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Table of Contents

Table of Contents

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The Trenz Electronic TEP0006 is a Pmod an Ultra96 LS Expansion to Pmod adapter.

Refer to http://trenz.org/tep0006-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups:

  • FPGA/Module
    • Package:
    • Speed:
    • Temperature:
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension
  • On Board:
    • 4x Voltage Level Translators
    • 2x Voltag Voltage Regulators
    • ...
  • Interface:
    • 1x Ultra96 LS Expansion Header (40 Pins)
    • .3x Pmod HeaderConnectors
    • 3x Jumpers
  • Power:
    • 5V
    • VCC_PSAUX
  • Dimension: 
    • 85 mm x 17 mm

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTEP0006 block diagram


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Main Components

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titleTEP0006 Main Components


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  1. PMod 2x6 Host Socke (PMOD 2)  ,J2
  2. PMod 2x6 Host Socke (PMOD 2) ,J1
  3. Level Translator (HP_GPIO[0..7]) ,U1
  4. Level Translator (HP_GPIO[8..15]),U3
  5. Level Translator PMOD(SPI),U6
  6. Linear Voltage Regulator,U2
  7. Jumper,J6-J7
  8. PMod 2x6 Host Socke (SPI),J4
  9. GROVE,J5
  10. Level Translator (GROVE) ,U5
  11. Jumper (Voltage select ),J10
  12. SMD Header (Ultra96 LS Expansion Header (40 Pos),J3

Initial Delivery State

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

Low Speed Expansion Connector

The SMD Header J3 has 40 pin (20x2) and it is compatible with Ultra96 LS Expansion Connector. You can find General information about the LS Expansion connector in the following table.FPGA bank number and number of I/O signals connected to the B2B connector:

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titleGeneral PL I/O to B2B connectors Ultra96 LS Expansion information

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FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

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JTAG access to the TExxxx SoM through B2B connector JMX.

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anchorTable_SIP_JTG
titleJTAG pins connection

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JTAG Signal

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B2B Connector

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MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

SchematicConnected toNotes
HD_GPIO0...7Level Translator HP_GPIO[0...7], U1GPIO0...7

HD_GPIO8...15

Level Translator HP_GPIO[8...15], U3GPIO8...15

MIO36...37

Level Translator PMOD(SPI)PS_GPIO_0...1
MIO38, MIO41...43Level Translator PMOD(SPI)SPI
VCC_PSAUX

Level Translator, U1-U3-U5-U6

Voltage Regulator, U2

1.8 V

nPOK

5V

Voltage Regulator, U2

Jumper, J10

Vin

Pull up Voltage


Pmod Connectors

The TEP0006 is equipped with three Pmod connectors. Pmod Connectors are the expanded outputs from Ultra96 Board. 

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titlePmod Connectors information

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Pin

Connected to

Notes

Pmod 1, J1Pmod 2, J2 Pmod SPI, J4
1PMOD_HD-GPIO0PMOD_HD-GPIO8SS
2PMOD_HD-GPIO1PMOD_HD-GPIO9MOSI
3PMOD_HD-GPIO2PMOD_HD-GPIO10MISO
4PMOD_HD-GPIO3PMOD_HD-GPIO11SCK
5GNDGNDGND
63.3 V3.3 V3.3 V
7PMOD_HD-GPIO4PMOD_HD-GPIO12INIT
8PMOD_HD-GPIO5PMOD_HD-GPIO13RESET
9PMOD_HD-GPIO6PMOD_HD-GPIO14Not Connected
10PMOD_HD-GPIO7PMOD_HD-GPIO15Not Connected
11GNDGNDGND
123.3 V3.3 V3.3 V


Jumpers

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titlePmod Connectors information

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SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

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anchorTable_OBP_MIOs
titleMIOs pins

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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titleOn board peripherals

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Chip/Interface

Designator
Notes

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins
FunctionalityConnection BetweenNotes

J6

HD_GPIO_15

Level Translator U3 and U5

If you install the jumper HD_GPIO_15 will be driven through Level Translator (U5) and Grove (J5) otherwise it goes to Level Translator (U3).
J7HD_GPIO_11

Level Translator U3 and U5

If you put the jumper HD_GPIO_11 will be driven through Level Translator (U5) and Grove (J5) otherwise it goes to Level Translator (U3).
J10Voltage select

5 V, 3.3 V

Pull up Voltage



On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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titleOn board peripherals

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titleI2C interface MIOs and pins

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MIO PinSchematicU? PinNotes
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titleI2C Address for RTC
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MIO PinI2C AddressDesignatorNotes

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Chip/InterfaceDesignatorNotes
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Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power is supplied by Ultra96 Board through SMD Header J3.

Power Consumption

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titleI2C EEPROM interface MIOs and pinsPower Consumption

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Notes
MIO Power Input PinTypical CurrentSchematicU?? Pin
5VTBD
VCC_PSAUXTBD


* TBD - To Be Determined

Power Distribution Dependencies

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titleI2C address for EEPROMPower Distribution


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Power-On Sequence

There is no specific power on sequence, after power on the Ultra96 Board all electrical components on TEP0006 will be enabled.

Power Rails

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titleOn-board LEDsModule power rails.

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DesignatorColorConnected toActive LevelNote

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

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anchorTable_OBP_ETH
titleEthernet PHY to Zynq SoC connections

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CAN Transceiver

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titleCAN Tranciever interface MIOs

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titleOsillators

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Power and Power-On Sequence

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hiddentrue
idComments

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

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titlePower Consumption

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* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution

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Power-On Sequence

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titlePower Sequency
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Power Rails

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anchorTable_PWR_PR
titleModule power rails.

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B2B Connector

JM1 Pin

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B2B Connector

JM2 Pin

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B2B Connector

JM3 Pin

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Bank Voltages

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anchorTable_PWR_BV
titleZynq SoC bank voltages.

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Bank          

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Voltage

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use "include page" macro and link to the general B2B connector page of the module series,

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? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)


Power Rail Name

LS Expansion Connector Pin

DirectionNotes
+5V37InputSupplied by Ultra96
VCC_PSAUX35InputSupplied by Ultra96

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Technical Specifications

Absolute Maximum Ratings

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SymbolsDescriptionMinMaxUnit
V
T_STGStorage Temperature-55150°C


Recommended Operating Conditions

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titleRecommended operating conditions.

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See Xilinx ???? datasheet.
ParameterMinMaxUnitsReference DocumentVSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.°C
T_OPT-40+85°C


Physical Dimensions

  • Module size: ?? 85 mm × ?? 17 mm.  Please download the assembly diagram for exact numbers.Mating height with standard connectors: ? mm.

PCB thickness: ?? 1.6 mm.

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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



Figure
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titlePhysical Dimension


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Currently Offered Variants 

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

    ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

    DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

For Baseboards or modules, where no overview page is available (and revision number is coded in the direct link) use shop search link, e.g. TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706TEP0006

   DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706

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titleTrenz Electronic Shop Overview

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Trenz shop TE0728 TEP0006 overview page
English pageGerman page


Revision History

Hardware Revision History

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DateRevisionChangesDocumentation LinkRevisionChangesDocumentation Link
2019-07-1901Initial ReleaseREV01


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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Board hardware revision number.


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Document Change History

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  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports

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DateRevisionContributorDescription|

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  • change listInitial release

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