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TE0803-03-
x
5
x
D
x
I
x
2
x
1
x
-
x
A
x
S

1 2

3456

78 9


10


11


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Module type

Additional options
TE
BB Mezzanine Module
Trenz Electronic

Module name
S
0802
Starter Kit
0803
0803
08060807080808130817081808200821
08230835
KWith heat spreader
0865






Module Revision
01

PCB Revision 1 (initial)

Device name
Other options (Connectors, custom options)
12345679ABDFZU+
A
ZU1
Standard height
ZU2ZU3ZU4ZU5ZU6ZU7ZU9ZU11ZU15ZU17ZU19
LLow profile
KMNPJRXYSTUV

ZU+ RFSoC

...Custom assembly variant, look additional table below
ZU21ZU25ZU27ZU28ZU29ZU39ZU42ZU43ZU46ZU47ZU48ZU49
PS and engine type and
/or
speed grade
eMMC (for 0820/0821)
ABDFGHKMNPRSTXY
-Not present at all (for TE0803/07/08)
CG-1EG-1EV-1CG-2EG-2EV-2CG-3EG-3EV-3CG-1LEG-1LEV-1LCG-2LDR-1DR-2
0Not populated (for TE0820/21)
Temp range (Tstr. abs. = -65°C to +150°C)
F8GByteIS21ES08G-JCLI#29169
XC  (Standard-Grade)XA  (Automotive-Grade)XQ  (Defense-Grade)
Extended (0/
EIQG8GByteKLM8G1GETF-B041#28669Extended (Tj = 0°C to
+100°C)Industrial (
Tj = –40°C to
–40/+100°C)Automotive (
Tj= –40°C to +
–40/125°C)
H
Industrial (I)Industrial Military
EIQ (R - Obsolete)TNM
DDR memory (TE0803/0807/0808: 4x; TE0820/0821:
2x)Flash memory (
2x
for all modules
)
0Not populated
0Not populated
1

TE0803/0807/0808: 2 GByte

. TE0820/0821: 1 Gbyte4GBit

Commercial4Gbit - NT5AD256M16D4-HR #29165
TE0820/0821: 1
512MbitMT25QU512ABB8E12-0SIT#292922
GByte
2TE0803/0807/0808/0812/0813/0817/0818: 4 GByteIndustrial8Gbit - K4A8G165WB-BIRC#28375
TE0820/0821: 2 GByte
TE0865:  4 GByte (PS) +  4 GByte (PL)
3TE0803/0807/0808: 8 GByteCommercial16Gbit (2 die) - K4AAG165WB-MCRC0CV#27787
TE0820/0821: 4 GByte
4
TE0803/0807/0808/0865:
4 GByte. TE0820/0821: 2 Gbyte8GBit - K4A8G165WB-BIRC#283752256MBitMT25QL256ABA8E12-1SIT#28856
8 GByteIndustrial16Gbit - MT40A1G16RC-062E IT:B#30258
TE0820/0821: 4 GByte
5TE0803/0807/0808: 4 GByteAutomotive8Gbit - MT40A512M16JY-083E AAT:B#30246
TE0820/0821: 2 GByte
6TE0803/0807/0808: 8 GByteIndustrial16Gbit (2 die) - H5ANAG6NCMR-XNI#30673
TE0820/0821: 4 GByte
7TE0813/TE0817/TE0818: 4 GByteIndustrial8GBit -  IS43QR16512A-083TBLI#30714
331GbitMT25QU01GBBB8E12-0SIT#28264
UTE0802/0823: 1
GbyteV
GByteIndustrial8Gbit - IS43LQ32256A-062BLI (LPDDR4)#29797
42GbitMT25QU02GCBB8E12-0SIT#28286
VTE0802/0823: 1 GByteCommercial
8Gbit - K4F8E304HB-MGCJ (LPDDR4)#28217
XDDR SODIMM Socket
YIC Socket (IC Debug Holder)
Flash memory (2x for all modules except TE0802)
0Not populated---
1TE0803/0807/0808/0813/0817/0818/0820/0821/0823/0865: 128MByteIndustrial512Mbit - MT25QU512ABB8E12-0SIT#29292
2TE0802/TE0803/0807/0808/0820/0821/0823: 64MByteIndustrial256Mbit - MT25QL256ABA8E12-1SIT#28856
3TE0803/0807/0808/0820/0821/0823: 256MByteIndustrial1Gbit - MT25QU01GBBB8E12-0SIT#28264
4TE0803/0807/0808/0820/0821/0823: 512MByte.Industrial2Gbit - MT25QU02GCBB8E12-0SIT#28286
5TE0803/0807/0808/0820/0821/0823: 64MByteAutomotive256Mbit - MT25QU256ABA8E12-0AAT#30245

6

TE0818/TE0830: 128MByteExtended (-40 .. +105 °C)512MBit - IS25WP512M-RHLE (not supported)#29423
7TE0812: 256MByte
Industrial1Gbit - MT25QL01GBBB8E12-0SIT#29992
eMMC (for TE0820/0821/0823)
-Not present (for TE0803/07/08/13/17/18)---
0Not populated (for TE0820/0821/0823)---
FTE00820/0821/0823: 8 GByte Industrial8GByte - IS21ES08G-JCLI#29169 (EOL)
GTE00820/0821/0823: 8 GByteCommercial8GByte - KLM8G1GETF-B041#28669 (NRND)
HTE00820/0821/0823/0812: 32 GByte
32GByte - ????
KTE00820/0821/0823: 64 GByteIndustrial64GByte - IS21ES64G-JCLI#29799
MTE00820/0821/0823/0865: 8 GByte Industrial8GByte - SDINBDG4-8G-XI2#31133
PTE00820/0821/0823: 64 GByteIndustrial64GByte - SDINBDG4-64G-XI2#31140
Other options (Connectors, custom options)
ModuleVariationDescription
AllAStandard connector height
LLow profile connector height
CStandard connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption)
DLow profile connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption)
...Custom assembly variant, look additional table below
Additional options
BlankNo extra options
SStarter Kit
KWith heat spreader
PPrototype
...Custom assembly variant, look additional table below 


Other assembly variations (position 17)

ModuleVariationDescription
TE0803AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220

L

Low profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
RCustom: standard hight connectors, R14 - 487k (PS_1V8 = 3.3V), U6 - SIT8008BI-71-33E-25.000000E, U32 - SiT8008BI-71-33E-33.333333E, U28 DNP, C81 DNP
CB2B connectors: standard profile , FPGA: XCZUxxx-xxxxxxxxx4524 modification
X
DB2B connectors:
standard profile, U??
low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XCustom: standard hight connectors, U41 → SBAS70-04LT1G
TE0807AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220
LLow profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XB2B connectors: standard profile, U41 → SBAS70-04LT1G
TE0808AStandard profile B2B connectors ST5-80-1.50-L-D-P-TR #27220
LLow profile B2B connectors ST5-80-1.00-L-D-P-TR #27017
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
XB2B connectors: standard profile, U41 → SBAS70-04LT1G
TE0812

A

Space grade model
BTest model
TE0820


AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
CB2B connectors: standard profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification
IB2B connectors: standard profile, Ethernet PHY  U8 - 88E1512-A0-NNP2I000 DNP, no screws/spacers
TE0821AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903
CStandard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
TE0823AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903, HyperFlash/HyperRAM DNP
CStandard profile B2B connectors, FPGA: XCZUxxx-xxxxxxxxx4524 modification
DB2B connectors: low profile, FPGA: XCZUxxx-xxxxxxxxx4524 modification

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
TE0830AStandard assembly option PICMG ASP connectors
TE0850AStandard assembly option
BWithout FAN
CLanes SATA_R_SL, SATA_R_SCL disconnected from J1. Clock CK (U14/U73) connected to J1 
TEB0911AStandard assembly option


Other assembly variations (position 18)

ModuleVariationDescription
TE0803IFPGA supplied by customer
TE0820TFPGA supplied by customer
JWithout screws, spacers