14. Configuration/Status LED (Red) , D10

  15. Power-on LED (Green), D1

  16. Push button, S1...2

  17. Micro USB Connector, J9

  18. 1x14 pin header, J2 (Not assembled)

  19. 1x6 pin header, J4 (Not assembled)

  20. 1x4 Header, J3 (Not assembled)

  21. 1x14 pin header, J1 (Not assembled)

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


Scroll Title
anchorTable_OV_BPIDS
titleBoot process.Initial delivery state of programmable devices on the module

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MODE Signal State

Boot Mode
Scroll Title
anchorTable_OV_RST
titleReset process.
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Signal

B2BI/ONote

...

Storage device name

Content

Notes

Quad SPI Flash

N/A

Not populated

EEPROM

Programmed

FTDI configuration


Configuration Signals

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

...

anchorTable_SIP_B2B
titleGeneral PL I/O to B2B connectors information

...

JTAG access to the TExxxx SoM through B2B connector JMX.

...

anchorTable_SIP_JTG
titleJTAG pins connection

...

JTAG Signal

...

B2B Connector

...

MIO Pins

...

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

...

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

...

anchorTable_OBP_MIOs
titleMIOs pins

...

  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.

FPGA Reconfigration can be triggered by pressing push button S1.

Scroll Title
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titleReset process.

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Signal

Push ButtonPin HeaderNote

RESET

S1J2Connected to nCONFIG


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

I/Os on Pin Headers and Connectors

Scroll Title
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titleGeneral I/Os to Pin Headers and connectors information

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FPGA BankConnector DesignatorI/O Signal CountVoltage LevelNotes
Bank 1AJ173.3VAIN0...6
Bank 1BJ453.3VJTAG interface
Bank 2J143.3VDIO2...5
Bank 5J293.3VDIO6...14
J123.3VDIO0...1
Bank 8J213.3VRESET


FPGA I/O Banks

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



Scroll Title

...

Scroll Title
anchorTable_OBP_RTC
titleI2C interface MIOs and pins
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cellHighlightingtrue
MIO PinSchematicU? PinNotes
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anchorTable_OBP_IOs
titleOn board peripherals
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Chip/InterfaceDesignatorNotes

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

...

anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins
anchorTable_OBP_I2C_RTC
titleI2C Address for RTCFPGA I/O Banks


FPGA BankI/O Signal CountConnected toNotes
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


41x14 Pin header, J1D2...5
5A2D, U15ADC_EN, ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
112MHz Oscillator, U7CLK12M
2Amplifier, U12nIAMP_A0, nIAMP_A1
Bank 322SDRAM, U2RAM_ADDR_CMD
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
Bank 8



8User Red LEDs, D2...9LED0...7
6SPI Flash, U5F_CS, F_CKL, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-USB Connector

The Micro-USB connector J9 provides an interface to access the FIFO/UART and JTAG functions via FTDI FT2232 chip. The use of this feature requires that FTDI USB drivers are installed on your host PC.

scroll-
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anchorTable_OBP_USB
titleMicro USB-2 connector pins

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MIO PinI2C AddressDesignatorNotes

...

PinsConnected toNote
VBUSUSB_VBUS
D+

FTDI FT2232H U3, DP pin


D-

FTDI FT2232H U3, DM pin



JTAG Interface

JTAG access to the TEI0015 SoM through pin header connector J4. This is normally not needed as there is on-board USB JTAG functionality.

scroll-title
anchorTable_OBPSIP_EEPJTG
titleI2C EEPROM interface MIOs and JTAG pins connection

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MIO

JTAG Signal

Pin Header Connector

SchematicU?? PinNotes
Scroll Title
anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM
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MIO PinI2C AddressDesignatorNotes

LEDs

...

anchorTable_OBP_LED
titleOn-board LEDs

...

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

...

anchorTable_OBP_ETH
titleEthernet PHY to Zynq SoC connections

...

Note
TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2Pulled-up to 3.3V


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


Scroll Title
anchorTable_OBP
titleOn board peripherals

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Chip/InterfaceDesignatorNotes
77530153U2
FTDI FT2232HU3JTAG/UART/FIFO
SPI FlashU5
77530153U9
OscillatorU712 MHz clock source
77530153U12, U14Analog to Digital Converter
Push ButtonsS1...2
8x User LEDsD2...9Red LEDs


SDRAM

TEI0015 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.


Scroll Title
anchorTable_OBP_CANSDRAM
titleCAN Tranciever interface MIOsSDRAM interface IOs and pins

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

Power Consumption
Scroll Title
anchorTable_PWR_PC
title

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Bank
SDRAM I/O Signals

Signal Schematic

U?? Pin

Name

Connected toNotes
D-TxDriver InputR-RxReciever Output

...

anchorTable_OBP_CLK
titleOsillators

...

Power and Power-On Sequence

...

hiddentrue
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Address inputs

A0 ... A13

bank 3-
Bank address inputs

BA0 / BA1

bank 3

-
Data input/output

DQ0 ... DQ15

bank 6

-
Data mask

DQM0 ... DQM1

bank 6

-
ClockCLKbank 3-
Control Signals

CS

bank 3

Chip select

CKE

bank 3

Clock enable

RAS

bank 3

Row Address Strobe

CAS

bank 3

Column Address Strobe

WEbank 3Write Enable


FTDI FT2232H

The FTDI chip U3 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the features of the FT2232H chip. FTDI FT2232H chip channel A is used in MPPSE mode for JTAG. Channel B is configured to be used in async FIFO mode, this is default mode when using preprogrammed FTDI configuration. In this mode the communication from host PC looks like normal UART but from the FTDI side it is 8 bit FIFO style interface.

The configuration of FTDI FT2232H chip is pre-programmed in the EEPROM U9.

Scroll Title
anchorTable_OBP_FTDI
titleFTDI chip interfaces and pins

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Power Input PinTypical Current
VINTBD*

* TBD - To Be Determined

Power Distribution Dependencies

...

anchorFigure_PWR_PD
titlePower Distribution
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Power-On Sequence

...

anchorFigure_PWR_PS
titlePower Sequency
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Voltage Monitor Circuit

...

anchorFigure_PWR_VMC
titleVoltage Monitor Circuit
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Power Rails

...

anchorTable_PWR_PR
titleModule power rails.

...

B2B Connector

JM1 Pin

...

B2B Connector

JM2 Pin

...

B2B Connector

JM3 Pin

...

Bank Voltages

FTDI Chip U3 PinSignal Schematic NameConnected toNotes
ADBUS0TCKFPGA bank 1B, pin G2JTAG interface
ADBUS1TDIFPGA bank 1B, pin F5
ADBUS2TDOFPGA bank 1B, pin F6
ADBUS3TMS

FPGA bank 1B, pin G1

BDBUS0BDBUS0FPGA bank 8, pin A4User configurable
BDBUS1BDBUS1FPGA bank 8, pin B4User configurable
BDBUS2BDBUS2FPGA bank 8, pin B5User configurable
BDBUS3BDBUS3FPGA bank 8, pin A6User configurable
BDBUS4BDBUS4FPGA bank 8, pin B6User configurable
BDBUS5BDBUS5FPGA bank 8, pin A7User configurable
BDBUS6BDBUS6FPGA bank 6, pin C11
BDBUS7BDBUS7FPGA bank 3, pin J7
BCBUS0BCBUS0FPGA bank 5, pin J9
BCBUS1BCBUS1FPGA bank 3, pin K5
BCBUS2BCBUS2FPGA bank 3, pin L4
BCBUS3BCBUS3FPGA bank 3, pin L5
BCBUS4BCBUS4FPGA bank 3, pin N12


SPI Flash

Optional SPI flash device maybe assembled in custom variants, normally it is not populated.

use "include page" macro and link to the general B2B connector page of the module series,

...

? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

  • 3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)

    Operating Temperature: -??°C ~ ??°C
    Current Rating: ??A per ContactNumber of Positions: ??
    Number of Rows: ??

Technical Specifications

...

Scroll Title
anchorTable_PWROBP_BVQSPI
titleZynq SoC bank voltages.Quad SPI Flash memory interface

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Bank          

Signal Schematic Name
Voltage
Connected toNotes

...

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...

F_CSFPGA bank 8, pin B3Chip select
F_CLKFPGA bank 8, pin A3Clock
F_DIFPGA bank 8, pin A2Data in / out
nSTATUS

FPGA bank 8, pin C4

Data in / out, configuration dual-purpose pin of FPGA
DEVCLRNFPGA bank 8, pin B9Data in / out, configuration dual-purpose pin of FPGA
F_DOFPGA bank 8, pin B2Data in / out


EEPROM

The configuration of FTDI FT2232H chip is pre-programmed in the EEPROM U9.

Scroll Title
anchorTable_TSOBP_AMREEP
titlePS absolute maximum ratingsI2C EEPROM interface MIOs and pins

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Symbols
Schematic
Description
Connected to
Min
Notes
MaxUnitVVVVVVVV

Recommended Operating Conditions

...

EECS

FTDI U3, Pin EECS
EECLKFTDI U3, Pin EECLK
EEDATAFTDI U3, Pin EEDATA


ADC

The TEI0015 board is equipped with the Analog Devices AD4003BCPZ-RL7 18-bit 2MSPS ADC.

Scroll Title
anchorTable_TSOBP_ROCA2D
titleRecommended operating conditions.A2D converter interface and pins

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anchorFigure_TS_PD
titlePhysical Dimension
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Currently Offered Variants 

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hiddentrue
idComments

Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

DEU Page:
Parameter
Pins
Min
Connected to
Max
Notes
UnitsReference DocumentVSee ???? datasheets.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.

Physical Dimensions

  • Module size: ?? mm × ?? mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? mm.

PCB thickness: ?? mm.

...

hiddentrue
idComments

In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

IN+

Diff Amplifier U14, VOUT-
IN-Diff Amplifier U14, VOUT+
SDIFPGA, bank 2, pin M2, ADC_SDI
SDOFPGA, bank 2, pin M1,  ADC_SDO
SCKFPGA, bank 2, pin N3,  ADC_SCK
CNVFPGA, bank 2, pin N2, ADC_CNV


LEDs

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DesignatorColorConnected toActive LevelNote
D2...9RedLED1...8Active HighUser LEDs
D10RedCONF_DONEActive LowConfiguration DONE LED
D1Green3.3V Active HighAfter power on it will be on.


Push Bottuns

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DesignatorConnected toFunctionalityNote
S1RESETGeneral reset
S2USER_BTNUser push buttonConnected to FPGA Bank 8.


Clock Sources

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Clock SourceSchematic NameFrequencyNote
MEMS Oscillator, U7CLK12M12.00 MHz

Connected to FTDI FT2232 U3, pin 3.

Connected to FPGA SoC bank 2, pin H6.


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

The module is power supplied from USB (optionally via unpopulated pin header).

Power Consumption

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FPGATypical Current
Intel MAX 10 10M08 FPGATBD*


* TBD - To Be Determined

Actual power consumption depends on the FPGA design and ambient temperature.

Power Distribution Dependencies

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titlePower Distribution


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Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed. After power on the green LED (D1) will be on.

Power Rails

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Power Rail Name

Connector

J2 Pin

Connector

J9 Pin

DirectionNotes
VINJ2-13-Input5 V - Pin Header
3.3VJ2-12-Output
5VJ2-14-Output

USB_VBUS

-J9-1Input5 V - USB Connector


Bank Voltages

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titleIntel MAX 10 SoC bank voltages.

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Bank          

Schematic Name

Voltage

Notes
Bank 1AVCCIO1A3.3V
Bank 1B

VCCIO1B

3.3V
Bank 2VCCIO23.3V
Bank 3VCCIO33.3V
Bank 5VCCIO53.3V
Bank 6VCCIO63.3V


Bank 8VCCIO83.3V



Technical Specifications

Absolute Maximum Ratings

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titleAbsolute maximum ratings

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SymbolsDescriptionMinMaxUnitReference Document

VIN 

Supply voltage4.755.25V
CH1-, CH1+Analog input voltage on amplifier U12 pin 1, 10-3030VAD8251 datasheet

T_STG

Storage Temperature-25+85°C


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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titleRecommended operating conditions.

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SymbolsMinMaxUnitReference Document

VIN supply voltage (5.0V nominal)

4.755.25V
Analog input voltage on amplifier U12 pin 1 (CH1-), 10 (CH1+)-1010VAD8251 datasheet

T_OP

0+70°CW9864G6JT-6 datasheet


Physical Dimensions

Module size: 25 mm × 86.5 mm.  Please download the assembly diagram for exact numbers.

PCB thickness: 1.22 mm.

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idComments

In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



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titlePhysical Dimension


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Currently Offered Variants 

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idComments

Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

if not available, set.

deProdukteTE07XX-Zynq-SoC/TE0728-Zynq-SoC/

if not available, set.


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titleTrenz Electronic Shop Overview

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Trenz shop TEI0015 overview page
English pageGerman page


Revision History

Hardware Revision History

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DateRevisionChangesDocumentation Link
2019-02-1101-REV01


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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titleTrenz Electronic Shop Overview Board hardware revision number.


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Trenz shop TE0728 overview page
English pageGerman page

Revision History

Hardware Revision History

List of online PCN ...Link

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Document Change History

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hiddentrue
idComments
  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports

...

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DateRevisionContributorDescription

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  • change listmultiple sections updated

2020-02-04

v.98ED
  • Technical Specifications updated

  • Power Rails updated

--

all

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  • --


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