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Excerpt

Scroll Table Layout

								TE	0841	-	02	-	x	x	x	x	x	x	-	x
								1 2	3456	7	8 9	10	11	12	13	14	15	16	17	18
Module type																				Additional options
TE	BB Mezzanine Module																				no extra options
Module name																				S	Starter Kit
	0841																			K	With Heat spreader
Module Revision																			Other options (Connectors, custom options)
01	Revision 1 (initial)																		A	Standard height
Device name																			L	Low profile
1	2	3	4	5	6	7	8	9	US										...	Custom assembly variant, look additional table below
115	25	35	40	-	60	-	85	95	US										...	Custom assembly variant, look additional table below
A	B	D	F	G	H	K	L	M	N	P	R	S	US+					eMMC
3P	5P	7P	9P	11P	13P	15P	27P	29P	31P	33P	35P	37P	US+					-	Not present at all (TE0841)
Speed grade																		0	Not populated
1	2	3	4	5														F
1	2	3	1L	2L														G
Temp range																		H
C			E			I			Q									K
Commercial			Extended			Industrial			Automotive								Flash memory (TE0841: 1x)
DDR memory (TE0841: 2x)																	0	Not populated
-	Not present at all																1	512Mbit		MT25QU512ABB8E12-0SIT		#29292
0	Not populated		-				-										2
1	4Gbit		Left for future use														3
2	8GBit		K4A8G165WB-BIRC				#28375										4
X	SODIMM		Socket														5

Other assembly variations (position 17)

Module	Variation	Description
TE0841	A	Standard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903
	L	Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
	C	B2B connectors: standard profile , FPGA: without encryption module
	D	B2B connectors: low profile, FPGA: without encryption module
	T	Standard profile B2B connectors LSHM-150-04.0-H-DV-A-S-K-TR #30488/LSHM-130-04.0-H-DV-A-S-K-TR #30489 (30µ Gold on contact)

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