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Table of Contents
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Overview
The Trenz Electronic TEB0835 is a carrier for TE0835 module which is based on Xilinx UltraScale+ RFSoC.
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The Carrier is equipped with a Micro SD card reader, Micro USB2.0, 21x UMCC connectors and 6x SMA connectors for clocks and ADC/DAC inputs/outputs , 6x Green User LEDs, Reset Push Button, DIP Switch for Mode, Battery Holder, FT2232H FTDI, programmable clock generators and a Temperature sensor IC. The carrier provides PCIe connector as well.
Refer to
http://trenz.org/teb0835-info for the current online version of this manual and other available documentation.
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Key Features
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Note: Key Features' must be split into 6 main groups for modules and mainboards:
Key Features' must be split into 6 main groups for carrier:
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Block Diagram
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Main Components
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- SMA Connectors, J1,J3,J5,J7,J9,J11
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- UMCC
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- Connectors, J2,J4,J6,J8, J10, J12...16, J20, J27, J32...J38, J42...43
- Green LEDs, D6...11
- B2B Connector, J18
- B2B Connector, J17
- Micro SD Card Connector, J28
- Reset Push Button, BTN1
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- PCIe 6 Pin Connector, J19
- Micro USB2.0 Connectors,
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- J30
- Gigabit RJ45 Connector, J31
- DIP Switch, S1
- UEC5 Connector, J22,J24
- UCC8 Connector, J23,J25
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- 1x4 Pin Header, J21
- FTDI, U12
- Green LEDs, D1...3
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- 1x6 Pin Header,
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- J40
- Micro USB2.0 Connectors (FTDI), J29
- PCIe-8x-kurz
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- Card, J26
Initial Delivery State
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- Battery Holder, B1
- DIP Switch (PLL SEL), S2
- Pin Header (PLL I2C), J41
- Jumper (PWR CFG), J39
- EEPROM, U15
- RF Transformer, T2...17, T26...32
- Programmable Clock Generator, U5
Initial Delivery State
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Configuration Signals
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Push Button BTN1 is provided to switch OFF all power supplies on RFSoC board.
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There is a DIP switch S1 provided for enabling CPLD and set the FPGA boot mode. The DIP Switch setting should be set like the following table.
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Signals, Interfaces and Pins
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Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
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Boot Mode must be set using DIP Switch S1 on CPLD provided on the module TE0835. Please note that the DIP Switch is active low.
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JTAG Interface
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Signals, Interfaces and Pins
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Board to Board (B2B) I/Os
Number of I/O signals and interfaces connected to the B2B connectors:
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Micro USB2.0
The TEB0835 is equipped with two Micro USB2.0 Connectors J29, J30.
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anchor | Table_SIP_MUSB2 |
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title | Micro USB2.0 Socket connections |
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SMA Connectors
There are 6 SMA Connectors provided for Analog and Digital signals.
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anchor | Table_SIP_SMA |
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title | SMA Connectors information |
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J17-22
Gigabit Ethernet
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title | Ethernet PHY to Zynq SoC connections |
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Gigabit Ethernet
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UMCC Connectors
There are 8 UMCC Connectors provided for Analog and Digital signals input and output.
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title | UMCC Connectors |
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Micro USB for JTAG/UART
The TEB0835 is equipped with two Micro USB2.0 Connectors J29, J30. The Micro USB2.0 port, J29 is provided for JTAG/UART and it is connected to FTDI, U12.
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UCE5 Connectors
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Micro USB2.0
There is a Micro USB2.0 J30, provided for user.
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Micro SD Card Reader
There is a Micro SD Card socket J28 connected to B2B J17 through an I/O expander U11.
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UCC8 Connectors
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SMA Connectors
There are 6 SMA Connectors provided for Analog and Digital signals.
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PCIe Card
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UMCC Connectors
There are 21x UMCC Connectors provided for Analog /Digital signals and Clocks input and output.
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SPI_CS , SPI_DQ0... SPI_DQ3
SPI_SCK
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title | MIOs pins |
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UART_TX, UART_RX
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Test Points
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id | Comments |
you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.
Example:
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MIO Pins
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id | Comments |
you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.
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UCE5 Connectors
The TEB0835 is equipped with two UCE5 Connectors.
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UCC8 Connectors
The TEB0835 is equipped with two UCC8 Connectors.
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PCIe 8x Short
There is a PICe-8x-Short card provided on the TEB0835 board.
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PCIe 6 Pins
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On-board Peripherals
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
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Pin Header 1x4
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Pin Header 1x6
There is a 1x6 Pin Header J40, connected to JTAG signals as the following.
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FTDI
The FTDI chip U12 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip. FTDI FT2232H chip is used in MPPSE mode for JTAG, 2 I/O's of Channel B are routed to B2B J17 and must be used as UART.
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Pin Header 1x3
There is a 1x3 Pin Header J41, it provides access to I2C signals which are connected to I2C Switch, U7.
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LEDs
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title | On-board LEDs |
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B2B, J17
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Jumper
There is a Jumper J39 provided for setting the DCDC_EN between two signal level as the following.
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Clock Sources
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I2C Addresses
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Programmable Clock Generator
There is a programmable clock generator on-board (U5) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J20. The I2C Address is 0x70.
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Test Points
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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section. Example:
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Power Supply
Power supply with minimum current capability of 3 A for system startup is recommended.
Power Consumption
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title | Power Consumption |
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* TBD - To Be Determined
Power Distribution Dependencies
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title | Power Distribution |
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Power-On Sequence
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anchor | Figure_PWR_PS |
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title | Power Sequency |
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Power Rails
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Power and Power-On Sequence
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
- Power on-sequence
- Power distribution
- Voltage monitoring circuit
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On-board Peripherals
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
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EEPROM
There is an EEPROM U15 provided in order to store the FTDI configuration.
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use "include page" macro and link to the general B2B connector page of the module series,
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The TE0835 has two Samtec Razor Beam on the bottom side.
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Technical Specifications
Absolute Maximum Ratings
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B2B JM17
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B2B JM2
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Board to Board Connectors
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DIP Switch
There are two DIP Switches S1, S2 provided for boot mode and manual input select of programmable clock generator. For more information please refer to Configuration Signal Section
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Temperature Sensor
There is a temperature sensor IC U9 provided to capture the temperature and provides an alert when cooling is needed. the temperature IC is connected to I2C bus at address 0x4C.
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Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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anchor | Table_TS_ROC |
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title | Recommended operating conditions. |
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FTDI
The FTDI chip U12 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip. FTDI FT2232H chip is used in MPPSE mode for JTAG, 2 I/O's of Channel B are routed to B2B J17 and must be used as UART.
The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U15.
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Push Button
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LEDs
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Clock Sources
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Programmable Clock Generator
There is a programmable clock generator on-board (U5) provided in order to generate variable clocks for the module. The I2C Address is 0x68.
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Power and Power-On Sequence
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
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Power Supply
Power supply with minimum current capability of 3 A for system startup is recommended.
Power Consumption
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* TBD - To Be Determined
Power Distribution Dependencies
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Power-On Sequence
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Power Rails
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Board to Board Connectors
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Technical Specifications
Absolute Maximum Ratings
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Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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Physical Dimensions
Module size: 106.6 mm × 167.7 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 5 mm.
PCB thickness: 1.5 mm.
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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM. For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
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Currently Offered Variants
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Set correct link to the shop page overview table of the product on English and German. Example for TE0728: ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ For Baseboards or modules, where no overview page is available (and revision number is coded in the direct link) use shop search link, e.g. TE0706: ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706 DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706 |
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Revision History
Hardware Revision History
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Set correct links to download arrier, e.g. TE0706 REV02: TE0706-02 -> https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/ |
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Note:
- Date format: YYYY-MM-DD
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anchor | Table_RH_HRH |
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title | Hardware Revision History |
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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Document Change History
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Disclaimer
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