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Refer to http://trenz.org/te0xyz-info for the current online version of this manual and other available documentation.
Date | Quartus | Project Built | Authors | Description |
---|---|---|---|---|
2022-04-21 | 21.4 Pro | TEI0006-test_board_noprebuilt-quartus_21.4.0-20220421183824.zip TEI0006-test_board-quartus_21.4.0-20210421183915.zip | Thomas Dück |
|
Issues | Description | Workaround | To be fixed version |
---|---|---|---|
No known issues | --- | --- | --- |
Software | Version | Note |
---|---|---|
Quartus Prime Pro | 21.4 | needed |
NIOS II SBT for Eclipse | --- | optional |
Yocto | dunfell | optional (more information: Yocto KICKstart#Used source files) |
SI ClockBuilder Pro | --- | optional |
Complete List is available on <project folder>/board_files/*_board_files.csv
Design supports following modules:
Module Model | Board Part Short Name | Yocto Machine Name | PCB Revision Support | DDR | QSPI Flash | EMMC | Others | Notes |
---|---|---|---|---|---|---|---|---|
*used as reference
Design supports following carriers:
Carrier Model | Notes |
---|---|
--- |
*used as reference
Additional HW Requirements:
Additional Hardware | Notes |
---|---|
USB cable for JTAG/UART | Check Carrier Board and Programmer for correct type |
*used as reference
For general structure and usage of the reference design, see Project Delivery - Intel devices
Type | Location | Notes |
---|---|---|
Quartus | <project folder>/source_files/quartus <project folder>/source_files/<Board Part Short Name>/quartus | Quartus project will be generated by TE Scripts (Optional) Source files for specific assembly variants |
Software | <project folder>/source_files/software <project folder>/source_files/<Board Part Short Name>/software | Additional software will be generated by TE Scripts (Optional) Source files for specific assembly variants |
Yocto | <project folder>/source_files/os/yocto | Yocto BSP layer template for linux |
File | File-Extension | Description |
---|---|---|
SOPC Information File | *.sopcinfo | File with description of the .qsys file to create software for the target hardware |
SRAM Object File | *.sof | Ram configuration file |
JTAG indirect configuration file | *.jic | Flash configuration file |
Raw binary file | *.rbf | FPGA configuration file |
Diverse Reports | --- | Report files in different formats |
Software-Application-File | *.elf | Software application for NIOS II processor system |
Reference Design is only usable with the specified Quartus version. Do never use different versions of Quartus software for the same project.
Reference Design is available on:
Reference Design is available with and without prebuilt files. It's recommended to use TE prebuilt files for first launch.
Trenz Electronic provides a tcl based built environment based on Quartus Design Flow.
See also:
The Trenz Electronic FPGA Reference Designs are TCL-script based projects. To create a project, open a project or program a device execute "create_project_win.cmd" on Windows OS and "create_project_linux.sh" on Linux OS.
TE Scripts are only needed to generate the quartus project, all other additional steps are optional and can also executed by Intel Quartus/SDK GUI. For currently Scripts limitations on Win OS and Linux OS see: Project Delivery - Intel devices → Currently limitations of functionality
Add the generated bsp layer meta-<machine> to path/to/yocto/poky/build/conf/bblayers.conf with:
bitbake-layers add-layer ../meta-<module>
Note: The generated meta-<module> layer depends on the meta-altera layer (for more information see: Yocto KICKstart#Used source files), so you need to add both bsp layers to bblayers.conf
Redefine the variable MACHINE with '<module>-<Board-Part-Short-Name>' in path/to//yocto/poky/build/conf/local.conf. The correct MACHINE name can be found in the #Hardware table.
Also define the variables INITRAMFS_IMAGE_BUNDLE and INITRAMFS_IMAGE to generate a ram disk image.
sed -i '/^MACHINE/s/MACHINE/#MACHINE/g' conf/local.conf echo -e '\nMACHINE = "<module>-<Board-Part-Short-Name>"' >> conf/local.conf echo -e '\nINITRAMFS_IMAGE_BUNDLE = "1"' >> conf/local.conf echo -e 'INITRAMFS_IMAGE = "te-initramfs"' >> conf/local.conf
Build the image with following command (the image recipes are located in meta-<module>/recipes-core/images/):
bitbake te-image-minimal
Check Module and Carrier TRMs for proper HW configuration before you try any design.
Reference Design is also available with prebuilt files. It's recommended to use TE prebuilt files for first launch.
Run following command to get the device name of the SD card (e.g. /dev/sdx):
lsblk
sudo umount /dev/sdx sudo sfdisk --delete /dev/sdx
Create required partitions on the SD card (partition 1: 50MB, FAT32 / partition 2: 2MB, a2)
echo -e ',50M,c\n,2M,a2' | sudo sfdisk /dev/sdb --force sudo mkfs.vfat -F 32 -n boot /dev/sdb1
Copy the u-boot file to partition 2 of the SD card
sudo dd if=path/to/_binaries_<Article Name>/boot_linux/u-boot-with-spl.sfp of=/dev/sdb2 bs=1M seek=0 sync
Option for u-boot-with-spl.sfp on QSPI flash and zimage-initramfs-<Yocto Machine Name>.bin, <Yocto Machine Name>.dtb, soc_system.rbf and extlinux/extlinux.conf on SD card.
Use files from "<project folder>\_binaries_<Article Name>\boot_linux" from generated binary folder,see: #Get prebuilt boot binaries
Run following commands:
quartus_hps -c 1 -o pv -a 0x0 path/to/_binaries_<Article Name>/boot_linux/u-boot-with-spl.sfp
Not used on this example.
select COM Port
Win OS: see device manager
Linux OS: see dmesg | grep tty (UART is *USB1)
Login data:
Note: Wait until Linux boot finished
Username: root Password: root
You can use Linux shell now.
i2cdetect -y -r 1 (check I2C 1 Bus) dmesg | grep rtc (RTC check) udhcpc (ETH0 check) lsusb (USB check)
The block designs may differ depending on the assembly variant.
Activated interfaces:
Type | Note |
DDR | -- |
EMAC0 | -- |
EMAC1 | -- |
GPIO0 | -- |
GPIO1 | -- |
GPIO2 | -- |
I2C0 | -- |
I2C1 | -- |
QSPI | -- |
SDMMC | -- |
UART0 | -- |
UART1 | -- |
USB0 | -- |
USB1 | -- |
CAN0 | -- |
CAN1 | -- |
Used software project depends on board assembly variant. Template location: <project folder>/source_files/software/
...
For Yocto installation and project creation, follow instructions from:
Start with Create a custom BSP layer for Intel SoC or FPGA#Configure u-boot
File location: meta-<module>/recipes-bsp/u-boot/
Changes:
#u-boot device_tree.dts / { };
#device_tree-u-boot.dts / { };
#kernel device_tree.dts / { };
Start with Create a custom BSP layer for Intel SoC or FPGA#Configure linux kernel
File location: meta-<module>/recipes-kernel/linux/
Changes:
Image recipe for minimal console image
File location: meta-<module>/recipes-images/yocto/
Image recipes:
Added packages/recipes:
Used filesystem: Initial RAM Filesystem (initramfs)
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Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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